公开(公告)号：US20060226199A1

公开(公告)日：2006-10-12

申请号：US11093449

申请日：2005-03-30

Applicant: Zhong-You Shi ,  Prathap Reddy ,  Anne Sullivan ,  William Hopfe

Inventor： Zhong-You Shi ,  Prathap Reddy ,  Anne Sullivan ,  William Hopfe

IPC: A47J36/02

CPC classification number: H05K3/363 ,  H01R12/62 ,  H01R43/0235 ,  H01R43/0249 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2201/0397 ,  H05K2201/09645

Abstract: A system and method for soldering flat flexible cable to an electronic substrate using lead-free solder is disclosed. The method comprises bending conductive end portions of the flat flexible cable and inserting the bent conductive end portions of the flat flexible cable through slots that extend through the thickness of the electronic substrate. In so doing, a segment of the conductive end portion will protrude through the thickness of the substrate. The method further comprises of heating the flat flexible cable to a temperature of approximately 100° C. and then applying the lead-free solder to the area where the end portion protrudes through the thickness of the substrate for a time period of approximately 5 to 9 seconds.

Abstract translation: 公开了一种使用无铅焊料将扁平柔性电缆焊接到电子基板的系统和方法。 该方法包括弯曲扁平柔性电缆的导电端部分，并将扁平柔性电缆的弯曲导电端部分插入穿过电子基板厚度的狭槽。 这样做时，导电端部的一部分将突出穿过基板的厚度。 该方法还包括将扁平柔性电缆加热至约100℃的温度，然后将无铅焊料施加到端部穿过衬底厚度的区域大约5至9的时间段 秒。

公开(公告)号：US20070091632A1

公开(公告)日：2007-04-26

申请号：US11257730

申请日：2005-10-25

Applicant: Andrew Glovatsky ,  Myron Lemecha ,  Prathap Reddy

Inventor： Andrew Glovatsky ,  Myron Lemecha ,  Prathap Reddy

IPC: B60Q1/00

CPC classification number: F21V29/74 ,  B60Q1/0052 ,  F21S41/143 ,  F21S41/147 ,  F21S41/17 ,  F21S45/43 ,  F21S45/47 ,  F21S45/48 ,  F21V29/673 ,  F21V29/70 ,  F21V29/763 ,  F21V29/83 ,  F21Y2115/10

Abstract: A headlamp assembly for a motor vehicle including a lens and a housing that cooperate to define an inner chamber that is generally isolated from the atmosphere. A heat sink includes a fin portion that extends from the inner chamber so as to be exposed to ambient air. A light source is located within the inner chamber and is supported on a base portion of the heat sink. The heat sink conducts heat from the light source to air located exterior of the chamber.

Abstract translation: 一种用于机动车辆的头灯组件，包括透镜和壳体，其协作以限定通常与大气隔离的内室。 散热器包括从内室延伸以暴露于环境空气的翅片部分。 光源位于内室内并且被支撑在散热器的基部上。 散热器将热量从光源传导到位于室外的空气。

公开(公告)号：US20050083655A1

公开(公告)日：2005-04-21

申请号：US10685931

申请日：2003-10-15

Applicant: Vivek Jairazbhoy ,  Prathap Reddy ,  Mohan Paruchuri ,  Jay Baker

Inventor： Vivek Jairazbhoy ,  Prathap Reddy ,  Mohan Paruchuri ,  Jay Baker

IPC: H01L23/373 ,  H01L23/427 ,  H01L23/473 ,  H05K7/20

CPC classification number: H01L23/3733 ,  H01L23/427 ,  H01L23/473 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A system for dissipating heat in an electronic power module is provided. The system includes a semiconductor die, a substrate, and a heat sink in which is contained a first fluid, and a conduit through which a second fluid is permitted to flow. The substrate is attached on one surface to the die and configured to conduct heat from the die. The heat sink is attached to another surface of the substrate and transfers heat from the die to the first fluid contained therein, which evaporates due to the heat provided by the substrate. The fluid is condensed on a condensing wall cooled by the second fluid, which flows across the outer surface of the condensing wall, to transport heat away from the heat sink.

Abstract translation: 提供了一种用于在电子电源模块中散热的系统。 该系统包括半导体管芯，衬底和散热器，其中容纳有第一流体，以及允许第二流体流过的导管。 衬底在一个表面附着到管芯上，并被配置为从管芯传导热量。 散热器附接到基板的另一表面，并将热量从模具传递到其中包含的第一流体，由于由基板提供的热量而蒸发。 流体在由第二流体冷却的冷凝壁上冷凝，第二流体流过冷凝壁的外表面，以将热量从散热器传送出去。

公开(公告)号：US20050083652A1

公开(公告)日：2005-04-21

申请号：US10685979

申请日：2003-10-15

Applicant: Vivek Jairazbhoy ,  Prathap Reddy ,  John Trublowski

Inventor： Vivek Jairazbhoy ,  Prathap Reddy ,  John Trublowski

IPC: H01L23/473 ,  H05K7/20

CPC classification number: H01L23/473 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A liquid cooled semiconductor device is provided. The device includes a semiconductor die, a heat spreader, a wetting material, a sealant, a substrate, and a base. The spreader is mounted to a substrate such that a first side of the spreader is exposed on one side of the substrate and that a second side of the spreader is exposed on an opposing side of the substrate. Attached to a first side of the spreader is the semiconductor die. The wetting material is used to provide a thermal/electrical connection between the die and heat spreader. Sealant is provided between the die and the heat spreader to encapsulate and contain the wetting material. The substrate is mounted to the base, whereby the second side of the spreader is exposed to allow fluid to flow across the second side, directed within a channel defined by the base, and transfer heat away from the spreader.

Abstract translation: 提供液冷半导体器件。 该装置包括半导体管芯，散热器，润湿材料，密封剂，基底和基底。 扩展器安装到基板上，使得扩展器的第一侧暴露在基板的一侧上，并且扩展器的第二侧暴露在基板的相对侧上。 连接到扩展器的第一侧是半导体管芯。 润湿材料用于在模具和散热器之间提供热/电连接。 在模具和散热器之间提供密封剂以包封和容纳润湿材料。 衬底被安装到基座上，从而暴露扩散器的第二侧以允许流体流过第二侧，指向由基座限定的通道内，并将热量从扩展器传送出去。

公开(公告)号：US20060061965A1

公开(公告)日：2006-03-23

申请号：US11271471

申请日：2005-11-10

Applicant: Vivek Jairazbhoy ,  Prathap Reddy ,  John Trublowski

Inventor： Vivek Jairazbhoy ,  Prathap Reddy ,  John Trublowski

IPC: H05K7/20

CPC classification number: H01L23/473 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A liquid cooled semiconductor device is provided. The device includes a semiconductor die and a heat spreader. In one aspect of the invention, the heat spreader is mounted to a substrate such that a first side of the spreader is exposed on one side of the substrate and that a second side of the heat spreader is exposed on an opposing side of the substrate. Attached to a first side of the spreader is the semiconductor die. In another aspect of the invention, a wetting material is used to provide a thermal/electrical connection between the die and heat spreader. Sealant is provided between the die and the heat spreader to encapsulate and contain the wetting material.

Abstract translation: 提供液冷半导体器件。 该装置包括半导体管芯和散热器。 在本发明的一个方面中，散热器安装到基板上，使得扩散器的第一侧暴露在基板的一侧上，并且散热器的第二面暴露在基板的相对侧上。 连接到扩展器的第一侧是半导体管芯。 在本发明的另一方面，润湿材料用于在模具和散热器之间提供热/电连接。 在模具和散热器之间提供密封剂以包封和容纳润湿材料。

公开(公告)号：US20070127257A1

公开(公告)日：2007-06-07

申请号：US11293913

申请日：2005-12-05

Applicant: Jeffrey Erion ,  Andrew Glovatsky ,  Myron Lemecha ,  Prathap Reddy

Inventor： Jeffrey Erion ,  Andrew Glovatsky ,  Myron Lemecha ,  Prathap Reddy

IPC: B60Q1/00 ,  F21S8/10

CPC classification number: F21V29/763 ,  F21S41/147 ,  F21S45/43 ,  F21S45/47 ,  F21S45/48 ,  F21V29/677 ,  F21V29/75 ,  F21V29/76 ,  F21Y2115/10

Abstract: A headlamp assembly for a motor vehicle having a light source, a chamber that receives the light source and a cooling channel for removing heat from the chamber. A conductive wall and an insulating wall cooperate to define the chamber and the channel. The conductive wall has a substantially higher thermal conductivity than the insulating wall to promote the heat exchange between the chamber and the cooling channel and to reduce heat exchange between the cooling channel and the relatively hot engine compartment.

Abstract translation: 一种用于具有光源的机动车辆的前照灯组件，容纳光源的腔室和用于从腔室去除热量的冷却通道。 导电壁和绝缘壁配合以限定室和通道。 导电壁具有比绝缘壁显着更高的热导率，以促进室与冷却通道之间的热交换并且减少冷却通道和相对热的发动机室之间的热交换。

公开(公告)号：US20060186535A1

公开(公告)日：2006-08-24

申请号：US11063916

申请日：2005-02-23

Applicant: Jay Baker ,  Lawrence Kneisel ,  Prathap Reddy

Inventor： Jay Baker ,  Lawrence Kneisel ,  Prathap Reddy

IPC: H01L23/34

CPC classification number: H01L23/49833 ,  H01L23/3677 ,  H01L33/641 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A die mount assembly including a semiconductor die and die mount is provided. The semiconductor die may be a light emitting diode die that is attached to the die mount forming an electrical and thermal connection. The die mount includes a first set of pads and a second set of pads. A first pad of the first set of pads is connected to a second pad of the second set of pads through a plurality of vias. The vias comprise an electrically and thermally conductive material that connect the first pad to the second pad through a substrate.

Abstract translation: 提供了包括半导体管芯和管芯安装件的管芯安装组件。 半导体管芯可以是发光二极管管芯，其附接到形成电和热连接的管芯安装件。 管芯安装件包括第一组焊盘和第二组焊盘。 第一组焊盘的第一焊盘通过多个通孔连接到第二组焊盘的第二焊盘。 通孔包括导电和导热材料，其通过基底将第一焊盘连接到第二焊盘。