公开(公告)号：US20240369389A1

公开(公告)日：2024-11-07

申请号：US18772701

申请日：2024-07-15

Applicant: APPLIED MATERIALS, INC.

Inventor： Srikanth Krishnamurthy ,  Ming Xu ,  Ashley M. Okada ,  Ramachandra Murthy Gunturi ,  Vijay Parkhe

IPC: G01F1/20 ,  C23C16/40 ,  C23C16/455 ,  H01J37/244 ,  H01J37/32 ,  H01L21/67 ,  H05K3/30

Abstract: A sensor assembly includes a substrate including an outer region, an inner region, and a middle region positioned between the outer region and the inner region, the substrate further including electrical contact pads on at least the inner region. The sensor assembly further includes a housing coupled to the substrate at the outer region to provide a hermetic seal. The sensor assembly further includes a sensor device coupled to the substrate, via the electrical contact pads, at the inner region.

公开(公告)号：US20230313376A1

公开(公告)日：2023-10-05

申请号：US17855031

申请日：2022-06-30

Applicant: APPLIED MATERIALS, INC.

Inventor： Srikanth Krishnamurthy ,  Ming Xu ,  Ashley M. Okada

IPC: C23C16/455

CPC classification number: C23C16/45557 ,  C23C16/45544 ,  C23C16/45504 ,  C23C16/45561

Abstract: Certain embodiments of the present disclosure relate to a sensor assembly including a housing having a first channel configured to flow a gas in a first direction and a second channel configured to flow the gas in a second direction. The housing is configured to couple to a gas flow assembly. A substrate is disposed within the housing. The substrate has an outer region, an inner region within the first channel, and a middle region between the outer region and the inner region. The substrate further includes electrical contact pads on at least the inner region. A sensor die is coupled to the inner region of the substrate, having an electrical connection to the electrical contact pads. The sensor die is disposed within a gas flow path of the first channel.

公开(公告)号：US12061103B2

公开(公告)日：2024-08-13

申请号：US17316622

申请日：2021-05-10

Applicant: APPLIED MATERIALS, INC.

Inventor： Srikanth Krishnamurthy ,  Ming Xu ,  Ashley M. Okada ,  Ramachandra Murthy Gunturi ,  Vijay Parkhe

IPC: G01F1/20 ,  C23C16/40 ,  C23C16/455 ,  H01J37/244 ,  H01J37/32 ,  H01L21/67 ,  H05K3/30

CPC classification number: G01F1/20 ,  C23C16/403 ,  C23C16/45525 ,  H01J37/244 ,  H01J37/32449 ,  H01L21/67253 ,  H05K3/303 ,  H01J2237/24585

Abstract: Disclosed herein are embodiments of a sensor assembly, methods of manufacturing the same, and methods of using the same. In one embodiment, a sensor assembly comprises a substrate comprising an outer region, an inner region, and a middle region positioned between the outer region and the inner region, the substrate further comprising electrical contact pads on at least the inner region. The sensor assembly further comprises a housing coupled to the substrate at the outer region or at the middle region to form a hermetic seal. The sensor assembly further comprises a sensor device coupled to the substrate, via the electrical contact pads, at the inner region. In certain embodiments, the sensor assembly further comprises a conformal coating deposited on at least a portion of the sensor assembly.

公开(公告)号：US20230314197A1

公开(公告)日：2023-10-05

申请号：US17855013

申请日：2022-06-30

Applicant: APPLIED MATERIALS, INC.

Inventor： Arvinder Manmohan Singh Chadha ,  Ashley M. Okada ,  Srikanth Krishnamurthy ,  Ming Xu

IPC: G01F1/688 ,  B81B7/00 ,  B81C1/00

CPC classification number: G01F1/688 ,  B81B7/0058 ,  B81C1/00301 ,  B81B2201/0292 ,  B81B2207/093 ,  B81C2203/035 ,  B81C2203/054 ,  B81C2203/019 ,  B81C2203/036 ,  H01J37/3244

Abstract: Certain embodiments of the present disclosure relate to a sensor assembly including a substrate, a housing, and a sensor die. In certain embodiments, the substrate includes an outer region, an inner region, and a middle region between the outer region and the inner region. In certain embodiments, the substrate includes electrical contact pads on at least the inner region. In certain embodiments, the housing is coupled to the substrate at the middle region or the outer region to provide a hermetic seal. In certain embodiments, the sensor die is coupled to the substrate at the inner region via the electrical contact pads. The sensor die is aligned to the substrate via aligning features that align the sensor die relative to the substrate in at least one of a first plane or a second plane.

公开(公告)号：US20250102074A1

公开(公告)日：2025-03-27

申请号：US18372526

申请日：2023-09-25

Applicant: Applied Materials, Inc.

Inventor： Srikanth Krishnamurthy

IPC: F16K31/40

Abstract: Certain embodiments of the present disclosure relate to a fluid flow valve. The valve includes a housing configured to receive a flow of fluid. The valve further includes a diaphragm to actuate between a closed position and a plurality of open positions. The valve further includes a first valve portion configured to flow a first amount of fluid responsive to the diaphragm actuating to one or more first open positions of the plurality of open positions. The valve further includes a second valve portion in parallel with the first valve portion and configured to flow a second amount of fluid responsive to the diaphragm actuating to one or more second open positions of the plurality of open positions.

公开(公告)号：US20220357187A1

公开(公告)日：2022-11-10

申请号：US17316622

申请日：2021-05-10

Applicant: APPLIED MATERIALS, INC.

Inventor： Srikanth Krishnamurthy ,  Ming Xu ,  Ashley M. Okada ,  Ramachandra Murthy Gunturi ,  Vijay Parkhe

IPC: G01F1/20 ,  H01L21/67 ,  H05K3/30 ,  H01J37/32 ,  H01J37/244 ,  C23C16/40 ,  C23C16/455

Abstract: Disclosed herein are embodiments of a sensor assembly, methods of manufacturing the same, and methods of using the same. In one embodiment, a sensor assembly comprises a substrate comprising an outer region, an inner region, and a middle region positioned between the outer region and the inner region, the substrate further comprising electrical contact pads on at least the inner region. The sensor assembly further comprises a housing coupled to the substrate at the outer region or at the middle region to form a hermetic seal. The sensor assembly further comprises a sensor device coupled to the substrate, via the electrical contact pads, at the inner region. In certain embodiments, the sensor assembly further comprises a conformal coating deposited on at least a portion of the sensor assembly.