Abstract:
An implanter provides two-dimensional scanning of a substrate relative to an implant beam so that the beam draws a raster of scan lines on the substrate. The beam current is measured at turnaround points off the substrate and the current value is used to control the subsequent fast scan speed so as to compensate for the effect of any variation in beam current on dose uniformity in the slow scan direction. The scanning may produce a raster of non-intersecting uniformly spaced parallel scan lines and the spacing between the lines is selected to ensure appropriate dose uniformity.
Abstract:
A semiconductor substrate support apparatus comprises a support chuck having at least one chuck manifold extending through the support chuck, and a rotatable shaft coupled to the support chuck. The shaft has at least one shaft conduit disposed therein and extends through the support chuck. A housing circumscribes the shaft and has a housing conduit adapted for connection to a gas source. A plurality of seals are disposed between the shaft and the housing and thereby define a radial passageway between the at least one shaft conduit and the housing conduit for providing a backside gas to a backside of a wafer disposed on the rotating support chuck.
Abstract:
An indirectly heated button cathode for use in the ion source of an ion implanter has a button member formed of a slug piece mounted in a collar piece. The slug piece is thermally insulated from the collar piece to enable it to operate at a higher temperature so that electron emission is enhanced and concentrated over the surface of the slug piece. The slug piece and collar piece can be both of tungsten. Instead the slug piece may be of tantalum to provide a lower thermionic work function. The resultant concentrated plasma in the ion source is effective to enhance the production of higher charge state ions, particularly Pnullnullnull for subsequent acceleration for high energy implantation.
Abstract:
A force compensator is provided for a semiconductor processing apparatus having a moving member, in order to compensate for a fixed force on the moving member, such as gravity or atmospheric pressure. A vacuum and piston combination is connected between the movable member and a reaction point. One side of the piston is open to atmosphere and the other side defines an enclosed region which is evacuated. The cylinder is evacuated to a pressure which does not exceed 10% of ambient pressure during operation of the device, so that pressure changes in the low pressure region have minimal effect on the compensation force during movement of the movable member over its displacement range.