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    INTEGRATED ILLUMINATION PART AND LEAD FRAME OF UMBRELLA
    1.
    发明申请
    INTEGRATED ILLUMINATION PART AND LEAD FRAME OF UMBRELLA 有权

    公开(公告)号：US20130128496A1

    公开(公告)日：2013-05-23

    申请号：US13682374

    申请日：2012-11-20

    Applicant: LONGWIDE TECHNOLOGY INC.

    Inventor： Huan-Jan CHIEN ,  Tsung-Hong TSAI

    IPC: A45B25/02 ,  F21V19/00

    CPC classification number: F21V23/002 ,  A45B3/04 ,  A45B23/00 ,  A45B25/00 ,  A45B25/02 ,  A45B2023/0006 ,  A45B2200/1018 ,  F21L4/02 ,  F21L2001/00 ,  F21V19/00 ,  F21V19/0025 ,  F21V23/06 ,  F21V33/0004 ,  F21Y2115/10

    Abstract: The manufacturing method of the integrated illumination part used in the present invention is to install annular lead frame with luminous LED chip on main part body of the umbrella, then package into one unity with transparent material such as plastic or silica gel, for example, slip ring, installation seat, handle and other parts can be used to produce the part. The purpose of the present aims at innovating the structure of annular lead frame made of sheet metal whereby to increase the mass production of integrated illumination part and diversity of light source, and fully to utilize high heat dissipation capacity of umbrella parts. It includes single-layer and multilayer structure according to the functional demand of LED chip; the manufacturing method of annular lead frame is first to produce LED chip and lead frame into LED lead frame, then bend it into annular with jig according to the appearance of main part body and fix power pin into annular structure with fastener.

    LED 3D curved lead frame of illumination device
    2.
    发明授权
    LED 3D curved lead frame of illumination device 有权
    LED 3D弯曲引线框架的照明装置

    公开(公告)号：US09557041B2

    公开(公告)日：2017-01-31

    申请号：US13734603

    申请日：2013-01-04

    Applicant: LongWide Technology Inc.

    Inventor： Huan-Jan Chien ,  Tsung-Hong Tsai

    IPC: F21V21/00 ,  F21V15/01 ,  H05K3/20 ,  F21V29/77 ,  F21V23/00 ,  H05K1/18 ,  F21Y101/00

    CPC classification number: F21V21/00 ,  F21K9/232 ,  F21V15/01 ,  F21V23/001 ,  F21V29/773 ,  F21Y2101/00 ,  F21Y2107/20 ,  F21Y2113/13 ,  F21Y2113/17 ,  F21Y2115/10 ,  H05K1/181 ,  H05K1/189 ,  H05K3/202 ,  H05K2201/0397 ,  H05K2201/09263 ,  H05K2201/10106

    Abstract: This invention relates to separately produce the complicated 3D curved structure and LED 3D curved lead frame to meet the demand of the complicated curved surface illumination of illumination device. First of all, draw illumination circuit with banded structure of multilayer lead frame on 3D illumination complicated curved surface, then spread these curved circuit into plane circuit, dismantle the banded structure of multilayer lead frame of circuit into circuit pattern of single layers, use process the prototype of circuit patterns of each layer with conductive metal charge tape, and produce the prototype of banded structure of multilayer conductive frame through repeated accumulation of multi-disc charge tapes, and install the LED chip on the installation seat to get LED flat lead frame, then flex the conductive metal into LED 3D curved lead frame with jig and paste on the luminous curved surface, and package them together with transparent material, for example, curved decorative lighting, spherical display advertising board, etc.; this method offers more flexibility for structure and aesthetic design, and fully utilizes the high heat dissipation capacity of main body of metal part.

    Abstract translation: 本发明涉及分别生产复杂的3D弯曲结构和LED 3D弯曲引线框架，以满足照明装置复杂曲面照明的需求。 首先，在3D照明复杂曲面上绘制具有多层引线框架带状结构的照明电路，然后将这些弯曲电路铺设成平面电路，将电路多层引线框架的带状结构拆除为单层电路图案，使用过程 通过导电金属充电胶带的每层电路图案原型，通过反复堆积多盘充电胶带生产多层导电框架带状结构的原型，并将LED芯片安装在安装座上，获得LED扁平引线框架， 然后将导电金属弯曲成3D 3D弯曲引线框架，并将其贴合在发光曲面上，并用透明材料包装，如弯曲装饰照明，球形展示广告板等; 这种方法为结构和美学设计提供了更多的灵活性，并充分利用了金属部件主体的高散热能力。

    Integrated illumination part and lead frame of umbrella
    4.
    发明授权
    Integrated illumination part and lead frame of umbrella 有权
    伞的集成照明部件和引线框架

    公开(公告)号：US09400096B2

    公开(公告)日：2016-07-26

    申请号：US14700412

    申请日：2015-04-30

    Applicant: LongWide Technology Inc.

    Inventor： Huan-Jan Chien ,  Tsung-Hong Tsai

    IPC: F21V23/00 ,  F21V33/00 ,  A45B3/04 ,  F21V23/06 ,  F21L4/02 ,  F21V19/00 ,  F21V1/00 ,  F21Y101/02

    CPC classification number: F21V23/002 ,  A45B3/04 ,  A45B23/00 ,  A45B25/00 ,  A45B25/02 ,  A45B2023/0006 ,  A45B2200/1018 ,  F21L4/02 ,  F21L2001/00 ,  F21V19/00 ,  F21V19/0025 ,  F21V23/06 ,  F21V33/0004 ,  F21Y2115/10

    Abstract: An integrated illumination part is produced by installing annular lead frame with luminous LED chip on main part body of the umbrella, then packaged into one unity with transparent material such as plastic or silica gel, slip ring, installation seat, handle and other parts can be used to produce the part. The structure of annular lead frame made of sheet metal whereby to increase the mass production of integrated illumination part and diversity of light source. It thus fully utilizes high heat dissipation capacity of umbrella parts. It includes single-layer and multilayer structure according to the functional demand of LED chip; the manufacturing method of annular lead frame firstly produces LED chip and lead frame into LED lead frame, then bend it into annular with jig according to the appearance of main part body and fix power pin into annular structure with fastener.

    Abstract translation: 通过在伞的主体上安装发光LED芯片的环形引线框架，通过塑料或硅胶等透明材料，滑环，安装座，手柄等部件组装成一体，制成集成照明部件 用来生产零件。 由金属板制成的环形引线框架的结构，从而增加了集成照明部件的大量生产和光源的多样性。 因此它完全利用伞部件的高散热能力。 根据LED芯片的功能需求，包括单层和多层结构; 环形引线框架的制造方法首先将LED芯片和引线框架制成LED引线框架，然后根据主体外观将其弯曲成夹具环形，并将电源针固定到带有紧固件的环形结构中。

    LED 3D CURVED LEAD FRAME OF ILLUMINATION DEVICE
    5.
    发明申请
    LED 3D CURVED LEAD FRAME OF ILLUMINATION DEVICE 有权
    LED 3D弯曲引线框架的照明设备

    公开(公告)号：US20130188369A1

    公开(公告)日：2013-07-25

    申请号：US13734603

    申请日：2013-01-04

    Applicant: LongWide Technology Inc.

    Inventor： Huan-Jan CHIEN ,  Tsung-Hong TSAI

    IPC: F21V21/00 ,  F21V29/00 ,  F21V15/01

    CPC classification number: F21V21/00 ,  F21K9/232 ,  F21V15/01 ,  F21V23/001 ,  F21V29/773 ,  F21Y2101/00 ,  F21Y2107/20 ,  F21Y2113/13 ,  F21Y2113/17 ,  F21Y2115/10 ,  H05K1/181 ,  H05K1/189 ,  H05K3/202 ,  H05K2201/0397 ,  H05K2201/09263 ,  H05K2201/10106

    Abstract: This invention relates to separately produce the complicated 3D curved structure and LED 3D curved lead frame to meet the demand of the complicated curved surface illumination of illumination device. First of all, draw illumination circuit with banded structure of multilayer lead frame on 3D illumination complicated curved surface, then spread these curved circuit into plane circuit, dismantle the banded structure of multilayer lead frame of circuit into circuit pattern of single layers, use process the prototype of circuit patterns of each layer with conductive metal charge tape, and produce the prototype of banded structure of multilayer conductive frame through repeated accumulation of multi-disc charge tapes, and install the LED chip on the installation seat to get LED flat lead frame, then flex the conductive metal into LED 3D curved lead frame with jig and paste on the luminous curved surface, and package them together with transparent material, for example, curved decorative lighting, spherical display advertising board, etc.; this method offers more flexibility for structure and aesthetic design, and fully utilizes the high heat dissipation capacity of main body of metal part.

    Abstract translation: 本发明涉及分别生产复杂的3D弯曲结构和LED 3D弯曲引线框架，以满足照明装置复杂曲面照明的需求。 首先，在3D照明复杂曲面上绘制具有多层引线框架带状结构的照明电路，然后将这些弯曲电路铺设成平面电路，将电路多层引线框架的带状结构拆除为单层电路图案，使用过程 通过导电金属充电胶带的每层电路图案原型，通过反复堆积多盘充电胶带生产多层导电框架带状结构的原型，并将LED芯片安装在安装座上，获得LED扁平引线框架， 然后将导电金属弯曲成3D 3D弯曲引线框架，并将其贴合在发光曲面上，并用透明材料包装，如弯曲装饰照明，球形展示广告板等; 这种方法为结构和美学设计提供了更多的灵活性，并充分利用了金属部件主体的高散热能力。

    LED 3D CURVED LEAD FRAME OF ILLUMINATION DEVICE
    8.
    发明申请
    LED 3D CURVED LEAD FRAME OF ILLUMINATION DEVICE 有权
    LED 3D弯曲引线框架的照明设备

    公开(公告)号：US20160069545A1

    公开(公告)日：2016-03-10

    申请号：US14943358

    申请日：2015-11-17

    Applicant: LongWide Technology Inc.

    Inventor： Huan-Jan CHIEN ,  Tsung-Hong TSAI

    IPC: F21V21/00 ,  F21V29/77 ,  F21V15/01 ,  F21K99/00

    CPC classification number: F21V21/00 ,  F21K9/232 ,  F21V15/01 ,  F21V23/001 ,  F21V29/773 ,  F21Y2101/00 ,  F21Y2107/20 ,  F21Y2113/13 ,  F21Y2113/17 ,  F21Y2115/10 ,  H05K1/181 ,  H05K1/189 ,  H05K3/202 ,  H05K2201/0397 ,  H05K2201/09263 ,  H05K2201/10106

    Abstract: A 3D curved structure and LED 3D curved lead frame for a curved surface illumination of an illumination device. First of all, draw illumination circuit with banded structure of multilayer lead frame on 3D illumination curved surface, then spread these curved circuit into plane circuit, dismantle the banded structure of multilayer lead frame of circuit into circuit pattern of single layers, use process the prototype of circuit patterns of each layer with conductive metal charge tape, and produce the prototype of banded structure of multilayer conductive frame through repeated accumulation of multi-disc charge tapes, and install the LED chip on the installation seat to get LED flat lead frame, then flex the conductive metal into LED 3D curved lead frame with jig and paste on the luminous curved surface, and package them with transparent material.

    Abstract translation: 3D曲线结构和用于照明装置的曲面照明的LED 3D弯曲引线框架。 首先，在三维照明曲面上绘制多层引线框架带状结构的照明电路，然后将这些弯曲电路分为平面电路，将电路多层引线框架的带状结构拆除为单层电路图案，使用原型 每层导电金属充电胶带的电路图案，并通过反复堆积多盘充电磁带产生多层导电框架带状结构的原型，并将LED芯片安装在安装座上，以获得LED平面引线框架 将导电金属弯曲成LED 3D弯曲引线框架，夹具和糊状物在发光曲面上，并用透明材料包装。

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