公开(公告)号：US20140203425A1

公开(公告)日：2014-07-24

申请号：US14067004

申请日：2013-10-30

Applicant: AMTEK SEMICONDUCTORS CO., LTD.

Inventor： Chien-Ping Huang

IPC: H01L23/34

CPC classification number: H01L23/467 ,  H01L23/3121 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/19105 ,  H01L2924/00014

Abstract: A heat dissipating device includes a semiconductor packaging structure having a stator set and a semiconductor element provided therein, a fan wheel set pivotally connected to the semiconductor packaging structure, and a guiding structure having a guiding channel. The guiding structure receives the semiconductor packaging structure and the fan wheel set. The fan wheel set includes a plurality of blades located above the surface of the semiconductor packaging structure. The stator set and the semiconductor element controls the first blades. The blades extend beyond side surfaces the semiconductor packaging structure and have their sizes increased, such that the airflow volume can be increased without changing the size of the semiconductor packaging structure.

Abstract translation: 散热装置包括具有定子组和设置在其中的半导体元件的半导体封装结构，可枢转地连接到半导体封装结构的风扇叶轮，以及具有引导通道的引导结构。 引导结构接收半导体封装结构和风扇轮组。 风扇轮组包括位于半导体封装结构的表面上方的多个叶片。 定子组和半导体元件控制第一叶片。 刀片延伸超过半导体封装结构的侧表面并且其尺寸增加，使得可以增加气流量而不改变半导体封装结构的尺寸。

公开(公告)号：US09390959B2

公开(公告)日：2016-07-12

申请号：US13860796

申请日：2013-04-11

Applicant: Amtek Semiconductors Co., Ltd.

Inventor： Chien-Ping Huang

IPC: H01L23/52 ,  H01L21/71 ,  H01L23/467 ,  H05K1/02 ,  H05K1/16 ,  H01L23/31 ,  H05K3/28

CPC classification number: H01L23/467 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/4882 ,  H01L21/565 ,  H01L21/71 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0209 ,  H05K1/0272 ,  H05K1/165 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/1009 ,  H01L2924/00014

Abstract: A semiconductor package is provided, including a substrate having a top surface, a bottom surface opposing the top surface, a via communicating the top surface with the bottom surface, and a stator set formed by circuits; an axial tube axially installed in the via of the substrate; a plurality of electronic components mounted on the top surface of the substrate and electrically connected to the substrate; an encapsulant formed on the top surface of the substrate for encapsulating the electronic components and the axial tube; and an impeller axially coupled to the axial tube via the bottom surface of the substrate. In the semiconductor package, the stator set is formed in the substrate by a patterning process. Therefore, the thickness of the semiconductor package is reduced significantly.

Abstract translation: 提供一种半导体封装，包括具有顶表面，与顶表面相对的底表面的衬底，将顶表面与底表面连通的通孔以及由电路形成的定子组; 轴向管轴向安装在基板的通路中; 安装在所述基板的顶表面上并电连接到所述基板的多个电子部件; 形成在所述基板的顶表面上用于封装所述电子部件和所述轴向管的密封剂; 以及经由衬底的底表面轴向联接到轴向管的叶轮。 在半导体封装中，通过图案化工艺在基板中形成定子组。 因此，半导体封装的厚度显着降低。

公开(公告)号：US20140203450A1

公开(公告)日：2014-07-24

申请号：US13860796

申请日：2013-04-11

Applicant: AMTEK SEMICONDUCTORS CO., LTD.

Inventor： Chien-Ping Huang

IPC: H01L23/433 ,  H01L21/71

CPC classification number: H01L23/467 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/4882 ,  H01L21/565 ,  H01L21/71 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0209 ,  H05K1/0272 ,  H05K1/165 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/1009 ,  H01L2924/00014

Abstract: A semiconductor package is provided, including a substrate having a top surface, a bottom surface opposing the top surface, a via communicating the top surface with the bottom surface, and a stator set formed by circuits; an axial tube axially installed in the via of the substrate; a plurality of electronic components mounted on the top surface of the substrate and electrically connected to the substrate; an encapsulant formed on the top surface of the substrate for encapsulating the electronic components and the axial tube; and an impeller axially coupled to the axial tube via the bottom surface of the substrate. In the semiconductor package, the stator set is formed in the substrate by a patterning process. Therefore, the thickness of the semiconductor package is reduced significantly.

Abstract translation: 提供一种半导体封装，包括具有顶表面，与顶表面相对的底表面的衬底，将顶表面与底表面连通的通孔以及由电路形成的定子组; 轴向管轴向安装在基板的通路中; 安装在所述基板的顶表面上并电连接到所述基板的多个电子部件; 形成在所述基板的顶表面上用于封装所述电子部件和所述轴向管的密封剂; 以及经由衬底的底表面轴向联接到轴向管的叶轮。 在半导体封装中，通过图案化工艺在基板中形成定子组。 因此，半导体封装的厚度显着降低。

公开(公告)号：US09679826B2

公开(公告)日：2017-06-13

申请号：US15178632

申请日：2016-06-10

Applicant: Amtek Semiconductors Co., Ltd.

Inventor： Chien-Ping Huang

IPC: H04L21/00 ,  H01L23/467 ,  H01L21/71 ,  H05K1/02 ,  H05K1/16 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/498 ,  H01L23/522 ,  H01L23/31 ,  H05K3/28

CPC classification number: H01L23/467 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/4882 ,  H01L21/565 ,  H01L21/71 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0209 ,  H05K1/0272 ,  H05K1/165 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/1009 ,  H01L2924/00014

Abstract: A semiconductor package is provided, including a substrate having a top surface, a bottom surface opposing the top surface, a via communicating the top surface with the bottom surface, and a stator set formed by circuits; an axial tube axially installed in the via of the substrate; a plurality of electronic components mounted on the top surface of the substrate and electrically connected to the substrate; an encapsulant formed on the top surface of the substrate for encapsulating the electronic components and the axial tube; and an impeller axially coupled to the axial tube via the bottom surface of the substrate. In the semiconductor package, the stator set is formed in the substrate by a patterning process. Therefore, the thickness of the semiconductor package is reduced significantly.

公开(公告)号：US20160284625A1

公开(公告)日：2016-09-29

申请号：US15178632

申请日：2016-06-10

Applicant: Amtek Semiconductors Co., Ltd.

Inventor： Chien-Ping Huang

IPC: H01L23/467 ,  H01L23/522 ,  H01L21/78 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/467 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/4882 ,  H01L21/565 ,  H01L21/71 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0209 ,  H05K1/0272 ,  H05K1/165 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/1009 ,  H01L2924/00014

Abstract: A semiconductor package is provided, including a substrate having a top surface, a bottom surface opposing the top surface, a via communicating the top surface with the bottom surface, and a stator set formed by circuits; an axial tube axially installed in the via of the substrate; a plurality of electronic components mounted on the top surface of the substrate and electrically connected to the substrate; an encapsulant formed on the top surface of the substrate for encapsulating the electronic components and the axial tube; and an impeller axially coupled to the axial tube via the bottom surface of the substrate. In the semiconductor package, the stator set is formed in the substrate by a patterning process. Therefore, the thickness of the semiconductor package is reduced significantly.

Abstract translation: 提供一种半导体封装，包括具有顶表面，与顶表面相对的底表面的衬底，将顶表面与底表面连通的通孔以及由电路形成的定子组; 轴向管轴向安装在基板的通路中; 安装在所述基板的顶表面上并电连接到所述基板的多个电子部件; 形成在所述基板的顶表面上用于封装所述电子部件和所述轴向管的密封剂; 以及经由衬底的底表面轴向联接到轴向管的叶轮。 在半导体封装中，通过图案化工艺在基板中形成定子组。 因此，半导体封装的厚度显着降低。

公开(公告)号：US09252074B2

公开(公告)日：2016-02-02

申请号：US14067004

申请日：2013-10-30

Applicant: Amtek Semiconductors Co., Ltd.

Inventor： Chien-Ping Huang

IPC: H01L23/34 ,  H01L23/467 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/467 ,  H01L23/3121 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/19105 ,  H01L2924/00014

Abstract: A heat dissipating device includes a semiconductor packaging structure having a stator set and a semiconductor element provided therein, a fan wheel set pivotally connected to the semiconductor packaging structure, and a guiding structure having a guiding channel. The guiding structure receives the semiconductor packaging structure and the fan wheel set. The fan wheel set includes a plurality of blades located above the surface of the semiconductor packaging structure. The stator set and the semiconductor element controls the first blades. The blades extend beyond side surfaces the semiconductor packaging structure and have their sizes increased, such that the airflow volume can be increased without changing the size of the semiconductor packaging structure.

Abstract translation: 散热装置包括具有定子组和设置在其中的半导体元件的半导体封装结构，可枢转地连接到半导体封装结构的风扇叶轮，以及具有引导通道的引导结构。 引导结构接收半导体封装结构和风扇轮组。 风扇轮组包括位于半导体封装结构的表面上方的多个叶片。 定子组和半导体元件控制第一叶片。 刀片延伸超过半导体封装结构的侧表面并且其尺寸增加，使得可以增加气流量而不改变半导体封装结构的尺寸。