Secure Communications
    1.
    发明申请
    Secure Communications 审中-公开
    安全通信

    公开(公告)号:US20080301433A1

    公开(公告)日:2008-12-04

    申请号:US11755544

    申请日:2007-05-30

    Inventor: Stephane Di Vito

    Abstract: The subject matter of this specification can be embodied in, among other things, an apparatus that includes a verification module to provide information used to identify a user of the apparatus, a memory for storing information used for securing communications transmitted to a remote device, a processing unit for generating a secured communication based on the stored information, and an interface to communicate with a peripheral interface of a host device. The host device configured to transmit the secured communication to the remote device without accessing content of the secured communication.

    Abstract translation: 本说明书的主题可以包括一种装置,其包括验证模块,用于提供用于识别设备的用户的信息;存储器,用于存储用于保护传送到远程设备的通信的信息; 用于基于所存储的信息产生安全通信的处理单元,以及与主机设备的外围接口进行通信的接口。 所述主机设备被配置为在不访问所述安全通信的内容的情况下将所述安全通信发送到所述远程设备。

    Immunity to Variations in Limited Resources, Provided to an Object with a Dual Interface
    2.
    发明申请
    Immunity to Variations in Limited Resources, Provided to an Object with a Dual Interface 审中-公开
    对有限资源的变化的豁免,提供给具有双重接口的对象

    公开(公告)号:US20080048042A1

    公开(公告)日:2008-02-28

    申请号:US10583260

    申请日:2004-12-16

    Abstract: The invention relates to a method for creating immunity to the variations in resources of a portable object comprising a processor block, and at least two communication and/or supply interfaces with and/or without contact. Said method comprises at least one step for controlling the availability state of at least one resource on one of the interfaces, and a resource selection step. The inventive method is characterised in that it comprises the following steps according to which an interruption signal is generated towards the processor block during a variation in the availability of the resource, and the processor treats the interruption signal in order to enable a selection of resources. The invention also relates to the associated portable object.

    Abstract translation: 本发明涉及一种用于创建对包括处理器块的便携式对象的资源变化的抗扰性的方法,以及具有和/或不具有接触的至少两个通信和/或提供接口。 所述方法包括用于控制所述接口之一上的至少一个资源的可用性状态的至少一个步骤和资源选择步骤。 本发明的方法的特征在于,其包括以下步骤,根据该步骤,在资源可用性的变化期间向处理器块产生中断信号,并且处理器处理中断信号以便能够选择资源。 本发明还涉及相关联的便携式对象。

    Keeping a dual-interface object in fully simultaneous operation
    3.
    发明申请
    Keeping a dual-interface object in fully simultaneous operation 审中-公开
    保持双接口对象完全同时运行

    公开(公告)号:US20070164118A1

    公开(公告)日:2007-07-19

    申请号:US10583250

    申请日:2004-12-16

    CPC classification number: G06K19/0723 G06K7/0008 G06K19/07 G06K19/07769

    Abstract: The invention relates to the operational maintenance of an intelligent portable object (1) which is provided with a processing unit (6) having at least two communication and/or feed interfaces either with or without contacts. The method comprises a reinitialization step (MaZ) for the processing unit (6). The method is characterized in that it comprises at least one delay and/or reinitialization simulation step if a communication or application is in the process of being processed by the processing unit. The invention also relates to an associated device.

    Abstract translation: 本发明涉及一种具有处理单元(6)的智能便携式对象(1)的操作维护,该处理单元具有至少两个具有或不具有触点的通信和/或馈送接口。 该方法包括用于处理单元(6)的重新初始化步骤(MaZ)。 该方法的特征在于,如果通信或应用正在被处理单元处理的过程中,其包括至少一个延迟和/或重新初始化仿真步骤。 本发明还涉及一种相关联的装置。

    Surface mounting chip carrier module
    4.
    发明授权
    Surface mounting chip carrier module 有权
    表面安装芯片载体模块

    公开(公告)号:US08159830B2

    公开(公告)日:2012-04-17

    申请号:US12426106

    申请日:2009-04-17

    Abstract: A device includes a carrier and an integrated circuit chip having a first side supported by the carrier and a second side having contacts. The carrier has multiple carrier contacts supported by the carrier and separated from the integrated circuit chip. Multiple leads are coupled between the contacts on the integrated circuit chip and the multiple carrier contacts. A resin encapsulates the integrated circuit chip leaving the multiple carrier contacts at least partially uncovered for attaching to a card or board.

    Abstract translation: 一种器件包括载体和集成电路芯片,其具有由载体支撑的第一侧和具有触点的第二侧。 载体具有由载体支撑并且与集成电路芯片分离的多个载体接触。 多个引线耦合在集成电路芯片上的触点和多个载体触点之间。 树脂将集成电路芯片封装起来,使得多个载体接触件至少部分地不被覆盖以附接到卡或板上。

    Fully simultaneous information on variation in status for an object with a dual interface
    5.
    发明申请
    Fully simultaneous information on variation in status for an object with a dual interface 有权
    全面同步的信息关于具有双重界面的对象的状态变化

    公开(公告)号:US20070095924A1

    公开(公告)日:2007-05-03

    申请号:US10583333

    申请日:2004-12-16

    Abstract: An intelligent portable object has a dual interface and is equipped with a chip and is suitable for communicating with at least one electronic data transmission terminal via a contact interface according to standard ISO7816.3 and likewise without contact via a contactless interface and according to another contactless standard; a transition causing a variation of at least one status for the object. At least one information step, for example in real time, of the chip restituting variations in status, with at least a logical phase forming a supply controller, which ensure a configuration/information allowing a fully simultaneous functioning of applications resorting to the contact and/or contactless interface.

    Abstract translation: 智能便携式对象具有双接口并且配备有芯片,并且适于通过根据标准ISO7816.3的接触界面与至少一个电子数据传输终端通信,并且同样通过非接触式接口和根据另一非接触式接口 标准; 导致对象的至少一个状态的变化的转换。 至少一个信息步骤,例如实时地,芯片恢复状态的变化,至少形成供应控制器的逻辑阶段,其确保配置/信息允许使用联系人的/ 或非接触式接口。

    SURFACE MOUNTING CHIP CARRIER MODULE
    6.
    发明申请
    SURFACE MOUNTING CHIP CARRIER MODULE 有权
    表面安装芯片载体模块

    公开(公告)号:US20100263922A1

    公开(公告)日:2010-10-21

    申请号:US12426106

    申请日:2009-04-17

    Abstract: A device includes a carrier and an integrated circuit chip having a first side supported by the carrier and a second side having contacts. The carrier has multiple carrier contacts supported by the carrier and separated from the integrated circuit chip. Multiple leads are coupled between the contacts on the integrated circuit chip and the multiple carrier contacts. A resin encapsulates the integrated circuit chip leaving the multiple carrier contacts at least partially uncovered for attaching to a card or board.

    Abstract translation: 一种器件包括载体和集成电路芯片,其具有由载体支撑的第一侧和具有触点的第二侧。 载体具有由载体支撑并且与集成电路芯片分离的多个载体接触。 多个引线耦合在集成电路芯片上的触点和多个载体触点之间。 树脂将集成电路芯片封装起来,使得多个载体接触件至少部分地不被覆盖以附接到卡或板上。

Patent Agency Ranking