公开(公告)号：US5825625A

公开(公告)日：1998-10-20

申请号：US728394

申请日：1996-10-09

Applicant: Dennis R. Esterberg ,  Mark A. Smith ,  Paul A. Rubens ,  Tracy A. Lang

Inventor： Dennis R. Esterberg ,  Mark A. Smith ,  Paul A. Rubens ,  Tracy A. Lang

IPC: H01L23/36 ,  H01L23/367 ,  H01L23/40 ,  H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L23/4006 ,  H01L24/50 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2924/07802 ,  H01L2924/14 ,  H05K2201/09054 ,  H05K2201/10409 ,  H05K2201/10416 ,  H05K2201/10681 ,  H05K2203/0191

Abstract: A heat conductive substrate is mounted within a through-opening of a printed circuit board. An integrated circuit then is mounted to one side of the heat conductive substrate, while a heat sink is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board. The substrate is mounted to an undersurface of the PC board and concentrically spaced from the PC board within the opening. An air gap occurs between the substrate and the PC board within the opening to substantially reduce heat conductivity into the PC board.

Abstract translation: 导热基板安装在印刷电路板的通孔内。 然后将集成电路安装到导热基板的一侧，同时将散热器固定成与基板的另一侧热接触。 IC和PC板之间没有直接的热接触。 基板被安装到PC板的下表面并与开口内的PC板同心地间隔开。 在开口之间的衬底和PC板之间产生气隙，以大大降低PC板的导热性。

公开(公告)号：US06807665B2

公开(公告)日：2004-10-19

申请号：US09766007

申请日：2001-01-18

Applicant: Tracy J Evans ,  Dale R Magnuson ,  Derek J Whiteside ,  Susan L Wechsler ,  Tracy A Lang ,  Richard Hollon, Jr. ,  Daniel L Severns ,  Mammie C Lee

Inventor： Tracy J Evans ,  Dale R Magnuson ,  Derek J Whiteside ,  Susan L Wechsler ,  Tracy A Lang ,  Richard Hollon, Jr. ,  Daniel L Severns ,  Mammie C Lee

IPC: G06F9445

CPC classification number: G06F8/64 ,  G06F8/63

Abstract: A manufacturer installs software by first partitioning storage media of the computing system into a first partition and a second partition. The manufacturer installs software bundles Into the second partition. Each software bundle is stored in form as an image. The manufacturer also installs bootable software and a user interface into the first partition. The bootable software and the user interface when run, operate to receive from a user a selection as to which of the software bundles to install in the computing system. The software bundle selected by the user is installed into the first partition while overwriting the bootable software and the user interface. After installation of the software bundle selected by the user, the bootable software, for example, can erase the installation software bundles in the second partition. This is done, for example, by overwriting the second partition with a blank file system.

Abstract translation: 制造商通过首先将计算系统的存储介质划分成第一分区和第二分区来安装软件。 制造商将软件包安装到第二个分区。 每个软件包都以图像形式存储。 制造商还将可引导软件和用户界面安装到第一个分区中。 可启动软件和用户界面运行时，操作以从用户接收关于在计算系统中安装哪个软件包的选择。 在覆盖可引导软件和用户界面的同时，将用户选择的软件包安装到第一个分区中。 在安装了用户选择的软件包之后，可引导软件可以擦除第二个分区中的安装软件包。 这是通过例如用空白文件系统覆盖第二个分区来完成的。