公开(公告)号：US20110273840A1

公开(公告)日：2011-11-10

申请号：US12773265

申请日：2010-05-04

Applicant: Po-Ching Chen

Inventor： Po-Ching Chen

IPC: G06F1/20

CPC classification number: H05K7/20727

Abstract: A server and cooler module arrangement includes a server accommodating a stack of an operating system and an electronic device in an accommodation chamber therein at one side and an access device unit in the accommodation chamber at an opposite side, and a cooler module, which comprises a rack mounted in a partition way in the accommodation chamber between the stack of operating system and electronic device and the access device unit and a plurality of fans respectively adjustably mounted in respective open frames at different elevations and adapted for drawing air or sending air toward different heat sources in the operating system, the electronic device and the access device unit for quick dissipation of waste heat.

Abstract translation: 服务器和冷却器模块装置包括一个服务器，其容纳一侧的操作系统和电子设备的堆叠在一个容纳室中，并且在相对侧的容纳室中的存取装置单元和一个冷却器模块， 机架以分隔方式安装在操作系统和电子设备的堆叠之间的容纳室中，以及分别可调节地安装在各个开放框架中的不同高度的多个风扇，并适于抽吸空气或将空气朝向不同的热量 操作系统的来源，电子设备和访问设备单元，用于快速消散废热。

公开(公告)号：US20090294953A1

公开(公告)日：2009-12-03

申请号：US12471712

申请日：2009-05-26

Applicant: Lu-Chen Hwan ,  Po Ching Chen

Inventor： Lu-Chen Hwan ,  Po Ching Chen

IPC: H01L23/522 ,  H01L21/50

CPC classification number: H01L23/49572 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/133 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/16195 ,  H05K3/321 ,  H05K2201/10666 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2924/00014

Abstract: The present invention discloses an integrated circuit module and method of manufacturing the same. The integrated circuit module includes a chip and a carrier supporting the chip. The carrier defines a front side and a back side, and the chip is disposed on the front side. The carrier includes a first insulating layer defining a first opening at the back side, a second insulating layer defining a second opening and a chip accommodation opening at the front side, and a patterned conductive layer sandwiched in between the first insulating layer and the second insulating layer. The patterned conductive layer is formed with an inner contacting portion exposed through the chip accommodation opening and an outer contacting portion exposed through the first opening and the second opening. The inner contacting portion is connected to the chip through the chip accommodation opening. The outer contacting portion is provided for electronically connecting an electronic device to the patterned conductive layer selectively at the front side through the second opening and at the back side through the first opening.

Abstract translation: 本发明公开了一种集成电路模块及其制造方法。 集成电路模块包括芯片和支持芯片的载体。 载体限定前侧和后侧，并且芯片设置在前侧。 载体包括限定在后侧的第一开口的第一绝缘层，限定第二开口的第二绝缘层和在前侧的芯片容纳开口，以及夹在第一绝缘层和第二绝缘层之间的图案化导电层 层。 图案化导电层形成有通过芯片容纳开口暴露的内部接触部分和通过第一开口和第二开口露出的外部接触部分。 内部接触部分通过芯片容纳开口连接到芯片。 外部接触部分被设置用于通过第二开口在电子设备和图案化导电层的前侧选择性地连接电子器件，并且通过第一开口在后侧。

公开(公告)号：US20080300496A1

公开(公告)日：2008-12-04

申请号：US11807800

申请日：2007-05-30

Applicant: Steven Lee ,  Po-Ching Chen ,  Cheng-Deng Kuo

Inventor： Steven Lee ,  Po-Ching Chen ,  Cheng-Deng Kuo

IPC: A61B5/0402

CPC classification number: A61B5/0452 ,  A61B5/726

Abstract: A method for delineation of characteristic points in an electrocardiogram signal includes the steps of: (a) processing the electrocardiogram signal to obtain at least one multiscale differential operator wavelet transform thereof; and (b) locating at least one characteristic point in at least one wave segment of the electrocardiogram signal based on the at least one multiscale differential operator wavelet transform.

Abstract translation: 一种用于描绘心电图信号中的特征点的方法包括以下步骤：（a）处理心电图信号以获得至少一个多尺度微分算子小波变换; 以及（b）基于所述至少一个多尺度微分算子小波变换将所述心电图信号的至少一个波段中的至少一个特征点定位。

公开(公告)号：US08344500B2

公开(公告)日：2013-01-01

申请号：US12471712

申请日：2009-05-26

Applicant: Lu-Chen Hwan ,  Po Ching Chen

Inventor： Lu-Chen Hwan ,  Po Ching Chen

IPC: H01L23/522

CPC classification number: H01L23/49572 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/133 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/16195 ,  H05K3/321 ,  H05K2201/10666 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2924/00014

Abstract: The present invention discloses an integrated circuit module and method of manufacturing the same. The integrated circuit module includes a chip and a carrier supporting the chip. The carrier defines a front side and a back side, and the chip is disposed on the front side. The carrier includes a first insulating layer defining a first opening at the back side, a second insulating layer defining a second opening and a chip accommodation opening at the front side, and a patterned conductive layer sandwiched in between the first insulating layer and the second insulating layer. The patterned conductive layer is formed with an inner contacting portion exposed through the chip accommodation opening and an outer contacting portion exposed through the first opening and the second opening. The inner contacting portion is connected to the chip through the chip accommodation opening. The outer contacting portion is provided for electronically connecting an electronic device to the patterned conductive layer selectively at the front side through the second opening and at the back side through the first opening.

Abstract translation: 本发明公开了一种集成电路模块及其制造方法。 集成电路模块包括芯片和支持芯片的载体。 载体限定前侧和后侧，并且芯片设置在前侧。 载体包括限定在后侧的第一开口的第一绝缘层，限定第二开口的第二绝缘层和在前侧的芯片容纳开口，以及夹在第一绝缘层和第二绝缘层之间的图案化导电层 层。 图案化导电层形成有通过芯片容纳开口暴露的内部接触部分和通过第一开口和第二开口露出的外部接触部分。 内部接触部分通过芯片容纳开口连接到芯片。 外部接触部分被设置用于通过第二开口在电子设备和图案化导电层的前侧选择性地连接电子器件，并且通过第一开口在后侧。

公开(公告)号：US07895386B2

公开(公告)日：2011-02-22

申请号：US11657575

申请日：2007-01-25

Applicant: Po-Ching Chen ,  Yun-Kuo Lee

Inventor： Po-Ching Chen ,  Yun-Kuo Lee

IPC: G06F13/00

CPC classification number: G06F13/4022 ,  G06F13/426

Abstract: A USB interface provided with USB host/device function and its control method is disclosed. The USB interface includes a control unit, a USB host, a USB device, a memory, a port router and a plurality of connection ports. The control unit is used to define the connection ports to be either an upstream port or downstream port. It also controls signal flows within the USB control interface. The signal flows are provided for the USB host and the USB device. The memory is used to store data during the operation of the USB control interface. The USB host is coupled to an external device via the port router, and the USB device is coupled to an external host via the port router.

Abstract translation: 公开了具有USB主机/设备功能的USB接口及其控制方法。 USB接口包括控制单元，USB主机，USB设备，存储器，端口路由器和多个连接端口。 控制单元用于将连接端口定义为上游端口或下游端口。 它还控制USB控制接口内的信号流。 为USB主机和USB设备提供信号流。 存储器用于在USB控制接口的操作期间存储数据。 USB主机通过端口路由器耦合到外部设备，USB设备通过端口路由器耦合到外部主机。

公开(公告)号：US07560993B2

公开(公告)日：2009-07-14

申请号：US11812267

申请日：2007-06-18

Applicant: Yung-Jane Hsu ,  Po-Ching Chen ,  Jing-Yuan Cheng

Inventor： Yung-Jane Hsu ,  Po-Ching Chen ,  Jing-Yuan Cheng

IPC: H03F3/04

CPC classification number: H03F1/301

Abstract: An amplifier has a self-bias circuit to generate the bias voltage for the input of the amplifying circuit in the amplifier, thereby simplifying the circuit complexity to reduce the size and cost of the amplifier.

Abstract translation: 放大器具有自偏置电路以产生用于放大器中的放大电路的输入的偏置电压，从而简化了电路复杂度以减小放大器的尺寸和成本。

公开(公告)号：US09136585B2

公开(公告)日：2015-09-15

申请号：US13401584

申请日：2012-02-21

Applicant: Lu-Chen Hwan ,  Po Ching Chen

Inventor： Lu-Chen Hwan ,  Po Ching Chen

IPC: G08B13/14 ,  G06K19/077 ,  H01Q1/22 ,  H01Q9/24 ,  H01Q9/28

CPC classification number: H01Q1/2225 ,  G06K19/07754 ,  H01Q9/24 ,  H01Q9/285

Abstract: A radio frequency identification tag includes a housing shaped as a stripe defining a longitudinal side and an inlay disposed within the housing. The inlay includes a carrier board supporting a packaged chip and a wiring antenna in connection with the packaged chip. The wiring antenna is formed with an electrical joint directly and electrically connecting the packaged chip and an extension portion directly extending out of the electrical joint. The extension direction of the extension portion is substantially perpendicular to the longitudinal side.

Abstract translation: 射频识别标签包括形成为限定纵向侧的条带的壳体和设置在壳体内的嵌体。 嵌体包括支撑封装芯片的载板和与封装芯片相连的布线天线。 布线天线形成有直接电连接电连接的电接头和直接延伸出电接头的延伸部分。 延伸部分的延伸方向基本上垂直于纵向侧。

公开(公告)号：US20130140368A1

公开(公告)日：2013-06-06

申请号：US13401584

申请日：2012-02-21

Applicant: Lu-Chen Hwan ,  Po Ching Chen

Inventor： Lu-Chen Hwan ,  Po Ching Chen

IPC: G06K19/077

CPC classification number: H01Q1/2225 ,  G06K19/07754 ,  H01Q9/24 ,  H01Q9/285

Abstract: A radio frequency identification tag includes a housing shaped as a stripe defining a longitudinal side and an inlay disposed within the housing. The inlay includes a carrier board supporting a packaged chip and a wiring antenna in connection with the packaged chip. The wiring antenna is formed with an electrical joint directly and electrically connecting the packaged chip and an extension portion directly extending out of the electrical joint. The extension direction of the extension portion is substantially perpendicular to the longitudinal side.

Abstract translation: 射频识别标签包括形成为限定纵向侧的条带的壳体和设置在壳体内的嵌体。 嵌体包括支撑封装芯片的载板和与封装芯片相连的布线天线。 布线天线形成有直接电连接电连接的电接头和直接延伸出电接头的延伸部分。 延伸部分的延伸方向基本上垂直于纵向侧。

公开(公告)号：US20080278242A1

公开(公告)日：2008-11-13

申请号：US11812267

申请日：2007-06-18

Applicant: Yung-Jane Hsu ,  Po-Ching Chen ,  Jing-Yuan Cheng

Inventor： Yung-Jane Hsu ,  Po-Ching Chen ,  Jing-Yuan Cheng

IPC: H03F3/04

CPC classification number: H03F1/301

Abstract: An amplifier has a self-bias circuit to generate the bias voltage for the input of the amplifying circuit in the amplifier, thereby simplifying the circuit complexity to reduce the size and cost of the amplifier.

Abstract translation: 放大器具有自偏置电路以产生用于放大器中的放大电路的输入的偏置电压，从而简化了电路复杂度以减小放大器的尺寸和成本。

公开(公告)号：US08045328B1

公开(公告)日：2011-10-25

申请号：US12773265

申请日：2010-05-04

Applicant: Po-Ching Chen

Inventor： Po-Ching Chen

IPC: H05K7/20

CPC classification number: H05K7/20727

Abstract: A server and cooler module arrangement includes a server accommodating a stack of an operating system and an electronic device in an accommodation chamber therein at one side and an access device unit in the accommodation chamber at an opposite side, and a cooler module, which comprises a rack mounted in a partition way in the accommodation chamber between the stack of operating system and electronic device and the access device unit and a plurality of fans respectively adjustably mounted in respective open frames at different elevations and adapted for drawing air or sending air toward different heat sources in the operating system, the electronic device and the access device unit for quick dissipation of waste heat.

Abstract translation: 服务器和冷却器模块装置包括一个服务器，其容纳一侧的操作系统和电子设备的堆叠在一个容纳室中，并且在相对侧的容纳室中的存取装置单元和一个冷却器模块， 机架以分隔方式安装在操作系统和电子设备的堆叠之间的容纳室中，以及分别可调节地安装在各个开放框架中的不同高度的多个风扇，并适于抽吸空气或将空气朝向不同的热量 操作系统的来源，电子设备和访问设备单元，用于快速消散废热。