公开(公告)号：US08110751B2

公开(公告)日：2012-02-07

申请号：US12411847

申请日：2009-03-26

Applicant: Dong You Kim ,  Yong Tae Kyeon ,  Ja Yong Ku

Inventor： Dong You Kim ,  Yong Tae Kyeon ,  Ja Yong Ku

IPC: H05K1/11

CPC classification number: H05K1/117 ,  H05K1/0298 ,  H05K3/403 ,  H05K2201/09172 ,  H05K2201/0919

Abstract: The present invention relates to a semiconductor memory module and an electronic component socket for coupling with the same. A printed circuit board of the semiconductor memory module includes three signal pad arrays longitudinally formed in a row on one sides of a first surface, a second surface and a third surface thereof. Each signal pad array includes a plurality of signal pads. An electronic component socket for coupling with the printed circuit board includes thee pin arrays. Thus, an increased number of the signal pads can be provided while retaining the size of the memory module and the electronic component socket.

Abstract translation: 本发明涉及半导体存储器模块和与其耦合的电子元件插座。 半导体存储器模块的印刷电路板包括在第一表面，第二表面和第三表面的一侧纵向形成为一排的三个信号垫阵列。 每个信号焊盘阵列包括多个信号焊盘。 用于与印刷电路板耦合的电子元件插座包括引脚阵列。 因此，可以在保持存储器模块和电子部件插座的尺寸的同时提供增加数量的信号焊盘。

公开(公告)号：US20100243308A1

公开(公告)日：2010-09-30

申请号：US12411847

申请日：2009-03-26

Applicant: DONG YOU KIM ,  Yong Tae Kyeon ,  Ja Yong Ku

Inventor： DONG YOU KIM ,  Yong Tae Kyeon ,  Ja Yong Ku

IPC: H05K1/11 ,  H05K1/00

CPC classification number: H05K1/117 ,  H05K1/0298 ,  H05K3/403 ,  H05K2201/09172 ,  H05K2201/0919

Abstract: The present invention relates to a semiconductor memory module and an electronic component socket for coupling with the same. A printed circuit board of the semiconductor memory module includes three signal pad arrays longitudinally formed in a row on one sides of a first surface, a second surface and a third surface thereof. Each signal pad array includes a plurality of signal pads. An electronic component socket for coupling with the printed circuit board includes thee pin arrays. Thus, an increased number of the signal pads can be provided while retaining the size of the memory module and the electronic component socket.

Abstract translation: 本发明涉及半导体存储器模块和与其耦合的电子元件插座。 半导体存储器模块的印刷电路板包括在第一表面，第二表面和第三表面的一侧纵向形成为一排的三个信号垫阵列。 每个信号焊盘阵列包括多个信号焊盘。 用于与印刷电路板耦合的电子元件插座包括引脚阵列。 因此，可以在保持存储器模块和电子部件插座的尺寸的同时提供增加数量的信号焊盘。