公开(公告)号：US20220418079A1

公开(公告)日：2022-12-29

申请号：US17358150

申请日：2021-06-25

Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.

Inventor： SHIH-HSI TAI ,  TZE-YANG YEH

IPC: H05K1/02 ,  H05K1/05

Abstract: An insulating metal substrate structure is provided. The insulating metal substrate structure includes an electrically-insulating layer, a plurality of metal layers, a plurality of electrically-insulating heat-conductive layers, and a heat-dissipation layer. The plurality of electrically-insulating heat-conductive layers are formed on the heat-dissipation layer. The electrically-insulating layer surrounds the plurality of metal layers, such that the plurality of metal layers are separated into different regions in a different region to form a predetermined circuit pattern. The electrically-insulating layer has at least one recessed corner structure that is configured to position the electrically-insulating heat-conductive layers filled between one of the metal layers and the heat-dissipation layer.

公开(公告)号：US20220399244A1

公开(公告)日：2022-12-15

申请号：US17343745

申请日：2021-06-10

Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.

Inventor： CHING-MING YANG ,  SHIH-HSI TAI ,  TZE-YANG YEH

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/14

Abstract: A thermally conductive and electrically insulating substrate is provided. The thermally conductive and electrically insulating substrate includes a thermally conductive base, an electrically insulating layer, and one or more metal sheets. The electrically insulating layer is disposed on the thermally conductive base, and the one or more metal sheets are disposed on the electrically insulating layer. The metal sheet is allowed to have one or more chips arranged thereon, and a surface of the metal sheet where the metal sheet is allowed to be engaged with the chip is not parallel to a surface of the electrically insulating layer where the electrically insulating layer is mated with the metal sheet.

公开(公告)号：US20220230932A1

公开(公告)日：2022-07-21

申请号：US17151203

申请日：2021-01-17

Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.

Inventor： SHIH-HSI TAI ,  TZE-YANG YEH

IPC: H01L23/367 ,  H01L25/07 ,  H01L23/00 ,  H01L23/373

Abstract: An IGBT module with a heat dissipation structure having a specific layer thickness ratio includes a layer of IGBT chips, an upper bonding layer, a circuit layer, an insulating layer, and a heat dissipation layer. The insulating layer is disposed on the heat dissipation layer, the circuit layer is disposed on the insulating layer, the upper bonding layer is disposed on the circuit layer, and the layer of IGBT chips is disposed on the upper bonding layer. A thickness of the insulating layer is less than 0.2 mm, a thickness of the circuit layer is between 1.5 mm and 3 mm, and a thickness ratio of the circuit layer to the insulating layer is greater than or equal to 7.5:1.

公开(公告)号：US20230199969A1

公开(公告)日：2023-06-22

申请号：US17552907

申请日：2021-12-16

Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.

Inventor： SHIH-HSI TAI ,  TUNG-HO TAO ,  TZE-YANG YEH

IPC: H05K3/06 ,  H05K1/02

CPC classification number: H05K3/061 ,  H05K1/0207 ,  H05K2201/0166

Abstract: An etching method for manufacturing a substrate structure having a thick electrically conductive layer, and a substrate structure having a thick electrically conductive layer are provided. The etching method includes providing an electrically insulating substrate structure including a thermally conductive and electrically insulating layer, an electrically conductive layer, and a non-photosensitive polymer masking layer, removing one part of the non-photosensitive polymer masking layer and one part of the electrically conductive layer by a machining process to form at least one electrically conductive recess having the electrically conductive layer exposed, forming a predetermined thickness ratio between a thickness of the electrically conductive recess and a thickness of the electrically conductive layer, removing a reserved part of the electrically conductive layer between a bottom wall of the electrically conductive recess and a bottom surface of the electrically conductive layer, and removing a remaining part of the non-photosensitive polymer masking layer.

公开(公告)号：US20230199968A1

公开(公告)日：2023-06-22

申请号：US17552982

申请日：2021-12-16

Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.

Inventor： SHIH-HSI TAI ,  TUNG-HO TAO ,  TZE-YANG YEH

IPC: H05K3/06 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K3/06 ,  H05K1/0201 ,  H05K3/0017 ,  H05K2201/09036 ,  H05K2203/0502

Abstract: A method for forming a pattern on a substrate structure without using a mask layer and a substrate structure are provided. The method includes providing an electrically insulating substrate structure including a thermally conductive and electrically insulating layer, forming at least one electrically conductive recess by removing one part of the electrically conductive layer by a machining process so as to form a predetermined thickness ratio between a thickness of the electrically conductive recess and a thickness of the electrically conductive layer, and removing another part of the electrically conductive layer that is reserved below the electrically conductive recess so that the electrically conductive recess forms an electrically conductive groove.