公开(公告)号：US07810232B2

公开(公告)日：2010-10-12

申请号：US11976617

申请日：2007-10-25

Applicant: Keun-Ho Kim ,  Dek-Gin Yang ,  Jong-Guk Kim ,  II-Kyoon Jeon ,  Eung-Suek Lee

Inventor： Keun-Ho Kim ,  Dek-Gin Yang ,  Jong-Guk Kim ,  II-Kyoon Jeon ,  Eung-Suek Lee

IPC: H05K3/36

CPC classification number: H05K3/4641 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/056 ,  H05K3/4069 ,  H05K3/4608 ,  H05K3/4614 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A printed circuit board and manufacturing method thereof. A printed circuit board has an insulation substrate, which includes an insulation layer, a circuit pattern formed on one side of the insulation layer, and an interlayer passage joined to the insulation layer and configured to electrically connect with the circuit pattern, and a heat-release layer, which is stacked on the other side of the insulation layer to be stacked on the insulation substrate, can provide a high heat-releasing effect and high bending strength, by means of inner layers or ground layers formed by the heat-release layers.

Abstract translation: 印刷电路板及其制造方法。 印刷电路板具有绝缘基板，该绝缘基板包括绝缘层，形成在绝缘层的一侧的电路图案，以及与该绝缘层接合并被构造为与电路图形电连接的层间通道， 层叠在绝缘层的另一方的层叠在绝缘基板上的剥离层能够通过由散热层形成的内层或接地层提供高散热效果和高弯曲强度 。

公开(公告)号：US20110100699A1

公开(公告)日：2011-05-05

申请号：US12716212

申请日：2010-03-02

Applicant: Masahi Hamazaki ,  Dek Gin Yang ,  Dong Hwan Lee ,  Bong Soo Kim ,  II Kyoon Jeon ,  Kwang Yune Kim

Inventor： Masahi Hamazaki ,  Dek Gin Yang ,  Dong Hwan Lee ,  Bong Soo Kim ,  II Kyoon Jeon ,  Kwang Yune Kim

IPC: H05K1/11 ,  H05K3/42

CPC classification number: H05K3/4069 ,  H05K1/0268 ,  H05K1/0269 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/092 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/09827 ,  H05K2203/0207 ,  Y10T29/49165

Abstract: Disclosed herein is a method of manufacturing a printed circuit board, including: forming a buildup layer on a base substrate including a circuit layer connected with a first via penetrating an insulation layer; forming a viahole penetrating the buildup layer and at least a part of the first via; and forming an interlayer connection member in the viahole. The method is advantageous in that a process of forming a multilayer connection structure can be simplified, and an error in the formation of a viahole can be minimized.

Abstract translation: 本发明公开了一种印刷电路板的制造方法，其特征在于，包括：在基板上形成积层，所述基板包括与穿过绝缘层的第一通孔连接的电路层; 形成穿过所述积聚层和所述第一通孔的至少一部分的通孔; 以及在所述通孔中形成层间连接构件。 该方法的优点在于，可以简化形成多层连接结构的过程，并且可以最小化通孔形成的误差。