公开(公告)号：US20050241950A1

公开(公告)日：2005-11-03

申请号：US10838732

申请日：2004-05-03

Applicant: Kuo-Bin Chen

Inventor： Kuo-Bin Chen

IPC: B05D1/00 ,  B05D1/12 ,  B05D1/32 ,  B05D3/12 ,  B05D5/06 ,  B05D5/12 ,  B05D7/00 ,  B05D7/14 ,  B60B7/00 ,  B60B21/00 ,  C08L33/24 ,  C09D5/08 ,  C09D133/00 ,  C09D133/04 ,  C09D133/26 ,  C25D5/02 ,  C25D5/36 ,  C25D7/00 ,  C25D13/06

CPC classification number: C25D7/00 ,  B05D1/007 ,  B05D1/32 ,  B05D3/12 ,  B05D5/06 ,  B05D7/14 ,  B05D7/52 ,  B60B1/06 ,  B60B7/004 ,  B60B7/0046 ,  C08L33/24 ,  C09D133/04 ,  C09D133/26 ,  C25D5/02 ,  C08L2666/04 ,  C08L2666/02

Abstract: A method for forming a coating on a wheel and the structure of the coating includes at least one indicating zone set on a sidewall of the wheel and at least one recess mark defined in the wheel. Ann electroplated layer is formed on the wheel except the recess mark, a color layer is formed on the recess mark and a guarding layer is formed on the color layer. A mass of powder is spread on a wheel and then a color layer with desired color is spread on the wheel body. A guarding layer is formed by spreading the enamel made of majority of Resin on the color layer. The guarding layer and the color layer in the indicating zone are removed by surface turning, and an electroplated layer is formed by electroplating the wheel after the surface turning process.

Abstract translation: 用于在车轮上形成涂层的方法和涂层的结构包括设置在车轮的侧壁上的至少一个指示区域和在车轮中限定的至少一个凹痕。 安装电镀层形成在除了凹痕之外的车轮上，在凹痕上形成着色层，在着色层上形成防护层。 一块粉末散布在轮子上，然后将具有所需颜色的彩色层分散在轮体上。 通过将大部分树脂制成的搪瓷铺展在着色层上形成防护层。 通过表面转动除去指示区域中的防护层和着色层，并且在表面转动处理之后通过电镀电镀形成电镀层。

公开(公告)号：US06475327B2

公开(公告)日：2002-11-05

申请号：US09827049

申请日：2001-04-05

Applicant: I-Chung Tung ,  Jiun-Shian Yu ,  Kuo-Bin Chen ,  Shih-Ping Hsu

Inventor： I-Chung Tung ,  Jiun-Shian Yu ,  Kuo-Bin Chen ,  Shih-Ping Hsu

IPC: H01L2332

CPC classification number: H01L24/49 ,  H01L23/10 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/3733 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A stiff heat spreader element for making a cavity down plastic chip carrier having benefits of excellent heat dissipation property, low weight, small thickness, low warpage and low twist is disclosed. The stiff heat spreader element is formed by bonding a heat spreader and a thermally conductive sheet with using a first bonding sheet. The first bonding sheet is a prepreg or prepregs made of fiber-reinforced resin. A second bonding sheet is used to bond a circuit substrate and the stiff heat spreader element. The second bonding sheet is made of a single adhesive layer or a stack of adhesive layers. The adhesive layer is made of an adhesive material, or a flake-filled adhesive material, or short fiber-filled adhesive material, or a particle-filled adhesive material. The second bonding sheet is not a prepreg or prepregs. The circuit substrate has an opening to receive an electronic chip.

Abstract translation: 公开了一种用于制造具有优异的散热性，低重量，小厚度，低翘曲和低扭曲的优点的塑料芯片载体的凹陷的散热器元件。 通过使用第一粘合片将散热器和导热片接合而形成刚性散热器元件。 第一粘合片是由纤维增强树脂制成的预浸料或预浸料。 第二接合片用于将电路基板和刚性散热器元件接合。 第二粘合片由单个粘合剂层或一叠粘合剂层制成。 粘合剂层由粘合剂材料或薄片填充的粘合剂材料或短纤维填充的粘合剂材料或填充颗粒的粘合剂材料制成。 第二粘合片不是预浸料或预浸料。 电路基板具有接收电子芯片的开口。