公开(公告)号：US20130092527A1

公开(公告)日：2013-04-18

申请号：US13325912

申请日：2011-12-14

Applicant: Yau-Hung Chiou ,  Chao-Lun Liu ,  Shu-Hui Fan

Inventor： Yau-Hung Chiou ,  Chao-Lun Liu ,  Shu-Hui Fan

IPC: C23C14/34

CPC classification number: H01L21/561 ,  C23C14/024 ,  C23C14/025 ,  C23C14/14 ,  C23C14/325 ,  H01L23/552 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/3025 ,  H05K9/0032 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for manufacturing shielding which uses multiple vacuum sputtering methods to produce shielding on single IC chip. The method comprises the following steps: using covering fixtures to cover a plurality of IC chips and fixing these IC chips on a work support; vacuumizing the chamber to a pretreatment vacuum level; keeping pumping an ionizable gas into the chamber and performing ion bombardment on the material for IC packaging on the surface of these IC chips in order to produce carbon dangling bond connection layer on the material when the vacuum level of the chamber reaches the work vacuum level; performing multiple vacuum sputtering method to sequentially form a first coating layer, a second coating layer and a third coating layer on the carbon dangling bond connection layer; and breaking the vacuum status of the chamber and taking out the coated IC chips.

Abstract translation: 一种用于制造屏蔽的方法，其使用多个真空溅射方法在单个IC芯片上产生屏蔽。 该方法包括以下步骤：使用覆盖夹具覆盖多个IC芯片并将这些IC芯片固定在工作支架上; 将腔室抽真空至预处理真空度; 保持泵送可离子化气体进入室内，对这些IC芯片表面的IC封装材料进行离子轰击，以便当室内真空度达到工作真空度时，在材料上产生碳悬挂键连接层; 进行多重真空溅射法，在碳悬挂接合层上依次形成第一涂层，第二涂层和第三涂层; 并破坏腔室的真空状态并取出涂覆的IC芯片。

公开(公告)号：US20120192411A1

公开(公告)日：2012-08-02

申请号：US13166525

申请日：2011-06-22

Applicant: Yau-Hung Chiou ,  Shu-Hui Fan ,  Ming-Tze Kao

Inventor： Yau-Hung Chiou ,  Shu-Hui Fan ,  Ming-Tze Kao

IPC: H01R43/00

CPC classification number: H05K3/4046 ,  H05K1/0306 ,  H05K3/0047 ,  H05K2201/10242 ,  Y10T29/49117

Abstract: The present invention discloses a method for electrical connection between two surfaces of a ceramic substrate, and the method includes the steps of forming a through hole between the two surfaces of the ceramic substrate corresponding to electrical connection points of a circuit on the ceramic substrate, and then mounting a conductive assembly inside the through hole to form a conduction path between the two surfaces of the ceramic substrate. By this means, time cost of manufacturing of ceramic substrate circuit board could be largely decreased, and the manufacturing procedures could be much simplified as well.

Abstract translation: 本发明公开了一种在陶瓷基板的两面之间进行电连接的方法，该方法包括以下步骤：在与陶瓷基板上的电路的电连接点相对应的陶瓷基板的两个表面之间形成通孔，以及 然后将导电组件安装在通孔内部以形成陶瓷基板的两个表面之间的传导路径。 通过这种方式，陶瓷基板电路板的制造时间成本可以大大降低，并且制造程序也可以被大大简化。

公开(公告)号：US20110061848A1

公开(公告)日：2011-03-17

申请号：US12874473

申请日：2010-09-02

Applicant: Yau-Hung Chiou ,  Shu-Hui Fan ,  Yuan-Li Chuang

Inventor： Yau-Hung Chiou ,  Shu-Hui Fan ,  Yuan-Li Chuang

IPC: F28F7/00 ,  B23P15/26

CPC classification number: F28F13/003 ,  F28D2021/0029 ,  F28F21/08 ,  F28F2255/12 ,  F28F2255/18 ,  H01L23/3733 ,  H01L23/3736 ,  H01L2924/0002 ,  Y10T29/49393 ,  H01L2924/00

Abstract: The present invention discloses a heat dissipation module and a manufacturing method thereof. The heat dissipation module comprises a metal base, a porous metal layer and a metal plate member. The porous metal layer is disposed on one side of the metal base and includes a plurality of micropores. Parts of the plurality of micropores contain a metal medium. The metal plate member is disposed on one side of the porous metal layer. Heat is rapidly conducted from the metal base through the metal plate member to the environment by means of the porous metal layer and the metal medium.

Abstract translation: 本发明公开了一种散热模块及其制造方法。 散热模块包括金属基底，多孔金属层和金属板构件。 多孔金属层设置在金属基体的一侧，并且包括多个微孔。 多个微孔的一部分含有金属介质。 金属板构件设置在多孔金属层的一侧。 通过多孔金属层和金属介质，热量从金属基体通过金属板构件快速传导到环境。

公开(公告)号：US20110277963A1

公开(公告)日：2011-11-17

申请号：US12778147

申请日：2010-05-12

Applicant: YAU-HUNG CHIOU ,  SHU-HUI FAN ,  YUAN-LI CHUANG

Inventor： YAU-HUNG CHIOU ,  SHU-HUI FAN ,  YUAN-LI CHUANG

IPC: H01L23/36 ,  H01L23/467 ,  B21D53/02 ,  H01L23/427

CPC classification number: H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

Abstract: A thermal module and a method of manufacturing the same are disclosed. The thermal module includes a first heat dissipation member, a second heat dissipation member, a binding layer, and a metal layer. The first heat dissipation member can be a heat dissipating substrate, and the second heat dissipation member can be a heat pipe or a heat dissipating substrate. The metal layer is coated on the first heat dissipation member through a metal spray process. The binding layer can be a solder paste. By providing the spray-coated metal layer, the thermal module can have upgraded heat dissipation efficiency, increased pull strength, and reduced manufacturing cost.

Abstract translation: 公开了一种热模块及其制造方法。 热模块包括第一散热构件，第二散热构件，结合层和金属层。 第一散热构件可以是散热基板，第二散热构件可以是热管或散热基板。 金属层通过金属喷涂工艺涂覆在第一散热构件上。 粘合层可以是焊膏。 通过提供喷涂金属层，热模块可以具有升级的散热效率，增加的拉伸强度和降低的制造成本。

公开(公告)号：US20130134036A1

公开(公告)日：2013-05-30

申请号：US13450843

申请日：2012-04-19

Applicant: CHAO-LUN LIU ,  YAU-HUNG CHIOU ,  SHU-HUI FAN

Inventor： CHAO-LUN LIU ,  YAU-HUNG CHIOU ,  SHU-HUI FAN

IPC: C23C14/35 ,  C23C14/58

CPC classification number: H01J37/3405 ,  C23C14/021 ,  C23C14/025 ,  C23C14/06 ,  C23C14/325 ,  C23C14/352 ,  C23C14/505 ,  H01J37/32055 ,  H01J37/3429 ,  H05K9/0032

Abstract: Equipment for making IC shielding coating layer and a metal shielding layer of IC. The equipment comprises a base, a work support, a plurality of medium frequency magnetron targets and a plurality of multi-arc ion targets. The base comprises a chamber. The work support is disposed in the chamber and movably connected with a plurality of rotation axes. Each rotation axes comprises at least one fixture. The fixture is used to put at least one IC. Each medium frequency magnetron target and each multi-arc ion target are disposed in the chamber. The medium frequency magnetron targets and the multi-arc ion targets are used to sputter a metal material over the IC to form at least one metal shielding layer on a surface of the IC.

Abstract translation: 制造IC屏蔽涂层和IC金属屏蔽层的设备。 该设备包括基座，工作支架，多个中频磁控管靶和多个多弧离子靶。 底座包括一个腔室。 工作支撑件设置在室中并与多个旋转轴线可移动地连接。 每个旋转轴包括至少一个夹具。 该夹具用于放置至少一个IC。 每个中频磁控管靶和每个多弧离子靶设置在腔室中。 中频磁控管靶和多弧离子靶用于溅射IC上的金属材料，以在IC的表面上形成至少一个金属屏蔽层。

公开(公告)号：US20120141755A1

公开(公告)日：2012-06-07

申请号：US13019475

申请日：2011-02-02

Applicant: Yau-Hung Chiou ,  Shu-Hui Fan

Inventor： Yau-Hung Chiou ,  Shu-Hui Fan

IPC: B32B15/04 ,  B05D3/10 ,  B32B7/02

CPC classification number: C23C28/044 ,  C23C14/0036 ,  C23C14/0635 ,  C23C28/04 ,  Y10T428/2495 ,  Y10T428/265 ,  Y10T428/31678

Abstract: The present invention discloses a metal member and a manufacturing method thereof. The metal member comprises a metal substrate and an intermediate layer. Wherein, the intermediate layer is disposed on the metal substrate by vacuum depositing, and the intermediate layer is a carbonized metal. Preferably, the intermediate layer could have a composition gradient or a thickness gradient to further increase the adhesion between the metal layer deposited on the metal substrate.

Abstract translation: 本发明公开了一种金属构件及其制造方法。 金属构件包括金属基板和中间层。 其中，中间层通过真空沉积设置在金属基板上，中间层是碳化金属。 优选地，中间层可以具有组成梯度或厚度梯度，以进一步增加沉积在金属基底上的金属层之间的粘合力。

公开(公告)号：US20120202028A1

公开(公告)日：2012-08-09

申请号：US13117640

申请日：2011-05-27

Applicant: Yau-Hung Chiou ,  Shu-Hui Fan

Inventor： Yau-Hung Chiou ,  Shu-Hui Fan

IPC: B32B18/00 ,  C23C16/06 ,  C23C16/02 ,  B32B9/04 ,  C23C16/50 ,  B82Y30/00 ,  B82Y40/00

CPC classification number: C04B41/90 ,  C04B41/009 ,  C04B41/52 ,  C23C14/0084 ,  Y10T428/2495 ,  Y10T428/265 ,  C04B35/00 ,  C04B41/4529 ,  C04B41/455 ,  C04B41/5061 ,  C04B41/5027 ,  C04B41/522 ,  C04B41/5062 ,  C04B41/5127 ,  C04B41/5133 ,  C04B41/51

Abstract: The present invention discloses a ceramic member and a manufacturing method thereof. The ceramic member comprises a ceramic substrate and an intermediate layer. Wherein, the intermediate layer is disposed on the ceramic substrate by vacuum depositing, and the intermediate layer is a carbonized metal (MxCy), an oxidized metal (MxOy) or a nitride metal (MxNy). Preferably, the intermediate layer could have a concentration gradient or a thickness gradient to further increase the adhesion between the metal layer deposited on the ceramic substrate.

Abstract translation: 本发明公开了一种陶瓷构件及其制造方法。 陶瓷构件包括陶瓷衬底和中间层。 其中，通过真空沉积将中间层设置在陶瓷基板上，中间层为碳化金属（MxCy），氧化金属（MxOy）或氮化物金属（MxNy））。 优选地，中间层可以具有浓度梯度或厚度梯度，以进一步增加沉积在陶瓷基底上的金属层之间的粘合性。