公开(公告)号：US20070042087A1

公开(公告)日：2007-02-22

申请号：US11206456

申请日：2005-08-18

Applicant: Jason Reese

Inventor： Jason Reese

IPC: A23G1/00

CPC classification number: A47J37/0611

Abstract: An apparatus is disclosed for making selectively designed breakfast cakes. In one embodiment, the present invention includes a top and bottom cover each having a heat source and able to receive a top and bottom design plate respectively. The top and bottom design plate impose a design such as a star or tree on the breakfast cake. The top and bottom design plate may be substantially similar. In certain embodiments, the top and bottom cover each include a bracket system for receiving a design plate. In other embodiments, the present invention also includes an interface panel, a base, a mechanically retractable power cord, and a handle.

Abstract translation: 公开了一种用于制造选择性设计的早餐蛋糕的设备。 在一个实施例中，本发明包括顶盖和底盖，每个顶盖和底盖分别具有热源并且能够分别接收顶部和底部设计板。 顶部和底部设计板在早餐蛋糕上施加诸如星形或树形的设计。 顶部和底部设计板可以基本相似。 在某些实施例中，顶盖和底盖均包括用于容纳设计板的托架系统。 在其他实施例中，本发明还包括接口面板，基座，机械可伸缩电源线和手柄。

公开(公告)号：US20050112369A1

公开(公告)日：2005-05-26

申请号：US10953825

申请日：2004-09-29

Applicant: Scott Ibbitson ,  Joseph Montano ,  Jason Reese ,  Robert Sloan

Inventor： Scott Ibbitson ,  Joseph Montano ,  Jason Reese ,  Robert Sloan

IPC: B32B7/12 ,  B32B15/04 ,  C09J133/14 ,  H05K3/38 ,  H05K3/46 ,  B32B3/00

CPC classification number: B32B7/12 ,  B32B15/04 ,  B32B15/092 ,  B32B15/20 ,  B32B2307/304 ,  B32B2457/08 ,  C08L2666/02 ,  C09J133/14 ,  H05K3/386 ,  H05K3/4611 ,  H05K2201/0212 ,  H05K2201/0257 ,  H05K2201/0358 ,  H05K2203/1355 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T428/2804

Abstract: Methods of enhancing the adhesion between a metal surface and an organic polymeric material, such as a dielectric material, in the manufacture of printed circuit boards are provided. Such methods use an adhesion promoting composition including polymeric particles disposed between the metal surface and the organic polymeric material. Also provided are printed circuit boards having enhanced adhesion between a metal surface and an organic polymeric material.

Abstract translation: 提供了在印刷电路板的制造中增强金属表面和有机聚合物材料（例如电介质材料）之间的粘附性的方法。 这种方法使用包含设置在金属表面和有机聚合物材料之间的聚合物颗粒的粘附促进组合物。 还提供了在金属表面和有机聚合物材料之间具有增强的粘合力的印刷电路板。

公开(公告)号：US20060182881A1

公开(公告)日：2006-08-17

申请号：US11354527

申请日：2006-02-15

Applicant: Joseph Montano ,  Jason Reese ,  Luke Little

Inventor： Joseph Montano ,  Jason Reese ,  Luke Little

IPC: B05D5/06 ,  B05D1/36

CPC classification number: H05K3/387 ,  C23C18/1651 ,  C23C18/1865 ,  C23C18/1893 ,  C23C18/2086 ,  C25D5/54 ,  H05K2201/0116 ,  H05K2201/0212 ,  H05K2201/0236

Abstract: Methods of improving the adhesion of metal layers to a substrate, such as an optical substrate, are provided. Such methods employ a layer of an adhesion promoting composition including a plating catalyst on the substrate before metal deposition. Also provided are devices made by such processes.

Abstract translation: 提供了改善金属层与诸如光学衬底之类的衬底的粘附性的方法。 这样的方法在金属沉积之前在基板上使用包含镀催化剂的粘合促进组合物层。 还提供了通过这些过程制造的装置。