公开(公告)号：US06792171B2

公开(公告)日：2004-09-14

申请号：US10713377

申请日：2003-11-14

Applicant: Marian C. Hargis ,  David Peter Gaio ,  Christopher M. Gabel ,  Sundeep NandNangalia ,  James Walling ,  Philip Deane ,  William K Hogan

Inventor： Marian C. Hargis ,  David Peter Gaio ,  Christopher M. Gabel ,  Sundeep NandNangalia ,  James Walling ,  Philip Deane ,  William K Hogan

IPC: G02B612

CPC classification number: G02B6/4201 ,  G02B6/4204

Abstract: The invention relates to a receiver optical sub-assembly (ROSA) for use in a high-speed small-form factor transceiver. The ROSA, according to the present invention, includes a stacked chip design in which a semiconductor micro-bench, upon which the photodiode and trans-impedance amplifier are mounted, is disposed perpendicular to the direction that the light travels. A flexible electrical connector is attached to the semiconductor micro-bench for electrically connecting the ROSA to a host a transceiver device. The flexible electrical connector is fixed to the surface of the semiconductor micro-bench with portions cut-out to receive the amplifier and other electrical components extending therefrom. To facilitate assembly, wells are etched from the semiconductor micro-bench corresponding to bumps extending from a mounting flange for the optical coupler.

Abstract translation: 本发明涉及一种用于高速小型收发器的接收机光学子组件（ROSA）。 根据本发明的ROSA包括堆叠式芯片设计，其中安装有光电二极管和跨阻抗放大器的半导体微型工作台垂直于光行进的方向设置。 柔性电连接器连接到半导体微型工作台，用于将ROSA电连接到主机收发器装置。 柔性电连接器固定到半导体微型工作台的表面，其部分切口以接收放大器和从其延伸的其它电气部件。 为了便于组装，从半导体微型工作台蚀刻孔，对应于从用于光耦合器的安装法兰延伸的凸块。

公开(公告)号：US20110096368A1

公开(公告)日：2011-04-28

申请号：US12807907

申请日：2010-09-16

Applicant: James Maher ,  James Walling ,  Timothy Armstrong ,  Sean Maher

Inventor： James Maher ,  James Walling ,  Timothy Armstrong ,  Sean Maher

IPC: G06K15/02

CPC classification number: B42D25/333 ,  B41M3/14 ,  B42D25/29 ,  B42D2033/16 ,  B42D2033/20 ,  B42D2033/28 ,  B42D2035/20 ,  B42D2035/34

Abstract: An improved security system is disclosed for material printed on a substrate comprising a primary marking printed on the substrate for conveying information. A secondary marking provides security to the primary marking. The secondary marking may include a variation in optical properties, a variation in magnetic properties or a variation in both in optical properties and magnetic properties of the primary marking. A method is disclosed comprising printing a primary and a secondary marking on a substrate with the primary marking conveying information and with the secondary marking providing security to the primary marking.

Abstract translation: 公开了一种改进的安全系统，用于印刷在基材上的材料，包括印刷在基材上的用于传送信息的主要标记。 辅助标记为主标记提供安全性。 二次标记可以包括光学特性的变化，磁性的变化或主要标记的光学性质和磁性的变化。 公开了一种方法，其包括在基板上印刷主标记和次标记，其中主标记传送信息和次标记为主标记提供安全性。

公开(公告)号：US07160039B2

公开(公告)日：2007-01-09

申请号：US11042868

申请日：2005-01-25

Applicant: Marian C. Hargis ,  David Peter Gaio ,  Roger T. Lindquist ,  William K. Hogan ,  James Walling ,  Sundeep Nangalia ,  Philip Deane ,  Miles F. Swain ,  Christopher M. Gabel

Inventor： Marian C. Hargis ,  David Peter Gaio ,  Roger T. Lindquist ,  William K. Hogan ,  James Walling ,  Sundeep Nangalia ,  Philip Deane ,  Miles F. Swain ,  Christopher M. Gabel

IPC: G02B6/36 ,  H05K1/14 ,  H05K5/00

CPC classification number: G02B6/4206 ,  G02B6/4292 ,  H01L2224/48091 ,  H01L2924/3011 ,  H05K1/189 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to an optical sub-assembly package for use in receiver optical sub-assemblies or transmitter optical sub-assemblies in which the electrical connections between the transducer chip, e.g. photo-detector or light source, and the device printed circuit board is made by a single flexible circuit conductor extending through the wall of the package. The package is comprised of a housing and a stiffening plate, which encloses and end of the housing and forms a mechanical support for an end of the flexible circuit conductor.

Abstract translation: 本发明涉及一种用于接收机光学子组件或发射器光学子组件中的光学子组件封装，其中，传感器芯片之间的电连接，例如， 光检测器或光源，并且设备印刷电路板由延伸穿过封装壁的单个柔性电路导体制成。 该包装包括外壳和加强板，其包围壳体的端部并且形成用于柔性电路导体的端部的机械支撑。

公开(公告)号：US20050175299A1

公开(公告)日：2005-08-11

申请号：US11042868

申请日：2005-01-25

Applicant: Marian Hargis ,  David Gaio ,  Roger Lindquist ,  William Hogan ,  James Walling ,  Sundeep Nangalia ,  Philip Deane ,  Miles Swain ,  Christopher Gabel

Inventor： Marian Hargis ,  David Gaio ,  Roger Lindquist ,  William Hogan ,  James Walling ,  Sundeep Nangalia ,  Philip Deane ,  Miles Swain ,  Christopher Gabel

IPC: G02B6/42 ,  H04B10/12 ,  H05K1/00 ,  H05K1/18 ,  G02B6/36

CPC classification number: G02B6/4206 ,  G02B6/4292 ,  H01L2224/48091 ,  H01L2924/3011 ,  H05K1/189 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to an optical sub-assembly package for use in receiver optical sub-assemblies or transmitter optical sub-assemblies in which the electrical connections between the transducer chip, e.g. photo-detector or light source, and the device printed circuit board is made by a single flexible circuit conductor extending through the wall of the package. The package is comprised of a housing and a stiffening plate, which encloses and end of the housing and forms a mechanical support for an end of the flexible circuit conductor.

Abstract translation: 本发明涉及一种用于接收机光学子组件或发射器光学子组件中的光学子组件封装，其中，传感器芯片之间的电连接，例如， 光检测器或光源，并且设备印刷电路板由延伸穿过封装壁的单个柔性电路导体制成。 该包装包括外壳和加强板，其包围壳体的端部并且形成用于柔性电路导体的端部的机械支撑。

公开(公告)号：US06709765B2

公开(公告)日：2004-03-23

申请号：US10152722

申请日：2002-05-23

Applicant: James Walling

Inventor： James Walling

IPC: B44C308

CPC classification number: B44C5/00 ,  Y10T428/2414

Abstract: An aesthetic, hangable ornament is produced by cutting a blank in the shape of, e.g. a bird or a butterfly from a laminate of three layers of vinyl, the outer two layers of which are holographic, cutting a hole in the blank, cutting slits in the blank to form a body including strips extending radially from a planar annulus around the hole to the periphery of the body, crimping the strips to incline them by 20-30° from the plane of the annulus, and mounting a multifaceted, polyhedral crystal in the hole using a hook, which is also used to suspend the ornament from a clear line.

Abstract translation: 通过切割成如下的形状的坯料来产生美学，可吊挂的装饰品。 来自三层乙烯基的层压体的鸟或蝴蝶，其外两层是全息的，在坯料中切割一个孔，切割坯料中的狭缝，以形成包括从孔周围的平面环径向延伸的条带的主体 到身体的周边，将条带卷曲，使它们从环的平面倾斜20-30°，并使用钩将多面体多面体晶体安装在孔中，该钩还用于将装饰物从透明 线。

公开(公告)号：US6091318A

公开(公告)日：2000-07-18

申请号：US337960

申请日：1999-06-22

Applicant: Robert D. Lee ,  Gary V. Zanders ,  James Walling ,  Steven N. Hass

Inventor： Robert D. Lee ,  Gary V. Zanders ,  James Walling ,  Steven N. Hass

IPC: H01L21/60 ,  H01L23/522 ,  H01L23/58 ,  H01L1/012

CPC classification number: H01L24/81 ,  H01L23/522 ,  H01L23/58 ,  H01L2224/81801 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107

Abstract: A metalization layer formed as part of a bump connection/flip chip process for a semiconductor circuit is also used to form a sense resistor or other passive components. The metalization layers normal composition can also be altered so as to change or control the value of the so formed resistor or to improve the temperature stability of the resistor. Other passive components such as capacitors or inductor can also be formed in this layer.

Abstract translation: 形成为用于半导体电路的凸块连接/倒装芯片工艺的一部分的金属化层也用于形成感测电阻器或其它无源部件。 金属化层正常组成也可以改变，以便改变或控制如此形成的电阻器的值或改善电阻器的温度稳定性。 其他无源元件如电容器或电感器也可以在该层中形成。