公开(公告)号：US20230199969A1

公开(公告)日：2023-06-22

申请号：US17552907

申请日：2021-12-16

Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.

Inventor： SHIH-HSI TAI ,  TUNG-HO TAO ,  TZE-YANG YEH

IPC: H05K3/06 ,  H05K1/02

CPC classification number: H05K3/061 ,  H05K1/0207 ,  H05K2201/0166

Abstract: An etching method for manufacturing a substrate structure having a thick electrically conductive layer, and a substrate structure having a thick electrically conductive layer are provided. The etching method includes providing an electrically insulating substrate structure including a thermally conductive and electrically insulating layer, an electrically conductive layer, and a non-photosensitive polymer masking layer, removing one part of the non-photosensitive polymer masking layer and one part of the electrically conductive layer by a machining process to form at least one electrically conductive recess having the electrically conductive layer exposed, forming a predetermined thickness ratio between a thickness of the electrically conductive recess and a thickness of the electrically conductive layer, removing a reserved part of the electrically conductive layer between a bottom wall of the electrically conductive recess and a bottom surface of the electrically conductive layer, and removing a remaining part of the non-photosensitive polymer masking layer.

公开(公告)号：US20230199968A1

公开(公告)日：2023-06-22

申请号：US17552982

申请日：2021-12-16

Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.

Inventor： SHIH-HSI TAI ,  TUNG-HO TAO ,  TZE-YANG YEH

IPC: H05K3/06 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K3/06 ,  H05K1/0201 ,  H05K3/0017 ,  H05K2201/09036 ,  H05K2203/0502

Abstract: A method for forming a pattern on a substrate structure without using a mask layer and a substrate structure are provided. The method includes providing an electrically insulating substrate structure including a thermally conductive and electrically insulating layer, forming at least one electrically conductive recess by removing one part of the electrically conductive layer by a machining process so as to form a predetermined thickness ratio between a thickness of the electrically conductive recess and a thickness of the electrically conductive layer, and removing another part of the electrically conductive layer that is reserved below the electrically conductive recess so that the electrically conductive recess forms an electrically conductive groove.