公开(公告)号：US4717639A

公开(公告)日：1988-01-05

申请号：US805525

申请日：1985-12-06

Applicant: Alan S. Dubin ,  Robert A. McMillen ,  R. David Mitchell

Inventor： Alan S. Dubin ,  Robert A. McMillen ,  R. David Mitchell

IPC: B41N1/24 ,  G03F7/26 ,  G03G13/26 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/28 ,  G03G13/20 ,  B05D3/02 ,  B05D3/10 ,  B05D5/12

CPC classification number: G03G13/26 ,  H05K3/0079 ,  H05K2203/1105 ,  H05K2203/1355 ,  H05K3/061 ,  H05K3/108 ,  H05K3/28

Abstract: Process for formation of a hardened, insoluble or crosslinked stencil or resist image on a substrate, e.g., having a metal surface such as copper, and modifying the substrate or image surface comprising:A. forming an image on the substrate by applying a solvent-soluble thermoplastic copolymer of ethylene and .alpha.,.beta.-ethylenically unsaturated acid having an acid number of at least about 30, the copolymer reacting thermochemically with the substrate;B. fusing at a temperature and for a duration to induce the thermochemical reaction at a rate sufficient to partially insolubilize, harden or crosslink the polymeric image and adhere the polymeric image to the substrate surface to facilitate subsequent removal therefrom;C. modifying the uncovered substrate surface or the polymeric image surface, e.g., etching, plating, depositing, soldering; andD. removing the polymeric image.The image can be formed on the substrate by printing, electrostatic means, etc. The image may comprise particulate material having a plurality of fibers. The process is useful in making conductive printed circuits, chemical milling, etc.

Abstract translation: 在基材上形成硬化的，不溶的或交联的模板或抗蚀剂图像的方法，例如具有诸如铜的金属表面，以及修饰基材或图像表面，包括：A.通过涂布溶剂 - 乙烯和α，β-乙烯不饱和酸的可溶性热塑性共聚物，其酸值至少约为30，该共聚物与底物热化学反应; B.在温度和持续时间下融化以以足以部分使不透水化，硬化或交联聚合物图像并将聚合物图像粘附到基材表面以便于随后从其中除去的速率引发热化学反应; C.修改未覆盖的基底表面或聚合物图像表面，例如蚀刻，电镀，沉积，焊接; 和D.去除聚合物图像。 图像可以通过印刷，静电装置等在基板上形成。图像可以包括具有多根纤维的颗粒材料。 该工艺可用于制造导电印刷电路，化学铣削等