公开(公告)号：US11729933B2

公开(公告)日：2023-08-15

申请号：US17590420

申请日：2022-02-01

Applicant: TTM TECHNOLOGIES NORTH AMERICA, LLC

Inventor： Michael Len ,  Nicholas S. Koop ,  Andrew Kempf ,  Matt Gortner

IPC: H05K5/02 ,  H05K1/14 ,  H05K1/18 ,  H05K5/00 ,  H05K5/06

CPC classification number: H05K5/0247 ,  H05K1/147 ,  H05K1/189 ,  H05K5/0004 ,  H05K5/069 ,  H05K2201/056 ,  H05K2201/2018

Abstract: The disclosure provides a low-cost near-hermetic package, which may a substrate configured to support one or more internal components. The package may also include an enclosure comprising a cavity surrounding the one or more internal components and a first sidewall extending upward from the substrate. The first sidewall may be coupled to the substrate. The package may further include a first flexible circuit comprising conductive traces configured to connect to the one or more internal components. The first flexible circuit may include a first section outside the first sidewall of the enclosure, a second section inside the enclosure, and a third section between the first section and the second section joining to the enclosure and the substrate.

公开(公告)号：US11693181B2

公开(公告)日：2023-07-04

申请号：US17053554

申请日：2019-07-08

Applicant: TTM Technologies North America, LLC

Inventor： Xinhong Shi ,  Haitao Fu ,  Jun Zhang ,  Huamei Zhou ,  Longxiu Zhu ,  Marika Immonen

IPC: G02B6/122 ,  G02B6/13 ,  H05K1/02

CPC classification number: G02B6/1221 ,  G02B6/13 ,  H05K1/0274 ,  H05K2201/09036

Abstract: The disclosure relates to a high-density optical waveguide structure, a printed circuit board and a preparation method thereof. The high-density optical waveguide structure comprises an undercladding layer, a core layer and an upper cladding layer in sequence; wherein, the lower cladding layer is arranged at intervals. The trench is filled with an optical waveguide material to form a core layer. The waveguide structure integrates an optical waveguide into a PCB to realize photoelectric interconnection. The waveguide structure can better achieve higher parallel interconnection density, maintain good signal integrity, reduce device and device size, and at the same time, consume less power. The structure is configured to easily dissipate heat, enabling a simpler physical architecture and design, maximizing the wiring space of printed circuit boards, facilitating the fabrication of ultra-fine wire boards; and improving the wiring density and reliability of existing manufacturing methods.

公开(公告)号：US11711885B2

公开(公告)日：2023-07-25

申请号：US17162773

申请日：2021-01-29

Applicant: TTM Technologies North America, LLC

Inventor： Rick Bauer ,  Jerrad Martinson ,  Shane Hoffstatter ,  Doyle Laudal ,  Mike Lugert ,  Mike Len

IPC: H05K1/02 ,  H05K3/40

CPC classification number: H05K1/0203 ,  H05K3/4076 ,  H05K2203/1572

Abstract: A printed circuit board (PCB) having an engineered thermal path and a method of manufacturing are disclosed herein. In one aspect, the PCB includes complementary cavities formed on opposite sides of the PCB. The complementary cavities are in a thermal communication and/or an electrical communication to form the engineered thermal path and each cavity is filled with a thermally conductive material to provide a thermal pathway for circuits and components of the PCB. The method of manufacturing may further include drilling and/or milling each cavity, panel plating the cavities and filling the cavities with a suitable filling material.