公开(公告)号：US11729933B2

公开(公告)日：2023-08-15

申请号：US17590420

申请日：2022-02-01

Applicant: TTM TECHNOLOGIES NORTH AMERICA, LLC

Inventor： Michael Len ,  Nicholas S. Koop ,  Andrew Kempf ,  Matt Gortner

IPC: H05K5/02 ,  H05K1/14 ,  H05K1/18 ,  H05K5/00 ,  H05K5/06

CPC classification number: H05K5/0247 ,  H05K1/147 ,  H05K1/189 ,  H05K5/0004 ,  H05K5/069 ,  H05K2201/056 ,  H05K2201/2018

Abstract: The disclosure provides a low-cost near-hermetic package, which may a substrate configured to support one or more internal components. The package may also include an enclosure comprising a cavity surrounding the one or more internal components and a first sidewall extending upward from the substrate. The first sidewall may be coupled to the substrate. The package may further include a first flexible circuit comprising conductive traces configured to connect to the one or more internal components. The first flexible circuit may include a first section outside the first sidewall of the enclosure, a second section inside the enclosure, and a third section between the first section and the second section joining to the enclosure and the substrate.