Abstract:
In an automotive vehicle inverter control apparatus of the related art, a limp-home mode is provided, but six power sources including transformers are required for respective gate circuits of the respective IGBT drive circuits. Therefore, a reduction in size and a reduction in weight cannot be achieved, and a demand of the improvement of mountability or the improvement of fuel consumption as described above cannot be satisfied. A power semiconductor module and the drive circuit include three unit semiconductor modules and three unit drive circuits corresponding to a three-phase alternating current, and power supply units of the unit drive circuits are provided independently, whereby the limp-home mode is provided and in addition, the number of power supply units may be reduced, so that the reduction in size and the reduction in weight are achieved.
Abstract:
A power conversion device includes an inverter circuit converting DC power into AC power and including switching devices constituting upper and lower arms, a control circuit controlling the switching devices, a drive circuit driving the switching devices by a signal from the control circuit, and an insulated power supply circuit supplying power to the drive circuit. The control circuit controls a power supply voltage to be outputted from the power supply circuit to the drive circuit. The drive circuit drives the switching devices and based on a carrier frequency and the power supply voltage. The power supply circuit includes a feedback output circuit through which the voltage outputted to the drive circuit is outputted to a power supply control IC. The feedback output circuit includes a dummy load circuit which controls the voltage to be outputted to the power supply control IC based on a change of the carrier frequency.
Abstract:
A COC DRAM including a plurality of stacked DRAM chips is mounted on a motherboard by using an interposer. The interposer includes a Si unit and a PCB. The Si unit includes a Si substrate and an insulating-layer unit in which wiring is installed. The PCB includes a reference plane for the wiring in the Si unit. The wiring topology between a chip set and the COC DRAM is the same for every signal. Accordingly, a memory system enabling a high-speed operation, low power consumption, and large capacity is provided.
Abstract:
A discharge circuit for a DC power supply smoothing capacitor that is used in a power conversion device that supplies DC power via a switch to the DC power supply smoothing capacitor and an inverter, includes; a resistor that discharges charge in the capacitor; a switch connected in series with the resistor, that either passes or intercepts discharge current flowing from the capacitor to the resistor; a measurement circuit that measures a terminal voltage of the capacitor; and a control circuit that controls continuity and discontinuity of the switch; wherein the control circuit, after having made the switch continuous and starting discharge of the capacitor by the resistor, if a terminal voltage of the capacitor as measured by the measurement circuit exceeds a voltage decrease characteristic set in advance, makes the switch discontinuous and stops discharge by the resistor.
Abstract:
Stacked semiconductor device includes plural memory chips, stacked together, in which waveform distortion at high speed transmission is removed. Stacked semiconductor device 1 includes plural memory chips 11, 12 stacked together. Data strobe signal (DQS) and inverted data strobe signal (/DQS), as control signals for inputting/outputting data twice per cycle, are used as two single-ended data strobe signals. Data strobe signal and inverted data strobe signal mate with each other. Data strobe signal line for the data strobe signal L4 is connected to data strobe signal (DQS) pad of first memory chip 11. Inverted data strobe signal line for /DQS signal L5 is connected to inverted data strobe signal (/DQS) pad of second memory chip 12.
Abstract:
An object of the present invention is to reduce jitter dependent on data patterns by an interface receiver. Another object of the present invention is to provide an LSI capable of automatically adjusting a delay time for jitter reduction so as to be able to control its setting for each device. Since the jitter dependent on the data patterns can be expected according to how the previous state is being placed, the state of data received by the receiver is held, and the timing provided to fetch input data is adjusted according to the held state and the input data. As a control mechanism lying in the receiver, for determining a delay time dependent on the form of mounting, a driver transmits and receives pulse data set at one-cycle intervals and pulse data set at two-cycle intervals as test patterns. The receiver has an automatic control mechanism for determining a delay time optimal to a system from the difference between a rising time of each of pulses different in pulse width and its falling time.
Abstract:
An object of the present invention is to reduce jitter dependent on data patterns by an interface receiver. Another object of the present invention is to provide an LSI capable of automatically adjusting a delay time for jitter reduction so as to be able to control its setting for each device. Since the jitter dependent on the data patterns can be expected according to how the previous state is being placed, the state of data received by the receiver is held, and the timing provided to fetch input data is adjusted according to the held state and the input data. As a control mechanism lying in the receiver, for determining a delay time dependent on the form of mounting, a driver transmits and receives pulse data set at one-cycle intervals and pulse data set at two-cycle intervals as test patterns. The receiver has an automatic control mechanism for determining a delay time optimal to a system from the difference between a rising time of each of pulses different in pulse width and its falling time.
Abstract:
A dummy wiring 25 is provided for simulating an actual wiring 26 connecting semiconductor integrated circuits 2 and 6 on a circuit board. The semiconductor integrated circuit comprises a data output circuit 28 capable of variably setting the slew rate and a circuit 29 for measuring signal delay time between a signal sending point and a signal reflection point (characteristic impedance mismatching point) using the dummy wiring 25, and the delay time so obtained by the measuring circuit is used for the determination of the signal transition time of the output circuit. The transition time of the signal is set at least twice of the signal delay time between the signal sending point and the wiring branch at the nearest end. In this way, signal transmission with alleviated reflection by the reflection point at the nearest end is realized.
Abstract:
A semiconductor module comprises a first semiconductor device, a second semiconductor device and a reference voltage supplying circuit. The first semiconductor device comprises a first electrode. The second semiconductor device comprises a second electrode. The reference voltage supplying circuit is for supplying a reference potential to the first electrode and the second electrode and for suppressing a noise to be transferred between the first electrode and the second electrode.
Abstract:
There is the problem that since C/A signals in a DIMM are distributed to respective DRAMs through a register in the DIMM and DQ signals are wired directly from terminals in the DIMM, their timing is difficult to synchronize. The register for speeding up the C/A signals of the DIMM that operates with high speed is provided, and a wiring from the register is set to a daisy-chain wiring. Then, by a timing adjustment circuit provided in the DRAM, a wiring delay time difference between the C/A signals and the clock signals, which are different depending on positions of the DRAMs, is such that the sum of a delay time from the register to each DRAM and a delay amount due to the timing adjustment circuit is made equal to a delay time of the farthest DRAM.