公开(公告)号：US3711922A

公开(公告)日：1973-01-23

申请号：US3711922D

申请日：1971-03-02

Applicant: AMP INC

Inventor： LEROY BUSLER W ,  ROSS M

IPC: H05K13/04 ,  H01R19/04 ,  H02G15/00

CPC classification number: H05K13/0417 ,  Y10T29/49155 ,  Y10T29/5149 ,  Y10T29/53004 ,  Y10T29/53026 ,  Y10T29/53183

Abstract: An apparatus and method are disclosed for staking or assembling articles into an apertured member and particularly for assembling electrical contacts into a printed circuit board. The contacts are intermittently fed in strip form to a work station whereat they are severed from the strip for individual assembling into the board. The printed circuit board is provided with rows of apertures for receiving the contacts and the board is indexed either manually or automatically to successively move apertures into position at the work station for receiving a contact.

Abstract translation: 公开了一种用于将物品放入或组装到有孔构件中并且特别用于将电触头组装到印刷电路板中的装置和方法。 接触件以带状形式间歇地进给到工作站，在那里它们被从条带上切断以便单独组装到板中。 印刷电路板设置有用于接收触点的一排孔，并且板被手动或自动地分度，以连续地将孔移动到工作站处的位置以接收接触。

公开(公告)号：US3785035A

公开(公告)日：1974-01-15

申请号：US3785035D

申请日：1969-02-12

Applicant: AMP INC

Inventor： BUSLER W ,  ROSS M ,  SCHWARTZER T

IPC: B65G47/14 ,  H01R12/58 ,  H05K3/34 ,  H05K13/04 ,  H05K3/00

CPC classification number: H05K13/0478 ,  H01R12/58 ,  H05K3/3447 ,  H05K2201/10401 ,  H05K2201/10916 ,  Y10T29/53174 ,  Y10T29/53252 ,  Y10T29/53261

Abstract: Liners are inserted into holes in printed circuit boards by means of a templet having holes therein at locations corresponding to the holes in the printed circuit board. An excess of liners are placed on top of the templet and the templet is vibrated until one liner enters each hole in the templet. Thereafter, the templet is placed on top of the printed circuit board and the individual liners are punched from the templet holes into the printed circuit board holes.

Abstract translation: 衬垫通过在印刷电路板中与孔对应的位置处的孔中插入印刷电路板的孔中。 将多余的衬垫放置在寺庙的顶部，并且寺庙被振动，直到一个衬垫进入寺庙的每个孔。 此后，将镜片放置在印刷电路板的顶部，并将各个衬垫从镜孔穿入印刷电路板孔。