公开(公告)号：US09698563B2

公开(公告)日：2017-07-04

申请号：US13883354

申请日：2011-10-27

Applicant: Ravi Palaniswamy ,  Arokiaraj Jesudoss ,  Alejandro Aldrin Il Agcaoili Narag ,  James R. White ,  Fong Liang Tan ,  Andrew J. Ouderkirk ,  Justine A. Mooney ,  Nathan P. Kreutter ,  Qihong Nie ,  Jian Xia Gao

Inventor： Ravi Palaniswamy ,  Arokiaraj Jesudoss ,  Alejandro Aldrin Il Agcaoili Narag ,  James R. White ,  Fong Liang Tan ,  Andrew J. Ouderkirk ,  Justine A. Mooney ,  Nathan P. Kreutter ,  Qihong Nie ,  Jian Xia Gao

IPC: H01L29/22 ,  H01S5/024 ,  H01L33/64 ,  H01L33/48 ,  H05K1/18 ,  H01L23/00

CPC classification number: H01S5/024 ,  H01L24/32 ,  H01L33/486 ,  H01L33/64 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/183 ,  H05K1/189 ,  H05K2201/10106 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Provided is a flexible light emitting semiconductor device, such as an LED device, that includes a flexible dielectric layer having first and second major surfaces with a conductive layer on the first major surface and at least one cavity in the first major surface with a conductive layer in the cavity that supports a light emitting semiconductor device. The conductive layer in the cavity is electrically isolated from the second major surface of the dielectric layer.

公开(公告)号：US07012017B2

公开(公告)日：2006-03-14

申请号：US10791966

申请日：2004-03-03

Applicant: Dennis M. Brunner ,  David L. Buster ,  Michael S. Graff ,  Daniel K. Luebbert ,  Nathan P. Kreutter ,  Rui Yang ,  Guoping Mao

Inventor： Dennis M. Brunner ,  David L. Buster ,  Michael S. Graff ,  Daniel K. Luebbert ,  Nathan P. Kreutter ,  Rui Yang ,  Guoping Mao

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/302

CPC classification number: H01L24/10 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01093 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/002 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2203/0369 ,  H01L2924/00

Abstract: Provided are partially etched dielectric films with raised conductive features. Also provided are methods for forming the raised conductive features in the dielectric films, which methods include partially etching the dielectric films.

Abstract translation: 提供了具有凸起导电特征的部分蚀刻的电介质膜。 还提供了用于在介电膜中形成凸起的导电特征的方法，该方法包括部分蚀刻介电膜。

公开(公告)号：US06480359B1

公开(公告)日：2002-11-12

申请号：US09567783

申请日：2000-05-09

Applicant: Christopher G. Dunn ,  Nathan P. Kreutter

Inventor： Christopher G. Dunn ,  Nathan P. Kreutter

IPC: G11B2116

CPC classification number: H05K1/0281 ,  G11B5/4826 ,  G11B5/484 ,  H05K1/056 ,  H05K3/108 ,  H05K3/243 ,  H05K2201/0338 ,  H05K2201/0352 ,  H05K2201/09736 ,  H05K2201/2009

Abstract: A disk drive suspension assembly including an elongated polymeric base member having a plurality of traces formed directly on a first surface thereof and a reference voltage layer formed on a second surface thereof. A support member is formed directly on at least a portion of the reference voltage layer. The plurality of traces overlay at least a portion of the reference voltage layer. The reference voltage layer is formed from a first electrically conductive material and the support member is formed from a second electrically conductive material. The first electrically conductive material providing substantially greater electrical conductivity and substantially less tensile strength than the second electrically conductive material. The support member includes a head gimbal portion having a first thickness and a load beam portion having a second thickness. The second thickness is substantially greater than the first thickness.

Abstract translation: 一种磁盘驱动器悬架组件，其包括细长的聚合物基底构件，其具有直接形成在其第一表面上的多个迹线和在其第二表面上形成的参考电压层。 支撑构件直接形成在参考电压层的至少一部分上。 多个迹线覆盖参考电压层的至少一部分。 参考电压层由第一导电材料形成，并且支撑构件由第二导电材料形成。 第一导电材料提供比第二导电材料显着更大的导电性和显着更小的拉伸强度。 支撑构件包括具有第一厚度的头部万向节部分和具有第二厚度的负载梁部分。 第二厚度基本上大于第一厚度。

公开(公告)号：US20140036461A1

公开(公告)日：2014-02-06

申请号：US13883386

申请日：2011-10-27

Applicant: Ravi Palaniswamy ,  Arokiaraj Jesudoss ,  Alejandro Aldrin II Agcaoili Narag ,  James R White ,  Fong Liang Tan ,  Andrew J Ouderkirk ,  Justine A Mooney ,  Nathan P Kreutter ,  Qihong Nie ,  Jian Xia Gao

Inventor： Ravi Palaniswamy ,  Arokiaraj Jesudoss ,  Alejandro Aldrin II Agcaoili Narag ,  James R White ,  Fong Liang Tan ,  Andrew J Ouderkirk ,  Justine A Mooney ,  Nathan P Kreutter ,  Qihong Nie ,  Jian Xia Gao

IPC: H05K1/02

CPC classification number: H05K1/0206 ,  H01L24/32 ,  H01L33/486 ,  H01L33/64 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/021 ,  H05K1/189 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/10106 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Provided is a flexible light emitting semiconductor device (26), such as an LED device, that includes a flexible dielectric layer (12) having first and second major surfaces and at least one via (10) extending through the dielectric layer from the first to the second major surface, with a conductive layer (19, 20, 18) on each of the first and second major surfaces and in the via. The conductive layer (18) in the via supports a light emitting semiconductor device (26) and is electrically isolated from the conductive layer (19) on the first major surface of the dielectric layer.

Abstract translation: 提供了一种诸如LED器件的柔性发光半导体器件（26），其包括具有第一和第二主表面的柔性介电层（12）和至少一个通孔（10），该通孔（10）从第一至第 所述第二主表面在所述第一和第二主表面中的每个表面上以及所述通孔中具有导电层（19,20,18）。 通孔中的导电层（18）支撑发光半导体器件（26），并且与电介质层的第一主表面上的导电层（19）电隔离。

公开(公告)号：US20130294471A1

公开(公告)日：2013-11-07

申请号：US13883354

申请日：2011-10-27

Applicant: Ravi Palaniswamy ,  Arokiaraj Jesudoss ,  Alejandro Aldrin II Agcaoili Narag ,  James R. White ,  Fong Liang Tan ,  Andrew J. Ouderkirk ,  Justine A. Mooney ,  Nathan P. Kreutter ,  Qihong Nie ,  Jian Xia Gao

Inventor： Ravi Palaniswamy ,  Arokiaraj Jesudoss ,  Alejandro Aldrin II Agcaoili Narag ,  James R. White ,  Fong Liang Tan ,  Andrew J. Ouderkirk ,  Justine A. Mooney ,  Nathan P. Kreutter ,  Qihong Nie ,  Jian Xia Gao

IPC: H01S5/024 ,  H01L33/64

CPC classification number: H01S5/024 ,  H01L24/32 ,  H01L33/486 ,  H01L33/64 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/183 ,  H05K1/189 ,  H05K2201/10106 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Provided is a flexible light emitting semiconductor device, such as an LED device, that includes a flexible dielectric layer having first and second major surfaces with a conductive layer on the first major surface and at least one cavity in the first major surface with a conductive layer in the cavity that supports a light emitting semiconductor device. The conductive layer in the cavity is electrically isolated from the second major surface of the dielectric layer.

Abstract translation: 提供了一种诸如LED器件的柔性发光半导体器件，其包括具有在第一主表面上具有导电层的第一和第二主表面的柔性介电层以及具有导电层的第一主表面中的至少一个空腔 在支撑发光半导体器件的腔中。 空腔中的导电层与电介质层的第二主表面电隔离。

公开(公告)号：US07348045B2

公开(公告)日：2008-03-25

申请号：US10235465

申请日：2002-09-05

Applicant: Rui Yang ,  Christopher G. Dunn ,  Nathan P. Kreutter

Inventor： Rui Yang ,  Christopher G. Dunn ,  Nathan P. Kreutter

IPC: C09K19/00 ,  H05K1/00

CPC classification number: H05K1/028 ,  H05K3/002 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/09036 ,  Y10T428/1023 ,  Y10T428/24479

Abstract: A dielectric film for use as a substrate for a flexible circuit comprises a polymer selected from the group consisting of liquid crystal polymers and polyimide copolymers including carboxylic ester structural units in the polymeric backbone. The dielectric film has a thickness from about 25 μm to about 60 μm including at least one thinned, recessed region wherein the thickness is reduced to less than 15 μm, as required for use of the dielectric film in e.g. ink jet print head, hard disk drive head gimbal assembly and touch sensor applications.

Abstract translation: 用作柔性电路基板的电介质膜包括选自由聚合物主链中的含有羧酸酯结构单元的液晶聚合物和聚酰亚胺共聚物组成的组的聚合物。 电介质膜具有约25μm至约60μm的厚度，包括至少一个变薄的凹陷区域，其中根据使用例如电介质膜所需的厚度减小到小于15μm。 喷墨打印头，硬盘驱动器头万向架组件和触摸传感器应用。

公开(公告)号：US09674938B2

公开(公告)日：2017-06-06

申请号：US13883386

申请日：2011-10-27

Applicant: Ravi Palaniswamy ,  Arokiaraj Jesudoss ,  Alejandro Aldrin Il Agcaoili Narag ,  James R. White ,  Fong Liang Tan ,  Andrew J. Ouderkirk ,  Justine A. Mooney ,  Nathan P. Kreutter ,  Qihong Nie ,  Jian Xia Gao

Inventor： Ravi Palaniswamy ,  Arokiaraj Jesudoss ,  Alejandro Aldrin Il Agcaoili Narag ,  James R. White ,  Fong Liang Tan ,  Andrew J. Ouderkirk ,  Justine A. Mooney ,  Nathan P. Kreutter ,  Qihong Nie ,  Jian Xia Gao

IPC: H05K1/18 ,  H05K1/02 ,  H01L33/48 ,  H01L23/00 ,  H01L33/64

CPC classification number: H05K1/0206 ,  H01L24/32 ,  H01L33/486 ,  H01L33/64 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/021 ,  H05K1/189 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/10106 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Provided is a flexible light emitting semiconductor device (26), such as an LED device, that includes a flexible dielectric layer (12) having first and second major surfaces and at least one via (10) extending through the dielectric layer from the first to the second major surface, with a conductive layer (19, 20, 18) on each of the first and second major surfaces and in the via. The conductive layer (18) in the via supports a light emitting semiconductor device (26) and is electrically isolated from the conductive layer (19) on the first major surface of the dielectric layer.

公开(公告)号：US07829794B2

公开(公告)日：2010-11-09

申请号：US11855038

申请日：2007-09-13

Applicant: Rui Yang ,  Nathan P. Kreutter ,  James S. McHattie

Inventor： Rui Yang ,  Nathan P. Kreutter ,  James S. McHattie

IPC: H05K1/00

CPC classification number: H05K3/4691 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/365 ,  B32B2457/00 ,  C08G73/14 ,  C09J179/08 ,  H05K3/002 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2203/0793 ,  Y10T29/49124 ,  Y10T428/24917 ,  Y10T428/31681

Abstract: The present invention relates to partially rigid flexible circuits having both rigid portions and flexible portions and methods for making the same.

Abstract translation: 本发明涉及具有刚性部分和柔性部分的部分刚性柔性电路及其制造方法。

公开(公告)号：US20090071696A1

公开(公告)日：2009-03-19

申请号：US11855038

申请日：2007-09-13

Applicant: Rui Yang ,  Nathan P. Kreutter ,  James S. McHattie

Inventor： Rui Yang ,  Nathan P. Kreutter ,  James S. McHattie

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H05K3/4691 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/365 ,  B32B2457/00 ,  C08G73/14 ,  C09J179/08 ,  H05K3/002 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2203/0793 ,  Y10T29/49124 ,  Y10T428/24917 ,  Y10T428/31681

Abstract: The present invention relates to partially rigid flexible circuits having both rigid portions and flexible portions and methods for making the same.

Abstract translation: 本发明涉及具有刚性部分和柔性部分的部分刚性柔性电路及其制造方法。

公开(公告)号：US20080003404A1

公开(公告)日：2008-01-03

申请号：US11768074

申请日：2007-06-25

Applicant: Rui Yang ,  Nathan P. Kreutter ,  Mark M. Lettang

Inventor： Rui Yang ,  Nathan P. Kreutter ,  Mark M. Lettang

IPC: B32B3/10 ,  D01D5/24

CPC classification number: H05K3/107 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/0393 ,  H05K3/108 ,  H05K3/403 ,  H05K2201/09036 ,  H05K2201/09645 ,  H05K2201/09827 ,  H05K2201/09981 ,  H05K2203/1394 ,  Y10T428/24273 ,  Y10T428/24355

Abstract: Provided is an article comprising a first polymeric substrate having in its surface at least one open channel comprising walls and a bottom surface and at least one conductive feature on the polymeric substrate surface wherein at least a portion of at least one conductive feature is located in at least one open channel. Also provided is an article comprising a polymeric substrate having on its surface at least one sloped conductive feature.

Abstract translation: 提供了一种包括第一聚合物基材的制品，其在其表面中具有包含壁和底表面的至少一个开放通道和聚合物基材表面上的至少一个导电特征，其中至少一个导电特征的至少一部分位于 至少一个开放渠道。 还提供了一种包括聚合物基材的制品，其表面具有至少一个倾斜的导电特征。