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公开(公告)号:US20240369389A1
公开(公告)日:2024-11-07
申请号:US18772701
申请日:2024-07-15
Applicant: APPLIED MATERIALS, INC.
Inventor: Srikanth Krishnamurthy , Ming Xu , Ashley M. Okada , Ramachandra Murthy Gunturi , Vijay Parkhe
IPC: G01F1/20 , C23C16/40 , C23C16/455 , H01J37/244 , H01J37/32 , H01L21/67 , H05K3/30
Abstract: A sensor assembly includes a substrate including an outer region, an inner region, and a middle region positioned between the outer region and the inner region, the substrate further including electrical contact pads on at least the inner region. The sensor assembly further includes a housing coupled to the substrate at the outer region to provide a hermetic seal. The sensor assembly further includes a sensor device coupled to the substrate, via the electrical contact pads, at the inner region.
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公开(公告)号:US12061103B2
公开(公告)日:2024-08-13
申请号:US17316622
申请日:2021-05-10
Applicant: APPLIED MATERIALS, INC.
Inventor: Srikanth Krishnamurthy , Ming Xu , Ashley M. Okada , Ramachandra Murthy Gunturi , Vijay Parkhe
IPC: G01F1/20 , C23C16/40 , C23C16/455 , H01J37/244 , H01J37/32 , H01L21/67 , H05K3/30
CPC classification number: G01F1/20 , C23C16/403 , C23C16/45525 , H01J37/244 , H01J37/32449 , H01L21/67253 , H05K3/303 , H01J2237/24585
Abstract: Disclosed herein are embodiments of a sensor assembly, methods of manufacturing the same, and methods of using the same. In one embodiment, a sensor assembly comprises a substrate comprising an outer region, an inner region, and a middle region positioned between the outer region and the inner region, the substrate further comprising electrical contact pads on at least the inner region. The sensor assembly further comprises a housing coupled to the substrate at the outer region or at the middle region to form a hermetic seal. The sensor assembly further comprises a sensor device coupled to the substrate, via the electrical contact pads, at the inner region. In certain embodiments, the sensor assembly further comprises a conformal coating deposited on at least a portion of the sensor assembly.
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公开(公告)号:US09327252B2
公开(公告)日:2016-05-03
申请号:US13834625
申请日:2013-03-15
Applicant: APPLIED MATERIALS, INC.
Inventor: John W. Lane , Berrin Daran , Ramachandra Murthy Gunturi , Mariusch Gregor , Bhaswan Manjunath , Prashanth Vasudeva
CPC classification number: B01F5/0077 , B01F3/028 , B01F5/0689 , B01F15/0429 , B01F2215/0096
Abstract: Apparatus and system for mixing gas comprising a first valve coupled to a first conduit controlling flow of a first gas, a second valve coupled to a second conduit controlling flow of a second gas, a controller controlling the valves, a base block with a first gas input coupled to the first conduit, a second gas input coupled to the second conduit and an output opening, a mixing chamber formed within the base block, wherein the mixing chamber is coupled to the first gas input and the second gas input to receive input gases, an inner block disposed within the mixing chamber, the inner block including a body with an inner volume and one or more perimeter holes formed through the body coupling the mixing chamber to the inner volume of the inner block; and a gas outlet configured to flow gas through the output opening of the base block.
Abstract translation: 用于混合气体的设备和系统,包括联接到控制第一气体流的第一导管的第一阀,连接到控制第二气体的流动的第二导管的第二阀,控制阀的控制器,具有第一气体的基座 输入,其耦合到第一导管,耦合到第二导管的第二气体输入口和输出开口,形成在基座块内的混合室,其中混合室与第一气体输入端相连,而第二气体输入端接收输入气体 设置在所述混合室内的内部块,所述内部块包括具有内部容积的主体和通过将所述混合室连接到所述内部块的内部容积的本体形成的一个或多个周边孔; 以及气体出口,其构造成使气体流过所述基座的输出开口。
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公开(公告)号:US20220357187A1
公开(公告)日:2022-11-10
申请号:US17316622
申请日:2021-05-10
Applicant: APPLIED MATERIALS, INC.
Inventor: Srikanth Krishnamurthy , Ming Xu , Ashley M. Okada , Ramachandra Murthy Gunturi , Vijay Parkhe
IPC: G01F1/20 , H01L21/67 , H05K3/30 , H01J37/32 , H01J37/244 , C23C16/40 , C23C16/455
Abstract: Disclosed herein are embodiments of a sensor assembly, methods of manufacturing the same, and methods of using the same. In one embodiment, a sensor assembly comprises a substrate comprising an outer region, an inner region, and a middle region positioned between the outer region and the inner region, the substrate further comprising electrical contact pads on at least the inner region. The sensor assembly further comprises a housing coupled to the substrate at the outer region or at the middle region to form a hermetic seal. The sensor assembly further comprises a sensor device coupled to the substrate, via the electrical contact pads, at the inner region. In certain embodiments, the sensor assembly further comprises a conformal coating deposited on at least a portion of the sensor assembly.
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公开(公告)号:US10460960B2
公开(公告)日:2019-10-29
申请号:US15372730
申请日:2016-12-08
Applicant: APPLIED MATERIALS, INC.
Inventor: Ashish Kumar , Vijayakumar Venugopal , Niladri Roy , Ramachandra Murthy Gunturi , Andreas Neuber , Stephen C. Wolgast
IPC: H01L21/67
Abstract: Embodiments of a system, a gas panel and method thereof having reduced exhaust requirements for the delivery of gases include distributing an inert gas in at least one interior portion of the gas panel in which a gas to be delivered by the gas panel is present. Embodiments can further include monitoring for leaks in the interior portion of the gas panel and, in response to a detected leak, increasing the distribution of the inert gas in at least the portion of the gas panel in which the leak was detected. Embodiments may further include exhausting gases out of the gas panel. In such embodiments, in response to a detected leak, a rate of the exhausting of the gases is increased. The gas panel can also be sealed to reduce an amount of gas that leaks out of or air that enters into the gas panel.
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