公开(公告)号：US5930601A

公开(公告)日：1999-07-27

申请号：US898240

申请日：1997-07-22

Applicant: Sharon M. Cannizzaro ,  Libbie R. Terwilliger ,  Timothy B. Tunnel ,  Wayne P. Vaughn ,  Steven Veneman

Inventor： Sharon M. Cannizzaro ,  Libbie R. Terwilliger ,  Timothy B. Tunnel ,  Wayne P. Vaughn ,  Steven Veneman

IPC: H01L23/367 ,  H01L23/40 ,  H05K1/02 ,  H05K3/34 ,  H05K3/42 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L23/4006 ,  H01L2924/0002 ,  H05K2201/066 ,  H05K2201/09572 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/10689 ,  H05K2201/10969 ,  H05K3/0061 ,  H05K3/341 ,  H05K3/42

Abstract: A heat sink assembly includes a printed wiring board, a metal case and a circuit package containing a gallium arsenide field effect transistor heat dissipating circuit. The circuit package includes a metal slug formed integrally with the circuit package, the heat dissipating circuit being bonded to an obverse surface of the metal slug. The printed wiring board includes first and second metal lands, the first metal land being disposed on an obverse surface of the printed wiring board, the second metal land being disposed on a reverse surface of the printed wiring board. A solder film is formed bonded to and thermally coupling a reverse surface of the metal slug to the first metal land, and a plurality of solder posts are formed, each post bonding to and thermally coupling the first metal land to the second metal land. The metal case is pressed against the second metal land with a grease film of thermally conductive grease squeezed therebetween. At least one bolt extends through a hole in the printed wiring board and into the metal case so as to squeeze together the metal case, the printed wiring board, the first and second metal lands and the grease film.

Abstract translation: 散热器组件包括印刷线路板，金属外壳和包含砷化镓场效应晶体管散热电路的电路封装。 电路封装包括与电路封装一体形成的金属块，该散热电路接合到金属块的正面上。 印刷电路板包括第一和第二金属焊盘，第一金属焊盘设置在印刷电路板的正面上，第二金属焊盘设置在印刷电路板的背面上。 形成了将金属块的反面与第一金属焊盘接合并热耦合的焊锡膜，并且形成多个焊料柱，每个焊接柱与第一金属焊盘接合并热耦合到第二金属焊盘。 金属壳体被压在第二金属焊盘上，在其间挤压有导热油脂的脂膜。 至少一个螺栓延伸穿过印刷线路板中的孔并进入金属壳体中，以将金属壳体，印刷线路板，第一和第二金属焊盘和油脂膜挤压在一起。

公开(公告)号：US5739586A

公开(公告)日：1998-04-14

申请号：US705609

申请日：1996-08-30

Applicant: Sharon M. Cannizzaro ,  Libbie R. Terwilliger ,  Timothy B. Tunnell ,  Wayne P. Vaughn ,  Steven Veneman

Inventor： Sharon M. Cannizzaro ,  Libbie R. Terwilliger ,  Timothy B. Tunnell ,  Wayne P. Vaughn ,  Steven Veneman

IPC: H01L23/367 ,  H01L23/40 ,  H05K1/02 ,  H05K3/34 ,  H05K3/42 ,  H01L23/10 ,  H01L23/28 ,  H01L23/34

CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L23/4006 ,  H01L2924/0002 ,  H05K2201/066 ,  H05K2201/09572 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/10689 ,  H05K2201/10969 ,  H05K3/0061 ,  H05K3/341 ,  H05K3/42

Abstract: A heat sink assembly includes a printed wiring board, a metal case and a circuit package containing a gallium arsenide field effect transistor heat dissipating circuit. The circuit package includes a metal slug formed integrally with the circuit package, the heat dissipating circuit being bonded to an obverse surface of the metal slug. The printed wiring board includes first and second metal lands, the first metal land being disposed on an obverse surface of the printed wiring board, the second metal land being disposed on a reverse surface of the printed wiring board. A solder film is formed bonded to and thermally coupling a reverse surface of the metal slug to the first metal land, and a plurality of solder posts are formed, each post bonding to and thermally coupling the first metal land to the second metal land. The metal case is pressed against the second metal land with a grease film of thermally conductive grease squeezed therebetween. At least one bolt extends through a hole in the printed wiring board and into the metal case so as to squeeze together the metal case, the printed wiring board, the first and second metal lands and the grease film.

Abstract translation: 散热器组件包括印刷线路板，金属外壳和包含砷化镓场效应晶体管散热电路的电路封装。 电路封装包括与电路封装一体形成的金属块，该散热电路接合到金属块的正面上。 印刷电路板包括第一和第二金属焊盘，第一金属焊盘设置在印刷电路板的正面上，第二金属焊盘设置在印刷电路板的背面上。 形成了将金属块的反面与第一金属焊盘接合并热耦合的焊锡膜，并且形成多个焊料柱，每个焊接柱与第一金属焊盘接合并热耦合到第二金属焊盘。 金属壳体被压在第二金属焊盘上，在其间挤压有导热油脂的脂膜。 至少一个螺栓延伸穿过印刷线路板中的孔并进入金属壳体中，以将金属壳体，印刷线路板，第一和第二金属焊盘和油脂膜挤压在一起。