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公开(公告)号：US08969732B2
公开(公告)日：2015-03-03
申请号：US13534041
申请日：2012-06-27
Applicant: Tetsuo Amano , Toshio Nishiwaki
Inventor： Tetsuo Amano , Toshio Nishiwaki
CPC classification number: H05K3/4602 , H05K1/024 , H05K3/4655 , H05K2201/068 , H05K2201/096
Abstract: A printed wiring board includes a core insulation layer having via conductors through the core layer, a first structure including an interlayer insulation layer on first surface of the core layer and having via conductors through the interlayer layer in the first structure, and a second structure including an interlayer insulation layer on second surface of the core layer and having via conductors through the interlayer layer in the second structure. The interlayer layers have dielectric constants set to be 4.0 or lower for signal transmission at frequency of 1 GHz, the core layer has thermal expansion coefficient at or below Tg set lower than thermal expansion coefficients of the interlayer layers at or below Tg, the coefficient of the core layer at or below Tg is set to be 75 ppm/° C. or lower, and the conductors in the interlayer layers are stacked on the conductors in the core layer.
Abstract translation: 一种印刷电路板包括具有穿过芯层的通孔导体的芯绝缘层，在芯层的第一表面上包括层间绝缘层并且具有穿过第一结构中的层间层的通路导体的第一结构，以及包括 在芯层的第二表面上的层间绝缘层，并且在第二结构中具有穿过层间层的通孔导体。 层间层的介电常数设定为4.0或更低，用于1GHz频率的信号传输，核心层的热膨胀系数低于或等于Tg设定为低于Tg或以下的中间层的热膨胀系数，系数 将Tg处于或低于Tg的芯层设定为75ppm /℃或更低，并且层间层中的导体堆叠在芯层中的导体上。
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公开(公告)号：US20130075147A1
公开(公告)日：2013-03-28
申请号：US13535532
申请日：2012-06-28
Applicant: Tetsuo Amano , Toshio Nishiwaki
Inventor： Tetsuo Amano , Toshio Nishiwaki
IPC: H05K1/11
CPC classification number: H05K1/0306 , H05K1/0219 , H05K1/024 , H05K1/0271 , H05K1/0373 , H05K1/09 , H05K1/115 , H05K3/427 , H05K3/4602 , H05K3/4655 , H05K2201/0145 , H05K2201/0209 , H05K2201/068 , H05K2201/096
Abstract: A printed wiring board includes a core insulation layer including a resin and having a via conductor through the core insulation layer, a first conductive layer formed on the core layer and including a copper foil and a plated film, an interlayer insulation layer formed on the first layer and including a resin, the interlayer layer having a via conductor through the interlayer layer, and a second conductive layer formed on the interlayer layer and including a copper foil and a plated film. The first layer includes a conductive circuit, the core and interlayer layers have dielectric constants of 4.0 or lower for signal transmission at frequency of 1 GHz and thermal expansion coefficient of 85 ppm/° C. or lower at or below Tg, and the foil of the first layer has thickness greater than thickness of the foil of the second layer.
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公开(公告)号：US20120067632A1
公开(公告)日：2012-03-22
申请号：US13175381
申请日：2011-07-01
Applicant: Toru Nakai , Tetsuo Amano , Yoshinori Takasaki
Inventor： Toru Nakai , Tetsuo Amano , Yoshinori Takasaki
CPC classification number: H05K3/027 , H05K3/4602 , H05K3/4652 , H05K2201/0209 , H05K2203/0557 , H05K2203/107
Abstract: A method for manufacturing a printed wiring board including forming an insulative resin layer containing a resin and an inorganic filler, forming a conductor layer including a conductive material and having a conductor on the insulative resin layer, irradiating a laser beam upon the conductor of the conductor layer such that the conductor is sectioned or a width of the conductor is narrowed, and forming a conductive pattern on the insulative resin layer. The inorganic filler is in an amount of 30 wt. % or more of the insulative resin layer.
Abstract translation: 一种印刷布线板的制造方法，其特征在于，在绝缘性树脂层上形成包含树脂和无机填料的绝缘性树脂层，形成具有导体的导体层，并且在导体上照射激光束 使得导体被切断或者导体的宽度变窄，并且在绝缘树脂层上形成导电图案。 无机填料的量为30wt。 绝缘树脂层的％以上。
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公开(公告)号：US4599024A
公开(公告)日：1986-07-08
申请号：US571713
申请日：1984-01-18
Applicant: Nariaki Sano , Tetsuo Amano
Inventor： Nariaki Sano , Tetsuo Amano
CPC classification number: F16B25/103 , F16B25/0021 , F16B25/0084 , Y10T408/9093
Abstract: A drill screw having an integral driving shank, head, and entering end portion. The shank has formed on it thread convolutions of uniform outer and root diameters. The entering end portion has a cylindrical portion coaxial with the shank provided with two flutes inclined with respect to the center axis of the cylindrical portion and disposed on opposite sides of it, and end surfaces of roof-shape. Each of the flutes includes conical flute surfaces. The intersection of each of the conical flute surfaces and each of the end surfaces forms a cutting edge. And each of the conical flute surfaces forms a rake angle with respect to one of the cutting edges, while each of the end surfaces forms a relief angle with respect to one of the cutting edges.In a preferred construction each fluted surface is located outside or beyond a plane containing the center axis of the drill screw, and the fluted surfaces each have a vertex angle of 35.degree. to 54.degree..
Abstract translation: 一种具有整体驱动柄，头部和进入端部的钻螺丝。 柄上形成有均匀外径和根直径的螺纹卷。 入口端部具有与柄同轴的圆柱形部分，其具有相对于圆柱形部分的中心轴线倾斜并设置在其相对侧上的两个凹槽和顶部形状的端面。 每个凹槽包括圆锥形凹槽表面。 每个锥形槽表面和每个端面的交点形成切削刃。 并且每个锥形凹槽表面相对于一个切削刃形成前角，而每个端面相对于其中一个切削刃形成一个倾斜角。 在优选的结构中，每个槽纹表面位于包含钻螺丝的中心轴线的平面的外侧或外侧，并且凹槽表面各自具有35°至54°的顶角。
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公开(公告)号：US08895873B2
公开(公告)日：2014-11-25
申请号：US13535532
申请日：2012-06-28
Applicant: Tetsuo Amano , Toshio Nishiwaki
Inventor： Tetsuo Amano , Toshio Nishiwaki
CPC classification number: H05K1/0306 , H05K1/0219 , H05K1/024 , H05K1/0271 , H05K1/0373 , H05K1/09 , H05K1/115 , H05K3/427 , H05K3/4602 , H05K3/4655 , H05K2201/0145 , H05K2201/0209 , H05K2201/068 , H05K2201/096
Abstract: A printed wiring board includes a core insulation layer including a resin and having a via conductor through the core insulation layer, a first conductive layer formed on the core layer and including a copper foil and a plated film, an interlayer insulation layer formed on the first layer and including a resin, the interlayer layer having a via conductor through the interlayer layer, and a second conductive layer formed on the interlayer layer and including a copper foil and a plated film. The first layer includes a conductive circuit, the core and interlayer layers have dielectric constants of 4.0 or lower for signal transmission at frequency of 1 GHz and thermal expansion coefficient of 85 ppm/° C. or lower at or below Tg, and the foil of the first layer has thickness greater than thickness of the foil of the second layer.
Abstract translation: 印刷布线板包括：芯绝缘层，其包括树脂，并且具有通过芯绝缘层的通路导体，形成在芯层上并包括铜箔和镀膜的第一导电层，形成在第一层上的层间绝缘层 层，并且包括树脂，所述层间层具有穿过所述层间层的通孔导体，以及形成在所述中间层上并包括铜箔和镀膜的第二导电层。 第一层包括导电电路，核心层和层间介电常数为4.0或更低，信号传输频率为1GHz，热膨胀系数为85ppm /℃或更低，等于或低于Tg， 第一层的厚度大于第二层的箔的厚度。
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Patent Agency Ranking
公开(公告)号：US08756803B2
公开(公告)日：2014-06-24
申请号：US13175381
申请日：2011-07-01
Applicant: Toru Nakai , Tetsuo Amano , Yoshinori Takasaki
Inventor： Toru Nakai , Tetsuo Amano , Yoshinori Takasaki
IPC: H05K3/02
CPC classification number: H05K3/027 , H05K3/4602 , H05K3/4652 , H05K2201/0209 , H05K2203/0557 , H05K2203/107
Abstract: A method for manufacturing a printed wiring board including forming an insulative resin layer containing a resin and an inorganic filler, forming a conductor layer including a conductive material and having a conductor on the insulative resin layer, irradiating a laser beam upon the conductor of the conductor layer such that the conductor is sectioned or a width of the conductor is narrowed, and forming a conductive pattern on the insulative resin layer. The inorganic filler is in an amount of 30 wt. % or more of the insulative resin layer.
Abstract translation: 一种印刷布线板的制造方法，其特征在于，在绝缘性树脂层上形成包含树脂和无机填料的绝缘性树脂层，形成具有导体的导体层，并且在导体上照射激光束 使得导体被切断或者导体的宽度变窄，并且在绝缘树脂层上形成导电图案。 无机填料的量为30wt。 绝缘树脂层的％以上。
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公开(公告)号：US08581104B2
公开(公告)日：2013-11-12
申请号：US12981709
申请日：2010-12-30
Applicant: Toru Nakai , Tetsuo Amano , Yoshinori Takasaki
Inventor： Toru Nakai , Tetsuo Amano , Yoshinori Takasaki
IPC: H05K1/03
CPC classification number: H05K3/108 , H05K1/0373 , H05K3/4673 , H05K2201/0209 , H05K2203/107
Abstract: A wiring board includes an insulation layer containing a resin and a silica-type filler and having a roughened surface, and a conductive layer formed on the roughened surface of the insulation layer and having a first conductive portion and a second conductive portion positioned adjacent to the first conductive portion. The roughened surface of the insulation layer has a roughness under the first conductive portion, a roughness under the second conductive portion, and a roughness between the first conductive portion and the second conductive portion, and the roughness between the first conductive portion and the second conductive portion is set less than at least one of the roughness under the first conductive portion and the roughness under the second conductive portion.
Abstract translation: 布线基板包括含有树脂的绝缘层和具有粗糙表面的二氧化硅型填料，以及形成在绝缘层的粗糙化表面上的导电层，并且具有第一导电部分和与第二导电部分相邻的第二导电部分 第一导电部分。 绝缘层的粗糙表面在第一导电部分下方具有粗糙度，第二导电部分下方的粗糙度，以及第一导电部分和第二导电部分之间的粗糙度，以及第一导电部分和第二导电部分之间的粗糙度 部分被设定为小于第一导电部分下的粗糙度和第二导电部分下方的粗糙度中的至少一个。
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公开(公告)号：US20110240358A1
公开(公告)日：2011-10-06
申请号：US12981709
申请日：2010-12-30
Applicant: Toru NAKAI , Tetsuo AMANO , Yoshinori TAKASAKI
Inventor： Toru NAKAI , Tetsuo AMANO , Yoshinori TAKASAKI
CPC classification number: H05K3/108 , H05K1/0373 , H05K3/4673 , H05K2201/0209 , H05K2203/107
Abstract: A wiring board includes an insulation layer containing a resin and a silica-type filler and having a roughened surface, and a conductive layer formed on the roughened surface of the insulation layer and having a first conductive portion and a second conductive portion positioned adjacent to the first conductive portion. The roughened surface of the insulation layer has a roughness under the first conductive portion, a roughness under the second conductive portion, and a roughness between the first conductive portion and the second conductive portion, and the roughness between the first conductive portion and the second conductive portion is set less than at least one of the roughness under the first conductive portion and the roughness under the second conductive portion.
Abstract translation: 布线基板包括含有树脂的绝缘层和具有粗糙表面的二氧化硅型填料，以及形成在绝缘层的粗糙化表面上的导电层，并且具有第一导电部分和与第二导电部分相邻的第二导电部分 第一导电部分。 绝缘层的粗糙表面在第一导电部分下方具有粗糙度，第二导电部分下方的粗糙度，以及第一导电部分和第二导电部分之间的粗糙度，以及第一导电部分和第二导电部分之间的粗糙度 部分被设定为小于第一导电部分下的粗糙度和第二导电部分下方的粗糙度中的至少一个。
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公开(公告)号：US20130075140A1
公开(公告)日：2013-03-28
申请号：US13534041
申请日：2012-06-27
Applicant: Tetsuo AMANO , Toshio NISHIWAKI
Inventor： Tetsuo AMANO , Toshio NISHIWAKI
CPC classification number: H05K3/4602 , H05K1/024 , H05K3/4655 , H05K2201/068 , H05K2201/096
Abstract: A printed wiring board includes a core insulation layer having via conductors through the core layer, a first structure including an interlayer insulation layer on first surface of the core layer and having via conductors through the interlayer layer in the first structure, and a second structure including an interlayer insulation layer on second surface of the core layer and having via conductors through the interlayer layer in the second structure. The interlayer layers have dielectric constants set to be 4.0 or lower for signal transmission at frequency of 1 GHz, the core layer has thermal expansion coefficient at or below Tg set lower than thermal expansion coefficients of the interlayer layers at or below Tg, the coefficient of the core layer at or below Tg is set to be 75 ppm/° C. or lower, and the conductors in the interlayer layers are stacked on the conductors in the core layer.
Abstract translation: 一种印刷电路板包括具有穿过芯层的通孔导体的芯绝缘层，在芯层的第一表面上包括层间绝缘层并且具有穿过第一结构中的层间层的通路导体的第一结构，以及包括 在芯层的第二表面上的层间绝缘层，并且在第二结构中具有穿过层间层的通孔导体。 层间层的介电常数设定为4.0或更低，用于1GHz频率的信号传输，核心层的热膨胀系数低于或等于Tg设定为低于Tg或以下的中间层的热膨胀系数，系数 将Tg处于或低于Tg的芯层设定为75ppm /℃或更低，并且层间层中的导体堆叠在芯层中的导体上。
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公开(公告)号：US20110300307A1
公开(公告)日：2011-12-08
申请号：US13150744
申请日：2011-06-01
Applicant: Toru NAKAI , Tetsuo Amano , Atsushi Kamano , Yoshinori Takasaki
Inventor： Toru NAKAI , Tetsuo Amano , Atsushi Kamano , Yoshinori Takasaki
CPC classification number: H05K3/0035 , B23K26/40 , B23K2101/42 , B23K2103/172 , B23K2103/42 , B23K2103/50 , H05K1/0373 , H05K2201/0209
Abstract: A method for manufacturing a wiring board includes forming a conductive pattern on an insulation layer, forming on the conductive pattern a resin insulation layer containing a resin and a silica-type filler, and irradiating a laser beam having an absorption rate with respect to the conductive pattern is in an approximate range of 30˜60% such that an opening portion reaching the conductive pattern is formed through the resin insulation layer. The silica-type filler in the resin insulation layer is in an amount of approximately 2˜60 wt. %.
Abstract translation: 一种布线基板的制造方法，其特征在于，在绝缘层上形成导电图案，在导电图案上形成含有树脂和二氧化硅型填料的树脂绝缘层，照射具有吸收率的导体 图案在30〜60％的近似范围内，使得到达导电图案的开口部分通过树脂绝缘层形成。 树脂绝缘层中的二氧化硅型填料的量约为2〜60重量％。 ％。
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