公开(公告)号：US11680138B2

公开(公告)日：2023-06-20

申请号：US17114988

申请日：2020-12-08

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Kuan-Wei Lee ,  Szu-Hsiang Su ,  Shou-Jui Hsiang ,  Pei-Jung Wu ,  Wei-Hsin Huang

IPC: C08G69/26 ,  C08L67/03 ,  C08G69/32 ,  C08J3/09 ,  C08J3/11 ,  C08J5/18

CPC classification number: C08G69/265 ,  C08G69/32 ,  C08J3/096 ,  C08J3/11 ,  C08J5/18 ,  C08L67/03 ,  C08K2201/005 ,  C08L2201/56 ,  C08L2203/16 ,  C08L2203/20 ,  C08L2205/12 ,  C08L2312/00

Abstract: A polymer dispersion is disclosed. The polymer dispersion includes a liquid crystal polymer powder, a polyamide acid, and a solvent. A solid content of the polymer dispersion includes the liquid crystal polymer powder and the polyamide acid. The liquid crystal polymer powder has a mass ratio of 20% to 30% in the solid content. The polyamide acid has a mass ratio of 70% to 80% in the solid content. The polyamide acid is obtained by mixing two kinds of diamines and two kinds of dianhydrides together, causing the diamines and the dianhydrides to be polymerized with each other. Both two kinds of diamines and two kinds of dianhydrides comprise a liquid crystal structure and a flexible structure respectively. A method of preparing the polymer dispersion, and a method for preparing a polymer composite film using the polymer dispersion are also disclosed.

公开(公告)号：US11524491B2

公开(公告)日：2022-12-13

申请号：US17107787

申请日：2020-11-30

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Wei-Hsin Huang ,  Chi-Fei Huang ,  Szu-Hsiang Su ,  Shou-Jui Hsiang ,  Kuan-Wei Lee

IPC: B32B27/28 ,  B29C53/56 ,  B32B37/02 ,  B29C53/00 ,  B29C53/16 ,  B32B38/10 ,  B32B38/00 ,  B32B37/20 ,  B29K105/00 ,  C08G73/10 ,  B29K79/00 ,  C08G69/32

Abstract: A method for manufacturing a thick polyimide film includes providing a first and second laminated structures. The first and second laminated structures are heated, and the heated first and second laminated structures are wound together to form a third laminated structure. The first polyamic acid gel film of the heated first laminated structure and the second polyamic acid gel film of the heated second laminated structure are overlapped and bonded together to form a third polyamic acid gel film. Two third laminated structures are wound together to form a fourth polyamic acid gel film. A dehydration ring-closure imidization reaction is applied to the fourth polyamic acid gel film by heating to obtain the thick polyimide film. A thick polyimide film manufactured by the method is also disclosed.

公开(公告)号：US20220002490A1

公开(公告)日：2022-01-06

申请号：US16990148

申请日：2020-08-11

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： KUAN-WEI LEE ,  SZU-HSIANG SU ,  SHOU-JUI HSIANG ,  PEI-JUNG WU ,  WEI-HSIN HUANG

IPC: C08G73/10 ,  C08J5/18

Abstract: A polyimide component being transparent includes a dianhydride monomer and a diamine monomer. The dianhydride monomer has an asymmetric structure. The dianhydride monomer has at least one first polar group and at least one side chain group. The first polar group is an ester group. A molecular structural formula of the side chain group is: The diamine monomer has an asymmetric structure and at least one second polar group. The second polar group is at least one of a nitrogen heterocycle and an ether group. The polyimide component is polymerized by the dianhydride monomer and the diamine monomer. The disclosure also relates to a polyimide film and a polyimide copper clad laminate.

公开(公告)号：US20180265699A1

公开(公告)日：2018-09-20

申请号：US15871141

申请日：2018-01-15

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： SZU-HSIANG SU ,  SHOU-JUI HSIANG ,  MAO-FENG HSU ,  MING-JAAN HO

IPC: C08L79/08 ,  C08L51/08 ,  C08L51/00 ,  C08J3/24 ,  H05K1/03

CPC classification number: C08L79/08 ,  C08J3/246 ,  C08J5/18 ,  C08J2351/00 ,  C08J2351/04 ,  C08J2351/06 ,  C08J2351/08 ,  C08J2379/08 ,  C08J2447/00 ,  C08J2463/00 ,  C08J2471/12 ,  C08L51/003 ,  C08L51/006 ,  C08L51/08 ,  C08L2203/20 ,  C08L2205/03 ,  C08L2312/00 ,  H05K1/0373 ,  H05K3/386 ,  H05K2201/0104 ,  H05K2201/0154 ,  C08L71/12 ,  C08L51/04

Abstract: A low dielectric resin composition comprises a low dielectric resin containing acid anhydride, an epoxy resin, a rigid cross-linking agent, a soft cross-linking agent, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained. A film and a circuit board using such resin composition are also provided.

公开(公告)号：US20180223048A1

公开(公告)日：2018-08-09

申请号：US15686232

申请日：2017-08-25

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： MAO-FENG HSU ,  SHOU-JUI HSIANG ,  SZU-HSIANG SU ,  YU-WEN KAO ,  CHIA-YIN TENG ,  MING-JAAN HO ,  YAO-YI CHENG ,  HSIN-MIN HSIAO

IPC: C08G81/02 ,  C09D179/08 ,  C03C17/32 ,  H05K1/03 ,  H05K3/22 ,  H05K1/02

CPC classification number: C08G81/024 ,  C03C17/32 ,  C03C2218/32 ,  C08G73/1014 ,  C08G73/1039 ,  C08G73/105 ,  C08G73/1071 ,  C09D179/08 ,  H05K1/024 ,  H05K1/0326 ,  H05K1/034 ,  H05K1/0393 ,  H05K3/22 ,  H05K2201/0158 ,  H05K2203/0759

Abstract: A resin composition having lower dielectric constant Dk, lower dielectric loss Df, lower water absorption, higher surface impedance, and higher glass transition temperature includes resins. The resins have a chemical structure selected from a group consisting of or any combination thereof.

公开(公告)号：US20180188649A1

公开(公告)日：2018-07-05

申请号：US15691282

申请日：2017-08-30

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： CHEN-FENG YEN ,  CHANG-HUNG LEE ,  YI-FANG LIN ,  YEN-CHIN HSIAO ,  SHOU-JUI HSIANG ,  MAO-FENG HSU

IPC: G03F7/029 ,  H05K1/03

Abstract: A non-toxic water soluble photosensitive resin composition able to function as a solder mask coating comprises a polymer containing oxazolinyl, a photosensitive monomer, and a photo-initiator. These elements are all water soluble or water dispersible. The polymer containing oxazolinyl and the photosensitive monomer have a plurality of carbon-carbon double bonds. The polymer containing oxazolinyl and the photosensitive monomer are polymerized to form a dense cross-linking network structure when the water soluble photosensitive resin composition is exposed to ultraviolet radiation. A film using the water soluble photosensitive resin composition is also provided.

公开(公告)号：US10012454B2

公开(公告)日：2018-07-03

申请号：US14691258

申请日：2015-04-20

Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. ,  Zhen Ding Technology Co., Ltd.

Inventor： Xian-Qin Hu ,  Fu-Yun Shen ,  Ming-Jaan Ho

IPC: F28F21/08 ,  F28F3/04 ,  F28D15/02

CPC classification number: F28F21/085 ,  F28D15/02 ,  F28F3/048 ,  F28F2275/025

Abstract: A heat dissipation device includes a first copper sheet and a second copper sheet. The first copper sheet includes a number of first recesses and the second copper sheet includes a number of corresponding second recesses. The second copper sheet is fixed on the first copper sheet and an airtight receiving cavity is formed by each first recess and each the second recess, a working fluid in the airtight receiving cavity carries unwanted heat away.

公开(公告)号：US09992873B2

公开(公告)日：2018-06-05

申请号：US14967907

申请日：2015-12-14

Applicant: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  FuKui Precision Component (Shenzhen) Co., Ltd. ,  Zhen Ding Technology Co., Ltd.

Inventor： Yu-Cheng Huang

IPC: H05K3/02 ,  H05K1/18 ,  H05K1/02 ,  H05K3/00 ,  H05K3/30 ,  H05K3/46 ,  H05K3/04 ,  H05K3/20 ,  H05K3/06

CPC classification number: H05K1/181 ,  H05K1/0298 ,  H05K3/0038 ,  H05K3/0058 ,  H05K3/007 ,  H05K3/045 ,  H05K3/06 ,  H05K3/20 ,  H05K3/303 ,  H05K3/46 ,  H05K2203/025

Abstract: A circuit board includes a dielectric layer, a first circuit layer, a second circuit layer and at least an electrically conductive pole. The dielectric layer includes a first side and a second side opposite to the first side. The first circuit layer is located at the first side of the dielectric layer, and includes a plurality of spaced first circuit patterns embedded into the dielectric layer. The second circuit layer is located at the second side of the dielectric layer, and includes a plurality of spaced second circuit patterns located outsides the dielectric layer. The electrically conductive pole electrically couples the first circuit layer to the second circuit layer. Each of the first circuit patterns has an extension direction from the first side toward the second side, and has widths thereof gradually decreasing along the extension direction. A method for manufacturing the circuit board is also provided.

公开(公告)号：US09905508B2

公开(公告)日：2018-02-27

申请号：US15693198

申请日：2017-08-31

Applicant: Qi Ding Technology Qinhuangdao Co., Ltd. ,  Zhen Ding Technology Co., Ltd.

Inventor： Wei-Shuo Su

IPC: H01L23/498 ,  H01L21/48 ,  H01L41/047 ,  H01L23/00

CPC classification number: H01L23/4985 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49866 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L41/0475 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/92125 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A chip packaging structure includes a flexible circuit board, a first built-up structure, a second built-up structure, and a first solder resist layer. The flexible circuit board defines a bent area and a laminated area. The flexible circuit board includes a first dielectric layer. The first dielectric layer includes a first conductive pattern, a bearing layer opposite to the first conductive pattern and corresponding to the laminated area. The first built-up structure is located on the first conductive pattern and corresponds to the laminated area, and includes a second dielectric layer and a second conductive pattern electrically connected with the first conductive pattern. The second built-up structure is located on the bearing layer and corresponds to the laminated area, and includes a third dielectric layer and a third conductive pattern electrically connected with the first conductive pattern. The first solder resist layer covers the second conductive pattern.

公开(公告)号：US20170369747A1

公开(公告)日：2017-12-28

申请号：US15231723

申请日：2016-08-08

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： SZU-HSIANG SU ,  KUO-SHENG LIANG ,  SHOU-JUI HSIANG ,  HONG-PING LIN

IPC: C09J109/06 ,  B32B27/30 ,  B32B27/18 ,  C09J1/00 ,  C09J7/02 ,  H05K1/03 ,  C08L9/06

CPC classification number: C09J109/06 ,  B32B27/18 ,  B32B27/302 ,  B32B2264/102 ,  B32B2405/00 ,  B32B2457/08 ,  C08L9/06 ,  C08L53/02 ,  C08L2201/02 ,  C08L2203/162 ,  C08L2203/206 ,  C08L2207/324 ,  C09J1/00 ,  C09J153/02 ,  C09J2203/326 ,  C09J2205/114 ,  H05K1/0373 ,  H05K3/386 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0209 ,  C08L9/00 ,  C08K5/541

Abstract: A resin composition for a PCB includes a styrene-butadiene-styrene block copolymer in an amount from 95 to 100 parts by weight, a modified porous spheres of silicon oxide in an amount from 1 to 50 parts by weight, and a liquid polybutadiene in an amount from 5 to 50 parts by weight. The styrene-butadiene-styrene block copolymer and the liquid polybutadiene both include vinyl groups on the molecular side chains. The modified porous spheres of silicon oxide also include vinyl groups. An adhesive film and a circuit board using the resin composition are also provided.