公开(公告)号：US20060114656A1

公开(公告)日：2006-06-01

申请号：US11335347

申请日：2006-01-18

Applicant: Timothy Takeuchi

Inventor： Timothy Takeuchi

IPC: H05K7/20

CPC classification number: H01L23/051 ,  H01L23/3675 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00

Abstract: A semiconductor package substrate has top and bottom surface buildup layers disposed on a thermally conductive substrate core. A portion of the substrate core may be exposed at a top surface of the package substrate to allow a heat spreader to be thermally coupled to the substrate core. An integrated circuit may be mounted on a top surface of the package substrate, with a top surface of the integrated circuit facing down. A heat spreader may be attached to the package substrate. The heat spreader may be thermally coupled to the substrate core and to a backside surface of the integrated circuit.

公开(公告)号：US20050218528A1

公开(公告)日：2005-10-06

申请号：US10815564

申请日：2004-03-31

Applicant: John Beatty ,  Timothy Takeuchi

Inventor： John Beatty ,  Timothy Takeuchi

IPC: H01L21/48 ,  H01L21/56 ,  H01L23/13 ,  H01L23/498 ,  H01L29/40 ,  H05K3/28 ,  H05K3/30

CPC classification number: H01L23/49816 ,  H01L21/563 ,  H01L23/13 ,  H01L24/28 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/09063 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/0126 ,  Y02P70/613 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An interposer, between a die and a substrate, has a body with a first surface, an opposite second surface, and a channel that passes from the first surface, through the body to the opposite second surface.

Abstract translation: 芯片和基板之间的插入件具有带有第一表面，相对的第二表面的主体以及从第一表面穿过主体到相对的第二表面的通道。

公开(公告)号：US20060214313A1

公开(公告)日：2006-09-28

申请号：US11089050

申请日：2005-03-24

Applicant: Ruel Pieda ,  Carmelito Libay ,  Andrew Gomez ,  Sandeep Sane ,  Timothy Takeuchi

Inventor： Ruel Pieda ,  Carmelito Libay ,  Andrew Gomez ,  Sandeep Sane ,  Timothy Takeuchi

IPC: H01L23/28

CPC classification number: H01L24/83 ,  H01L23/3121 ,  H01L24/32 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8385 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method for packaging a die includes attaching the die to a substrate using a plurality of pieces of discontinuous die attach material, and injecting a mold compound at the interface between the die and the substrate.

Abstract translation: 包装模具的方法包括使用多个不连续的芯片附着材料将模具附着到基板上，以及在模具和基板之间的界面处注入模具化合物。

公开(公告)号：US20060060845A1

公开(公告)日：2006-03-23

申请号：US10946262

申请日：2004-09-20

Applicant: Narahari Ramanuja ,  Florence Pon ,  Timothy Takeuchi

Inventor： Narahari Ramanuja ,  Florence Pon ,  Timothy Takeuchi

IPC: H01L29/10

CPC classification number: H01L23/481 ,  H01L22/32 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2225/06562 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/14

Abstract: A semiconductor device having a conductive layer above a dielectric layer and a top metal layer. The conductive layer is patterned to form an alternate probe area to test the functionality of active circuitry within the semiconductor device and patterned to electrically route a thru semiconductor via within the semiconductor device to an alternate junction point.

Abstract translation: 一种在电介质层上方具有导电层和顶部金属层的半导体器件。 将导电层图案化以形成替代的探针区域，以测试半导体器件内的有源电路的功能，并将其图案化以将半导体器件内的通过半导体通路电气路由到另一连接点。