Abstract:
A standoff contact array is disposed between a mounting substrate of a flip-chip package and a board. The standoff contact array is formable by mating a low-profile solder bump on the mounting substrate with a low-profile solder paste on the board. Thereafter, the standoff contact array is formed by reflowing the low-profile solder paste on the board against the low-profile solder bump on the mounting substrate.
Abstract:
A display includes pixels having a magnetically controllable reflectivity. The pixels are formed between a pair of flexible non-conductive sheets. Each of the magnetically controllable pixels includes a flexible ring located between the flexible non-conductive sheets. Each of the magnetically controllable pixels also includes magnetic particles located within the flexible ring. The location of the magnetic particles with respect to the flexible non-conductive sheets determines the reflectivity of the pixel. The display is especially suitable for use in connection with portable electronic devices.
Abstract:
Solder bumps are created on a substrate of an electronic assembly having lengths that are longer than the widths. The solder bumps are created by locating solder balls of power or ground connections close to one another so that, upon reflow, the solder balls combine. Signal solder balls however remain separated. Capacitors are created by locating power solder bumps adjacent ground solder bumps and extending parallel to one another.
Abstract:
A standoff contact array is disposed between a mounting substrate of a flip-chip package and a board. The standoff contact array is formable by mating a low-profile solder bump on the mounting substrate with a low-profile solder paste on the board. Thereafter, the standoff contact array is formed by reflowing the low-profile solder paste on the board against the low-profile solder bump on the mounting substrate.
Abstract:
A segmented mold assembly is utilized to cast a turbine engine component having an annular inner wall and an annular outer wall which are interconnected by a plurality of struts or vanes. The mold assembly includes a plurality of sections which are formed of a ceramic mold material and are interconnected at flange joints. A pair of mold sections are advantageously formed simultaneously by repetitively dipping a single pattern in a slurry of liquid ceramic mold material to form a wet coating on the pattern. This wet coating of ceramic mold material is then dried. After a covering of the desired thickness has been built up by repetitively dipping and drying the coatings on the wax pattern, the wax pattern is destroyed. To facilitate separating the mold sections after destroying the wax pattern, at least some of the wet coatings are wiped away in an area between portions of the wet coatings which will eventually form the mold sections.
Abstract:
The present invention is directed to a Banjo type axle assembly with a drop out third member carrier for the pinion shaft assembly, ring gear assembly, the rotatable differential house assembly and the differential bearing clamp assembly. Said drop out third member carrier and the rear axle housing are constructed sufficiently to house a 10.5 inch diameter ring gear. In one preferred embodiment the drive pinion assembly and the ring gear assembly exhibit a mild hypoid gear set orientation. In one preferred embodiment said drop out third member carrier has substantially uniform dimensions in thickness and has a symmetrical bolt pattern between a pinion shaft side and a non-pinion shaft side with a total of twelve bolts to affix said drop out third member to carrier to said rear axle housing. An oiling shelf has extra material to house pinion bolts as part of the pinion shaft assembly.
Abstract:
A method of fabricating a flexible display, the method comprising selecting a first flexible sheet and a second flexible sheet; and forming a number of magnetic display elements having magnetically controllable reflectivity between the first flexible sheet and the second flexible sheet. In some embodiments, a display includes pixels having a magnetically controllable reflectivity. The pixels are formed between a pair of flexible non-conductive sheets. Each of the magnetically controllable pixels includes a flexible ring located between the flexible non-conductive sheets. Each of the magnetically controllable pixels also includes magnetic particles located within the flexible ring. The location of the magnetic particles with respect to the flexible non-conductive sheets determines the reflectivity of the pixel. The display is especially suitable for use in connection with portable electronic devices.
Abstract:
A microelectronic package and a method of forming the package. The package includes a first level package mounted to a carrier. The first level package includes a package substrate having a die side and a carrier side; and a microelectronic die mounted on the package substrate at the die side thereof. The carrier has a substrate side, and the first level package is mounted on the carrier at the substrate side thereof. A rigid body is attached to the carrier side of the substrate at an attachment location of the substrate and to the substrate side of the carrier at an attachment location of the carrier, the attachment location of the carrier being electrically unconnected, the rigid body being configured and disposed to provide structural support between the substrate and the carrier.
Abstract:
Various methods and apparatuses are described in which a printed circuit board has trace lines. Input/output pads on the printed circuit board may have approximately the same width dimension as a trace line connected to those input/output pads. A first group of vias in the printed circuit board may be aligned into a planar line with a set corridor spacing between adjacent of groups of vias also aligned into a planar line with the same axis to allow a routing space for lines in multiple layers of the printed circuit board to occur in the routing space established by the set corridor spacing.
Abstract:
Solder bumps are created on a substrate of an electronic assembly having lengths that are longer than the widths. The solder bumps are created by locating solder balls of power or ground connections close to one another so that, upon reflow, the solder balls combine. Signal solder balls however remain separated. Capacitors are created by locating power solder bumps adjacent ground solder bumps and extending parallel to one another.