公开(公告)号：US06191053B1

公开(公告)日：2001-02-20

申请号：US09094443

申请日：1998-06-10

Applicant: Jung-Hoon Chun ,  James Derksen ,  Sangjun Han

Inventor： Jung-Hoon Chun ,  James Derksen ,  Sangjun Han

IPC: H01L21312

CPC classification number: H01L21/6715 ,  B05C5/0245 ,  B05C11/08 ,  B05D1/002 ,  B05D1/005 ,  B05D1/265 ,  G03F7/16 ,  G03F7/162

Abstract: An improved method and apparatus for coating semiconductor substrates with organic photoresist polymers by extruding a ribbon of photoresist in a spiral pattern which covers the entire top surface of the wafer. The invention provides a more uniform photoresist layer and is much more efficient than are current methods in the use of expensive photoresist solutions. A wafer is mounted on a chuck, aligned horizontally and oriented upward. An extrusion head is positioned adjacent to the outer edge of the wafer and above the top surface of the wafer with an extrusion slot aligned radially with respect to the wafer. The wafer is rotated and the extrusion head moved radially toward the center of the wafer while photoresist is extruded out the extrusion slot. The rotation rate of the wafer and the radial speed of the extrusion head are controlled so that the tangential velocity of the extrusion head with respect to the rotating wafer is a constant.

Abstract translation: 一种改进的用有机光致抗蚀剂聚合物涂覆半导体衬底的方法和装置，通过以覆盖晶片的整个顶表面的螺旋图案挤出光致抗蚀剂带。 本发明提供了更均匀的光致抗蚀剂层，并且比使用昂贵的光致抗蚀剂溶液中的现有方法更有效。 将晶片安装在卡盘上，水平排列并向上取向。 挤出头定位成与晶片的外边缘相邻并且在晶片的顶表面上方，具有相对于晶片径向排列的挤压槽。 晶片旋转，并且挤出头朝向晶片的中心径向移动，而光致抗蚀剂被挤出挤出槽。 控制晶片的旋转速度和挤压头的径向速度，使得挤出头相对于旋转晶片的切向速度是恒定的。

公开(公告)号：US07030039B2

公开(公告)日：2006-04-18

申请号：US09895787

申请日：2001-06-30

Applicant: Emir Gurer ,  Tom Zhong ,  John Lewellen ,  Edward C. Lee ,  Robert P. Mandal ,  James C. Grambow ,  Ted C. Bettes ,  Donald R. Sauer ,  Edmond R. Ward ,  Jung-Hoon Chun ,  Sangjun Han

Inventor： Emir Gurer ,  Tom Zhong ,  John Lewellen ,  Edward C. Lee ,  Robert P. Mandal ,  James C. Grambow ,  Ted C. Bettes ,  Donald R. Sauer ,  Edmond R. Ward ,  Jung-Hoon Chun ,  Sangjun Han

IPC: H01L21/312

CPC classification number: H01L21/6715 ,  B05C5/0208 ,  B05C5/0245 ,  B05C5/0254 ,  B05D1/005 ,  B05D1/265 ,  B05D3/0486 ,  G03F7/162

Abstract: A method of and an apparatus for coating a substrate with a polymer solution to produce a film of uniform thickness, includes mounting the substrate inside an enclosed housing and passing a control gas, which may be a solvent vapor-bearing gas into the housing through an inlet. The polymer solution is deposited onto the surface of the substrate in the housing and the substrate is then spun. The control gas and any solvent vapor and particulate contaminants suspended in the control gas are exhausted from the housing through an outlet and the solvent vapor concentration is controlled by controlling the temperature of the housing and the solvent from which the solvent vapor-bearing gas is produced. Instead the concentration can be controlled by mixing gases having different solvent concentrations. The humidity of the gas may also be controlled.