Abstract:
A method of fabricating a recessed channel access transistor device is provided. First, a semiconductor substrate having thereon a recess etched into a major surface is provided. A gate dielectric layer is then formed on interior surface of the recess. A recessed gate electrode is then formed in and on the recess. The recessed gate electrode comprises a recessed gate portion that is inlaid into the recess and under the major surface, and an upper gate portion above the major surface. An exposed sidewall of the recessed gate electrode is isotropically etched to thereby form a trimmed neck portion having a width that is smaller than that of the recessed gate portion. An exposed sidewall of the trimmed neck portion is then oxidized.
Abstract:
A trench-type semiconductor device structure is disclosed. The structure includes a semiconductor substrate, a gate dielectric layer and a substrate channel structure. The semiconductor substrate includes a trench having an upper portion and a lower portion. The upper portion includes a conductive layer formed therein. The lower portion includes a trench capacitor formed therein. The gate dielectric layer is located between the semiconductor substrate and the conductive layer. The substrate channel structure with openings, adjacent to the trench, is electrically connected to the semiconductor substrate via the openings.
Abstract:
Provided is a bridge coupled between an external host and an external storage device. The bridge includes a first interface, an encoder, a memory device, a decoder and a second interface. The first interface is coupled to the external host and receives a first data from an external host. The encoder is coupled to the first interface and compresses the first data by undistorted compression for producing a second data. The memory device is coupled to the encoder and temporally stores the second data produced by the encoder. The decoder is coupled to the memory device and decompresses the second data stored in the memory device for producing a third data. The third data and the first data are substantially the same. The second interface is coupled between the decoder and the external storage device and outputs the third data transmitted from the decoder to the external storage device.
Abstract:
A trench-type semiconductor device structure is disclosed. The structure includes a semiconductor substrate, a gate dielectric layer and a substrate channel structure. The semiconductor substrate includes a trench having an upper portion and a lower portion. The upper portion includes a conductive layer formed therein. The lower portion includes a trench capacitor formed therein. The gate dielectric layer is located between the semiconductor substrate and the conductive layer. The substrate channel structure with openings, adjacent to the trench, is electrically connected to the semiconductor substrate via the openings.
Abstract:
A flash memory includes a substrate with a protrusion, a control gate, two floating gates, and a dielectric layer. The protrusion extends from a top face of the substrate. The control gate is formed on the protrusion of the substrate and extendedly covers opposite sidewalls of the protrusion. The floating gates are respectively formed on top of the protrusion and being on two opposite sides of the control gate. The dielectric layer is sandwiched the control gate and each of the two floating gates. Because of the arcuate control gate used in the flash memory, the controllability of the control gate is increased and the memory cell window is enhanced.
Abstract:
A non-volatile memory having a gate structure and a source/drain region is provided. The gate structure is disposed on a substrate. The gate structure includes a pair of floating gates, tunneling dielectric layers, a control gate and an inter-gate dielectric layer. The floating gates are disposed on the substrate. Each tunneling dielectric layer is disposed between each floating gate and the substrate. The control gate is disposed on the substrate between the pair of the floating gates and covers a top surface and sidewalls of each floating gate. The inter-gate dielectric layer is disposed between the control gate and each of the floating gates, disposed between the control gate and each of the tunneling dielectric layers, and disposed between the control gate and the substrate. The source/drain region is disposed in the substrate at respective sides of the gate structure.
Abstract:
Disclosed is a method for making artificial leather with superficial texture. In the method, a substrate is coated, in a non-overall manner, with a wet polyurethane resin. After curing, there is provided a polyurethane resin coated on releasing paper. Thus, a semi-product is made. Texture of the releasing paper is transferred to a surface of the semi-product. Then, the semi-product with the texture on the surface is coated with a layer of a chemical. A machine is used to heat and flatten the surface of the semi-product. Finally, the semi-product is physically finished by forces so that the surface of the final product is formed with texture like that of real leather.
Abstract:
A deep trench self-alignment process for an active area of a partial vertical cell. A semiconductor substrate with two deep trenches is provided. A deep trench capacitor is formed in each deep trench, and an isolating layer is formed thereon. Each trench is filled with a mask layer. A photoresist layer is formed on the semiconductor substrate between the deep trenches, and the photoresist layer partially covers the mask layer. The semiconductor substrate is etched lower than the isolating layer using the photoresist layer and the mask layer as masks. The photoresist layer and the mask layer are removed, such that the pillar semiconductor substrate between the deep trenches functions as an active area.
Abstract:
A reflective mechanism includes a base fixed on a support member of a stage lamp, a bracket fixed on the base, a mirror frame, and a reflective mirror mounted on the mirror frame. A hollow shaft rotatably extends through an axial hole of the base and includes a fork on an end thereof. The hollow shaft is driven by a first motor mounted on the base to turn about a longitudinal axis of the hollow shaft. The mirror frame includes a pivotal portion pivotally mounted to the fork of the hollow shaft. The pivotal portion of the mirror frame is driven by a second motor to pivot through transmission by an endless cord that extends through the hollow shaft without interfering with rotation of the hollow shaft.
Abstract:
A dynamic random access memory (DRAM) cell layout for arranging deep trenches and active areas and a fabrication method thereof. An active area comprises two vertical transistors, a common bitline contact and two deep trenches. The first vertical transistor is formed on a region where the first deep trench is partially overlapped with the first gate conductive line. The second vertical transistor is formed on a region where the second deep trench is partially overlapped with the second gate conductive line.