公开(公告)号：US20080202919A1

公开(公告)日：2008-08-28

申请号：US12034707

申请日：2008-02-21

Applicant: Jeon Geon Han ,  Kab Seog Kim ,  Yong Mo Kim

Inventor： Jeon Geon Han ,  Kab Seog Kim ,  Yong Mo Kim

IPC: C23C14/35

CPC classification number: C23C14/352 ,  C23C14/20 ,  C23C14/562 ,  H01J37/3277 ,  H01J37/3405 ,  H05K1/028 ,  H05K1/09 ,  H05K3/16 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2203/1476 ,  H05K2203/1545

Abstract: An apparatus and method for manufacturing a highly efficient flexible thin metal film-laminated strip by improves adhesiveness between a polyimide strip and a thin metal film, and removes stress from thin films laminated through magnetron sputtering, which is a dry deposition process. The stress-free flexible circuit board manufacturing method includes the steps of: a) depositing a seed layer on the substrate using the magnetron deposition source; b) depositing a compressive thin film using the single magnetron deposition source arranged next to the magnetron deposition source; c) depositing tensile thin film using the dual magnetron deposition source arranged next to the single magnetron deposition source; and d) repeating the steps b) and c) so as to sequentially and alternately deposit compressive thin films and tensile thin films thereby obtaining a thick film with a desired thickness.

Abstract translation: 通过改善聚酰亚胺条和薄金属膜之间的粘合性，并且通过作为干沉积工艺的磁控溅射层叠的薄膜来消除应力，从而制造高效率的柔性薄金属膜层叠带的装置和方法。 无应力柔性电路板的制造方法包括以下步骤：a）使用磁控管沉积源将种子层沉积在基板上; b）使用布置在磁控管沉积源旁边的单个磁控管沉积源沉积压缩薄膜; c）使用布置在单个磁控管沉积源旁边的双重磁控管沉积源沉积拉伸薄膜; 以及d）重复步骤b）和c），以顺序和交替地沉积压缩薄膜和拉伸薄膜，从而获得具有所需厚度的厚膜。

公开(公告)号：US08916034B2

公开(公告)日：2014-12-23

申请号：US13059318

申请日：2009-08-25

Applicant: Yuichi Setsuhara ,  Akinori Ebe ,  Jeon Geon Han

Inventor： Yuichi Setsuhara ,  Akinori Ebe ,  Jeon Geon Han

IPC: C23C14/35 ,  H01J37/34 ,  H01J37/32 ,  C23C14/34

CPC classification number: H01J37/3408 ,  C23C14/3407 ,  C23C14/358 ,  H01J37/321 ,  H01J37/3211 ,  H01J37/3411 ,  H01J37/3417

Abstract: A thin-film forming sputtering system capable of a sputtering process at a high rate. A thin-film forming sputtering system includes: a vacuum container; a target holder located inside the vacuum container; a target holder located inside the vacuum container; a substrate holder opposed to the target holder; a power source for applying a voltage between the target holder and the substrate holder; a magnetron-sputtering magnet provided behind the target holder, for generating a magnetic field having a component parallel to a target; and radio-frequency antennae for generating radio-frequency inductively-coupled plasma within a space in the vicinity of the target where the magnetic field generated by the magnetron-sputtering magnet has a strength equal to or higher than a predetermined level. The radio-frequency inductively-coupled plasma generated by the radio-frequency antennae promotes the supply of electrons into the aforementioned magnetic field, so that the sputtering process can be performed at a high rate.

Abstract translation: 能够高速溅射工艺的薄膜形成溅射系统。 薄膜形成溅射系统包括：真空容器; 位于真空容器内的目标支架; 位于真空容器内的目标支架; 与靶保持器相对的衬底保持器; 用于在所述目标保持器和所述基板保持器之间施加电压的电源; 设置在目标支架后面的磁控溅射磁体，用于产生具有平行于目标的分量的磁场; 以及用于在由磁控溅射磁体产生的磁场具有等于或高于预定水平的强度的目标附近的空间内产生射频感应耦合等离子体的射频天线。 由射频天线产生的射频感应耦合等离子体促进电子向上述磁场的供给，从而可以高速率进行溅射处理。

公开(公告)号：US08354009B2

公开(公告)日：2013-01-15

申请号：US12034707

申请日：2008-02-21

Applicant: Jeon Geon Han ,  Kab Seog Kim ,  Yong Mo Kim

Inventor： Jeon Geon Han ,  Kab Seog Kim ,  Yong Mo Kim

IPC: C23C14/00

CPC classification number: C23C14/352 ,  C23C14/20 ,  C23C14/562 ,  H01J37/3277 ,  H01J37/3405 ,  H05K1/028 ,  H05K1/09 ,  H05K3/16 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2203/1476 ,  H05K2203/1545

Abstract: An apparatus and method for manufacturing a highly efficient flexible thin metal film-laminated strip by improves adhesiveness between a polyimide strip and a thin metal film, and removes stress from thin films laminated through magnetron sputtering, which is a dry deposition process. The stress-free flexible circuit board manufacturing method includes the steps of: a) depositing a seed layer on the substrate using the magnetron deposition source; b) depositing a compressive thin film using the single magnetron deposition source arranged next to the magnetron deposition source; c) depositing tensile thin film using the dual magnetron deposition source arranged next to the single magnetron deposition source; and d) repeating the steps b) and c) so as to sequentially and alternately deposit compressive thin films and tensile thin films thereby obtaining a thick film with a desired thickness.

Abstract translation: 通过改善聚酰亚胺条和薄金属膜之间的粘合性，并且通过作为干沉积工艺的磁控溅射层叠的薄膜来消除应力，从而制造高效率的柔性薄金属膜层叠带的装置和方法。 无应力柔性电路板的制造方法包括以下步骤：a）使用磁控管沉积源将种子层沉积在基板上; b）使用布置在磁控管沉积源旁边的单个磁控管沉积源沉积压缩薄膜; c）使用布置在单个磁控管沉积源旁边的双重磁控管沉积源沉积拉伸薄膜; 以及d）重复步骤b）和c），以顺序和交替地沉积压缩薄膜和拉伸薄膜，从而获得具有所需厚度的厚膜。