SENSOR DEVICE WITH HEATED NANOSTRUCTURE
    2.
    发明申请
    SENSOR DEVICE WITH HEATED NANOSTRUCTURE 审中-公开
    具有加热纳米结构的传感器装置

    公开(公告)号:US20090165533A1

    公开(公告)日:2009-07-02

    申请号:US12245638

    申请日:2008-10-03

    CPC classification number: G01N25/20

    Abstract: A nanostructure sensing device includes a substrate, a nanotube disposed over the substrate, and at least two conductive elements electrically connected to the nanotube. A electric current on the order of about 10 μA, or greater, is passed through the conductive elements and the nanotube. As a result, the nanotube heats up relative to the substrate. In the alternative, some other method may be used to heat the nanotube. When operated as a sensor with a heated nanotube, the sensor's response and/or recovery time may be markedly improved.

    Abstract translation: 纳米结构感测装置包括衬底,设置在衬底上的纳米管以及电连接到纳米管的至少两个导电元件。 大约10μA或更大的电流通过导电元件和纳米管。 结果,纳米管相对于基底加热。 在替代方案中,可以使用一些其它方法来加热纳米管。 当作为具有加热的纳米管的传感器操作时,可以显着改善传感器的响应和/或恢复时间。

    Nanostructures with electrodeposited nanoparticles
    3.
    发明授权
    Nanostructures with electrodeposited nanoparticles 有权
    具有电沉积纳米粒子的纳米结构

    公开(公告)号:US07449757B2

    公开(公告)日:2008-11-11

    申请号:US10945803

    申请日:2004-09-20

    CPC classification number: B82Y30/00 G01N27/4146 G01N33/005 Y10S977/72

    Abstract: A nanoelectronic device includes a nanostructure, such as a nanotube or network of nanotubes, disposed on a substrate. Nanoparticles are disposed on or adjacent to the nanostructure so as to operatively effect the electrical properties of the nanostructure. The nanoparticles may be composed of metals, metal oxides, or salts, and nanoparticles composed of different materials may be present. The amount of nanoparticles may be controlled to preserve semiconductive properties of the nanostructure, and the substrate immediately adjacent to the nanostructure may remain substantially free of nanoparticles. A method for fabricating the device includes electrodeposition of the nanoparticles using one or more solutions of dissolved ions while providing an electric current to the nanostructures but not to the surrounding substrate.

    Abstract translation: 纳米电子器件包括设置在衬底上的纳米结构,例如纳米管或纳米管网络。 将纳米颗粒设置在纳米结构上或与纳米结构相邻,以便有效地影响纳米结构的电性能。 纳米颗粒可以由金属,金属氧化物或盐组成,并且可以存在由不同材料组成的纳米颗粒。 可以控制纳米颗粒的量以保持纳米结构的半导体性质,并且紧邻纳米结构的衬底可以基本上不含纳米颗粒。 制造该器件的方法包括使用一种或多种溶解离子的溶液电沉积纳米颗粒,同时向纳米结构提供电流,而不向周围的衬底提供电流。

    Sensor device with heated nanostructure
    4.
    发明申请
    Sensor device with heated nanostructure 审中-公开
    具有加热纳米结构的传感器装置

    公开(公告)号:US20070114573A1

    公开(公告)日:2007-05-24

    申请号:US10655529

    申请日:2003-09-04

    CPC classification number: G01N25/20

    Abstract: A nanostructure sensing device includes a substrate, a nanotube disposed over the substrate, and at least two conductive elements electrically connected to the nanotube. A electric current on the order of about 10 μA, or greater, is passed through the conductive elements and the nanotube. As a result, the nanotube heats up relative to the substrate. In the alternative, some other method may be used to heat the nanotube. When operated as a sensor with a heated nanotube, the sensor's response and/or recovery time may be markedly improved.

    Abstract translation: 纳米结构感测装置包括衬底,设置在衬底上的纳米管以及电连接到纳米管的至少两个导电元件。 大约10μA或更大的电流通过导电元件和纳米管。 结果,纳米管相对于基底加热。 在替代方案中,可以使用一些其它方法来加热纳米管。 当作为具有加热的纳米管的传感器操作时,可以显着改善传感器的响应和/或恢复时间。

    Nanostructures with electrodeposited nanoparticles
    6.
    发明申请
    Nanostructures with electrodeposited nanoparticles 有权
    具有电沉积纳米粒子的纳米结构

    公开(公告)号:US20050157445A1

    公开(公告)日:2005-07-21

    申请号:US10945803

    申请日:2004-09-20

    CPC classification number: B82Y30/00 G01N27/4146 G01N33/005 Y10S977/72

    Abstract: A nanoelectronic device includes a nanostructure, such as a nanotube or network of nanotubes, disposed on a substrate. Nanoparticles are disposed on or adjacent to the nanostructure so as to operatively effect the electrical properties of the nanostructure. The nanoparticles may be composed of metals, metal oxides, or salts, and nanoparticles composed of different materials may be present. The amount of nanoparticles may be controlled to preserve semiconductive properties of the nanostructure, and the substrate immediately adjacent to the nanostructure may remain substantially free of nanoparticles. A method for fabricating the device includes electrodeposition of the nanoparticles using one or more solutions of dissolved ions while providing an electric current to the nanostructures but not to the surrounding substrate.

    Abstract translation: 纳米电子器件包括设置在衬底上的纳米结构,例如纳米管或纳米管网络。 将纳米颗粒设置在纳米结构上或与纳米结构相邻,以便有效地影响纳米结构的电性能。 纳米颗粒可以由金属,金属氧化物或盐组成,并且可以存在由不同材料组成的纳米颗粒。 可以控制纳米颗粒的量以保持纳米结构的半导体性质,并且紧邻纳米结构的衬底可以基本上不含纳米颗粒。 制造该器件的方法包括使用一种或多种溶解离子的溶液电沉积纳米颗粒,同时向纳米结构提供电流,而不向周围的衬底提供电流。

    GAPPED ATTACHMENT STRUCTURES
    7.
    发明申请
    GAPPED ATTACHMENT STRUCTURES 审中-公开
    接缝附件结构

    公开(公告)号:US20140168909A1

    公开(公告)日:2014-06-19

    申请号:US13719506

    申请日:2012-12-19

    Abstract: Attachment structures for electrically coupling a microelectronic package to a microelectronic board/interposer including joint pads formed on the microelectronic board/interposer which provide a gap between respective openings in a solder resist layer of the microelectronic substrate and each of the joint pads. Such attachment structures may reduce or substantially eliminate contact between a solder interconnect and a solder resist layer of the microelectronic board/interposer, which may, in turn, reduce or substantially eliminate the potential of crack initiation and propagation at contact areas between the solder interconnect and a solder resist layer of the microelectronic board/interposer due to stresses induced by a mismatch of thermal expansion between the microelectronic package and the microelectronic board/interposer during thermal cycling. Further, the connection area between the pad and outside circuitry may be maximized, so that the impact to electrical performance due to the pad design may be minimized.

    Abstract translation: 用于将微电子封装电耦合到包括形成在微电子板/插入件上的接合焊盘的微电子板/插入件的附接结构,其提供微电子衬底的阻焊层中的各个开口之间的间隙以及每个接合焊盘。 这种附接结构可以减少或基本上消除微电子板/插入件的焊料互连和阻焊层之间的接触,这又可以减少或基本消除在焊料互连和焊接互连之间的接触区域处的裂纹发生和传播的可能性 由于在热循环期间微电子封装和微电子板/插入件之间的热膨胀不匹配引起的应力,微电子板/插入件的阻焊层。 此外,焊盘和外部电路之间的连接区域可以最大化,使得由于焊盘设计而对电性能的影响可能被最小化。

    NANOSTRUCTURES WITH ELECTRODEPOSITED NANOPARTICLES
    8.
    发明申请
    NANOSTRUCTURES WITH ELECTRODEPOSITED NANOPARTICLES 审中-公开
    具有电沉积纳米颗粒的纳米结构

    公开(公告)号:US20090101996A1

    公开(公告)日:2009-04-23

    申请号:US12268327

    申请日:2008-11-10

    Abstract: A nanoelectronic device includes a nanostructure, such as a nanotube or network of nanotube, disposed on a substrate. Nanoparticles are disposed on or adjacent to the nanostructure so as to operatively effect the electrical properties of the nanostructure. The nanoparticles may be composed of metals, metal oxides or salts and nanoparticles composed of different materials may be present. The amount of nanoparticles may be controlled to preserve semiconductive properties of the nanostructure, and the substrate immediately adjacent to the nanostructure may remain substantially free of nanoparticles. A method for fabricating the device includes electrodeposition of the nanoparticles using one of more solutions of dissolved ions while providing an electric current to the nanostructures but not to the surrounding substrate.

    Abstract translation: 纳米电子器件包括纳米结构,例如纳米管或纳米管网络,其设置在衬底上。 将纳米颗粒设置在纳米结构上或与纳米结构相邻,以便有效地影响纳米结构的电性能。 纳米颗粒可以由金属,金属氧化物或盐组成,并且可以存在由不同材料组成的纳米颗粒。 可以控制纳米颗粒的量以保持纳米结构的半导体性质,并且紧邻纳米结构的衬底可以基本上不含纳米颗粒。 制造该器件的方法包括使用溶解离子的更多溶液中的一种电解沉积纳米颗粒,同时向纳米结构提供电流,但不向周围衬底提供电流。

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