公开(公告)号：US3785035A

公开(公告)日：1974-01-15

申请号：US3785035D

申请日：1969-02-12

Applicant: AMP INC

Inventor： BUSLER W ,  ROSS M ,  SCHWARTZER T

IPC: B65G47/14 ,  H01R12/58 ,  H05K3/34 ,  H05K13/04 ,  H05K3/00

CPC classification number: H05K13/0478 ,  H01R12/58 ,  H05K3/3447 ,  H05K2201/10401 ,  H05K2201/10916 ,  Y10T29/53174 ,  Y10T29/53252 ,  Y10T29/53261

Abstract: Liners are inserted into holes in printed circuit boards by means of a templet having holes therein at locations corresponding to the holes in the printed circuit board. An excess of liners are placed on top of the templet and the templet is vibrated until one liner enters each hole in the templet. Thereafter, the templet is placed on top of the printed circuit board and the individual liners are punched from the templet holes into the printed circuit board holes.

Abstract translation: 衬垫通过在印刷电路板中与孔对应的位置处的孔中插入印刷电路板的孔中。 将多余的衬垫放置在寺庙的顶部，并且寺庙被振动，直到一个衬垫进入寺庙的每个孔。 此后，将镜片放置在印刷电路板的顶部，并将各个衬垫从镜孔穿入印刷电路板孔。