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公开(公告)号：US20170292025A1
公开(公告)日：2017-10-12
申请号：US15092819
申请日：2016-04-07
Inventor： YU-CHIA CHEN , CHING-I CHOU
IPC: C09D5/00 , C23C26/00 , C09D201/04 , C09K5/14 , C09D7/12
CPC classification number: C09D5/00 , C08K3/013 , C08K3/04 , C08K3/20 , C08K3/28 , C08K13/02 , C08K2201/001 , C09D7/61 , C09D7/65 , C09D201/04 , C09K5/14 , C23C26/00
Abstract: A manufacturing method for a heat-dissipating coating includes steps as: a) providing a gluey liquid mixed by a first solution and a compound substance at a weight ratio of 1:0.6 to 1:1.4; the compound substance is selected from a group consisting of fluorocarbon resin, fluororesin, acrylic acid resin, polyurethane, polyurea resin, unsaturated polyester, epoxide, and mixtures thereof; b) providing a filler material mixed by a second solution and a filler substance at a weight ratio of 1:0.3 to 1:0.8 and another weight ratio of the compound substance to the filler substance being 1:0.1 to 1:0.6; the filler substance is selected from a group consisting of bamboo charcoal, carbon nanotube, graphite, graphene platelets, graphene, carbon spheres, carbon fibers, BN, AlN, mica, SiO2, TiO2, SiC, ZnO, GeO2, and mixtures thereof; c) mixing the gluey liquid and the filler material to produce a heat-dissipating material, so as to form a heat-dissipating coating.
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公开(公告)号：US11020884B2
公开(公告)日：2021-06-01
申请号：US16537740
申请日：2019-08-12
Inventor： Ching-I Chou , Yu-Chia Chen
IPC: B29C43/34 , C09J127/06 , C09J123/06 , C09J175/04 , C09J163/00 , C09J131/04 , C09J195/00 , C09J133/12 , C09J133/24 , B29K307/04
Abstract: A solid thermal balancing composite material with lightweight is formed by a reinforced composite material pressured by a molding machine after going through a powder filling equipment. The reinforced composite material is a mixture of inorganic filler powders and polymer adhesives after granulation. The specific gravity of the solid thermal balancing composite material is no greater than 2.0. In addition, the present invention is adjustable in different shapes for various applications of heat dissipation.
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公开(公告)号：US20170292027A1
公开(公告)日：2017-10-12
申请号：US15092867
申请日：2016-04-07
Inventor： YU-CHIA CHEN , CHING-I CHOU
IPC: C09D5/26 , B32B15/082 , B32B15/095 , C09D201/04 , B32B15/20 , C09K5/10 , C09D7/12 , B05D1/00 , B32B15/09
CPC classification number: C09D201/04 , B32B15/082 , B32B15/09 , B32B15/095 , B32B15/20 , B32B2307/302 , B32B2457/00 , C08K3/04 , C09D5/00 , C09D5/24 , C09D7/61 , C09K5/10
Abstract: A manufacturing method for a thermal balancing conductive coating includes steps as: a) providing gluey liquid mixed by a first solution and a compound substance with a weight ratio ranging from 1:0.6 to 1:1.4; the compound substance is selected from a group consisting of fluorocarbon resin, fluororesin, acrylic acid resin, polyurethane, polyurea resin, unsaturated polyester, silicon resin, and mixtures thereof; b) providing a filler material mixed by a second solution and a filler substance with a weight ratio ranging from 1:0.1 to 1:0.6 and another weight ratio of the compound substance to the filler substance from 1:0.3 to 1:0.8; the filler substance includes a main ingredient selected from a group consisting of graphite, graphene platelets, graphene, graphite fiber, graphene fiber, BN, mica, and mixtures thereof; c)mixing the gluey liquid and the filler material to produce a thermal balancing conductive material, so as to form a thermal balancing conductive coating.
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4.发明申请公开(公告)号：US20180281244A1
公开(公告)日：2018-10-04
申请号：US15474173
申请日：2017-03-30
Inventor： CHING-I CHOU , YU-CHIA CHEN
Abstract: A solid thermal balancing composite material with lightweight is formed by a reinforced composite material pressured by a molding machine after going through a powder filling equipment. The reinforced composite material is a mixture of inorganic filler powders and polymer adhesives after granulation. The specific gravity of the solid thermal balancing composite material is no greater than 2.0. In addition, the present invention is adjustable in different shapes for various applications in heat dissipation.
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