公开(公告)号：US3193962A

公开(公告)日：1965-07-13

申请号：US34459664

申请日：1964-02-13

Applicant: REGINALD SIMPSON

Inventor： REGINALD SIMPSON

IPC: A01K83/06

CPC classification number: A01K83/06

公开(公告)号：US20170374731A1

公开(公告)日：2017-12-28

申请号：US15526861

申请日：2016-06-16

Applicant: Reginald SIMPSON ,  Ronald NEHRING ,  Mokhtar ROUABHI

Inventor： Reginald SIMPSON ,  Ronald NEHRING ,  Mokhtar ROUABHI

IPC: H05K1/02 ,  H03F1/30 ,  H03F3/213 ,  H03F3/195

CPC classification number: H05K1/0203 ,  H01L23/66 ,  H01L2223/6644 ,  H03F1/30 ,  H03F3/195 ,  H03F3/213 ,  H03F2200/451 ,  H05K1/0243 ,  H05K3/325 ,  H05K3/3405 ,  H05K2201/10166 ,  H05K2201/1034 ,  H05K2201/10386 ,  H05K2201/10446 ,  H05K2201/10628 ,  H05K2201/10689 ,  H05K2201/10818 ,  H05K2201/10969

Abstract: Power amplifier assemblies and components are disclosed. According to some embodiments, a power amplifier assembly (10) is provided that includes a power amplifier (12) having a gate lead (14) with a gate contact surface, a drain lead (13) with a drain contact surface and a source contact surface (15) having a length and width. An extended heat slug (11) is mounted against the source contact surface to conduct heat away (18) from the surface and to extend the electrical path of the source. The extended heat slug has at least a length that is greater than the length of the source contact surface.

公开(公告)号：US10912185B2

公开(公告)日：2021-02-02

申请号：US15526861

申请日：2016-06-16

Applicant: Reginald Simpson ,  Ronald Nehring ,  Mokhtar Rouabhi

Inventor： Reginald Simpson ,  Ronald Nehring ,  Mokhtar Rouabhi

IPC: H05K1/02 ,  H03F1/30 ,  H03F3/195 ,  H03F3/213 ,  H05K3/32 ,  H01L23/66 ,  H05K3/34

Abstract: Power amplifier assemblies and components are disclosed. According to some embodiments, a power amplifier assembly (10) is provided that includes a power amplifier (12) having a gate lead (14), a drain lead (13) and a source contact surface (15). An extended heat slug (11) is mounted against the source contact surface to conduct heat away (18) from the surface and to extend the electrical path of the source. The extended heat slug has at least a length that is greater than the length of the source contact surface.

公开(公告)号：US20180310416A1

公开(公告)日：2018-10-25

申请号：US15738074

申请日：2016-06-16

Applicant: Ronald NEHRING ,  Mokhtar ROUABHI ,  Reginald SIMPSON

Inventor： Ronald NEHRING ,  Mokhtar ROUABHI ,  Reginald SIMPSON

IPC: H05K3/34 ,  H05K1/02

CPC classification number: H05K3/3405 ,  H05K1/0243 ,  H05K3/325 ,  H05K3/3421 ,  H05K2201/10166 ,  H05K2201/10386 ,  H05K2201/10446 ,  H05K2201/10628 ,  H05K2201/10818 ,  H05K2201/10969

Abstract: Methods for mounting a power amplifier (PA) assembly having an extended heat slug (11) are disclosed. According to one aspect, a method includes manufacturing a left side PCB (22a) and a right side PCB (22b). The method further includes sliding the left side PCB and the right side PCB inward (30) to encompass the PA assembly so that one of the left and right side PCB is in a position to contact a drain of the PA (13) and so that the other of the left and right side PCB is in a position to contact a gate of the PA (14).