Abstract:
Certain applicator liquids and method of making the applicator liquids are described. The applicator liquids can be used to form nanotube films or fabrics of controlled properties. An applicator liquid for preparation of a nanotube film or fabric includes a controlled concentration of nanotubes dispersed in a liquid medium containing water. The controlled concentration is sufficient to form a nanotube fabric or film of preselected density and uniformity.
Abstract:
A nanostructure sensing device includes a substrate, a nanotube disposed over the substrate, and at least two conductive elements electrically connected to the nanotube. A electric current on the order of about 10 μA, or greater, is passed through the conductive elements and the nanotube. As a result, the nanotube heats up relative to the substrate. In the alternative, some other method may be used to heat the nanotube. When operated as a sensor with a heated nanotube, the sensor's response and/or recovery time may be markedly improved.
Abstract:
A nanoelectronic device includes a nanostructure, such as a nanotube or network of nanotubes, disposed on a substrate. Nanoparticles are disposed on or adjacent to the nanostructure so as to operatively effect the electrical properties of the nanostructure. The nanoparticles may be composed of metals, metal oxides, or salts, and nanoparticles composed of different materials may be present. The amount of nanoparticles may be controlled to preserve semiconductive properties of the nanostructure, and the substrate immediately adjacent to the nanostructure may remain substantially free of nanoparticles. A method for fabricating the device includes electrodeposition of the nanoparticles using one or more solutions of dissolved ions while providing an electric current to the nanostructures but not to the surrounding substrate.
Abstract:
A nanostructure sensing device includes a substrate, a nanotube disposed over the substrate, and at least two conductive elements electrically connected to the nanotube. A electric current on the order of about 10 μA, or greater, is passed through the conductive elements and the nanotube. As a result, the nanotube heats up relative to the substrate. In the alternative, some other method may be used to heat the nanotube. When operated as a sensor with a heated nanotube, the sensor's response and/or recovery time may be markedly improved.
Abstract:
A new sensing technology for chemical/biomolecular sensors is provided. One such sensor detects molecular hydrogen (H2) using nanoelectronic components. A tiny, low-cost nanosensor chip can offer: (i) performance that matches or exceeds that of existing technology, (ii) plug-and-play simplicity with both digital and analog control systems, and (ii) the small size and low power consumption needed for wireless integration.
Abstract translation:提供了一种用于化学/生物分子传感器的新型传感技术。 一种这样的传感器使用纳米电子部件检测分子氢(H 2 N 2)。 一个小型,低成本的纳米传感器芯片可以提供:(i)匹配或超过现有技术的性能,(ii)数字和模拟控制系统的即插即用简单性,以及(ii)小尺寸和低 无线集成所需的功耗。
Abstract:
A nanoelectronic device includes a nanostructure, such as a nanotube or network of nanotubes, disposed on a substrate. Nanoparticles are disposed on or adjacent to the nanostructure so as to operatively effect the electrical properties of the nanostructure. The nanoparticles may be composed of metals, metal oxides, or salts, and nanoparticles composed of different materials may be present. The amount of nanoparticles may be controlled to preserve semiconductive properties of the nanostructure, and the substrate immediately adjacent to the nanostructure may remain substantially free of nanoparticles. A method for fabricating the device includes electrodeposition of the nanoparticles using one or more solutions of dissolved ions while providing an electric current to the nanostructures but not to the surrounding substrate.
Abstract:
Attachment structures for electrically coupling a microelectronic package to a microelectronic board/interposer including joint pads formed on the microelectronic board/interposer which provide a gap between respective openings in a solder resist layer of the microelectronic substrate and each of the joint pads. Such attachment structures may reduce or substantially eliminate contact between a solder interconnect and a solder resist layer of the microelectronic board/interposer, which may, in turn, reduce or substantially eliminate the potential of crack initiation and propagation at contact areas between the solder interconnect and a solder resist layer of the microelectronic board/interposer due to stresses induced by a mismatch of thermal expansion between the microelectronic package and the microelectronic board/interposer during thermal cycling. Further, the connection area between the pad and outside circuitry may be maximized, so that the impact to electrical performance due to the pad design may be minimized.
Abstract:
A nanoelectronic device includes a nanostructure, such as a nanotube or network of nanotube, disposed on a substrate. Nanoparticles are disposed on or adjacent to the nanostructure so as to operatively effect the electrical properties of the nanostructure. The nanoparticles may be composed of metals, metal oxides or salts and nanoparticles composed of different materials may be present. The amount of nanoparticles may be controlled to preserve semiconductive properties of the nanostructure, and the substrate immediately adjacent to the nanostructure may remain substantially free of nanoparticles. A method for fabricating the device includes electrodeposition of the nanoparticles using one of more solutions of dissolved ions while providing an electric current to the nanostructures but not to the surrounding substrate.