公开(公告)号：US11527488B2

公开(公告)日：2022-12-13

申请号：US17235055

申请日：2021-04-20

Applicant: Ntrium Inc.

Inventor： Se Young Jeong ,  Kisu Joo ,  Kyu Jae Lee ,  Seungjae Lee

IPC: H01L23/00 ,  H01L23/552 ,  H01L21/48 ,  H01L21/78

Abstract: A semiconductor package includes a magnetic layer including an inner portion having a predetermined area and an outer portion disposed outward of the inner portion, a lower polymer layer disposed below the magnetic layer, and a dicing surface formed by ends of the magnetic layer and the lower polymer layer and extending along a stacked direction of the magnetic layer and the lower polymer layer. At least a part of the outer portion of the magnetic layer includes an inclined surface inclined downward in the stacked direction, and has a thickness greater than a thickness of the inner portion in the stacked direction.