公开(公告)号：US06560121B1

公开(公告)日：2003-05-06

申请号：US09554595

申请日：2000-05-26

Applicant: Jean-Yves Daden ,  Muriel Gohn-Devineau ,  Gérard Cachier ,  Pascal Etourneau ,  Vincent Jahier ,  Alain Grancher ,  Ludovic Michel

Inventor： Jean-Yves Daden ,  Muriel Gohn-Devineau ,  Gérard Cachier ,  Pascal Etourneau ,  Vincent Jahier ,  Alain Grancher ,  Ludovic Michel

IPC: H05K702

CPC classification number: H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6644 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/12041 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0243 ,  H05K3/0061 ,  H05K3/3442 ,  H05K2201/09054 ,  H05K2201/09072 ,  H05K2201/09745 ,  H05K2201/10666 ,  H05K2201/10727 ,  H05K2203/0455 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: The surface mounting of a backset microwave package on a printed circuit. After the package has been accurately positioned against the printed circuit the connections are produced by soldering the conducting elements in direct contact. A chip is enclosed in a sort of cage constituting a screen which replaces a conventional cover, the cage is formed by layouts borne respectively by the package and the printed circuit and is linked together by metal links. The surface mounting is particularly applicable to packages operating in millimetric microwaves.

Abstract translation: 背板微波封装在印刷电路上的表面安装。 在封装已经精确地定位在印刷电路上之后，通过直接接触导电元件来焊接连接。 芯片被封装在构成屏幕的笼子中，其替代传统的盖子，保持架由分别由包装和印刷电路承载的布局形成，并通过金属连接件连接在一起。 表面安装特别适用于以毫米微波工作的封装。