公开(公告)号：US20170323805A1

公开(公告)日：2017-11-09

申请号：US15662432

申请日：2017-07-28

Applicant: ASAHI GLASS COMPANY, LIMITED

Inventor： Seigo KOTERA ,  Wataru KASAI ,  Masami SUZUKI

IPC: H01L21/56 ,  B32B27/00 ,  C08F290/06 ,  C08G18/48 ,  C08G18/75 ,  C08K9/10 ,  C09J7/02 ,  H01L23/29 ,  B29C33/68 ,  H01L23/433 ,  H01L23/495 ,  H01L27/14 ,  H01L23/31

CPC classification number: H01L21/565 ,  B29C33/68 ,  B32B27/00 ,  B32B27/30 ,  C08F290/067 ,  C08G18/4854 ,  C08G18/6229 ,  C08G18/6262 ,  C08G18/757 ,  C08G18/792 ,  C08G18/8029 ,  C08G2170/40 ,  C08K5/0075 ,  C08K9/10 ,  C08K2201/017 ,  C08L65/00 ,  C09J7/22 ,  C09J7/24 ,  C09J7/38 ,  C09J133/00 ,  C09J133/066 ,  C09J175/04 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/11 ,  C09J2427/006 ,  C09J2433/00 ,  C09J2475/00 ,  H01L21/566 ,  H01L21/568 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49575 ,  H01L27/14 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/26145 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29499 ,  H01L2224/40247 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/83139 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/00014 ,  H01L2224/81 ,  C08K5/43

Abstract: To provide a film which is excellent in releasing property with respect to a resin sealed portion and excellent in low migration property and peeling property with respect to a semiconductor chip, a source electrode or a sealing glass and which is suitable as a mold release film for producing a semiconductor element having a part of the surface of a semiconductor chip, source electrode or sealing glass exposed. A film 1 which comprises a substrate 3 and an adhesive layer 5, wherein the storage elastic modulus at 180° C. of the substrate 3 is from 10 to 100 MPa, and the adhesive layer 5 is a reaction cured product of a composition for adhesive layer comprising a specific acrylic polymer and a polyfunctional isocyanate compound, wherein the number of moles MOH of hydroxy groups and the number of moles MCOOH of carboxy groups, derived from the acrylic polymer, and the number of moles MNCO of isocyanate groups derived from the polyfunctional isocyanate compound, satisfy a specific relation, and which is suitable as a mold release film for producing a semiconductor element.

公开(公告)号：US20160189986A1

公开(公告)日：2016-06-30

申请号：US15061094

申请日：2016-03-04

Applicant: Asahi Glass Company, Limited

Inventor： Wataru KASAI ,  Masami SUZUKI

IPC: H01L21/56 ,  B29C33/68

CPC classification number: H01L21/566 ,  B29C33/68 ,  B29C43/18 ,  B29C47/0021 ,  B29L2031/3406 ,  B32B3/28 ,  B32B7/06 ,  B32B27/322 ,  B32B2307/748 ,  B32B2439/00 ,  H01L21/565 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A mold release film to be disposed on a cavity surface of a mold in a method for producing a semiconductor package wherein a semiconductor element is disposed in the mold and encapsulated with a curable resin to form a resin-encapsulation portion, characterized in that it has a first surface to be in contact with the curable resin at the time of forming the resin-encapsulation portion, and a second surface to be in contact with the cavity surface, at least one of the first surface and the second surface has irregularities formed thereon, and the surface having irregularities formed thereon, has an arithmetic mean roughness (Ra) of from 1.3 to 2.5 μm and a peak count (RPc) of from 80 to 200; and a process for producing a semiconductor package by using the mold release film.

Abstract translation: 一种在半导体封装的制造方法中设置在模具的空腔表面上的脱模膜，其中半导体元件设置在模具中并用可固化树脂包封以形成树脂封装部分，其特征在于，其具有 在形成树脂封装部时与可固化树脂接触的第一表面和与空腔表面接触的第二表面，第一表面和第二表面中的至少一个具有形成在其上的不规则性 ，形成有凹凸的表面的算术平均粗糙度（Ra）为1.3〜2.5μm，峰值计数（RPc）为80〜200; 以及通过使用脱模膜制造半导体封装的方法。

公开(公告)号：US20160189985A1

公开(公告)日：2016-06-30

申请号：US15061044

申请日：2016-03-04

Applicant: Asahi Glass Company, Limited

Inventor： Wataru KASAI ,  Masami SUZUKI

IPC: H01L21/56 ,  C08F214/26 ,  B29C33/68

CPC classification number: H01L21/566 ,  B29C33/68 ,  B29L2031/3406 ,  C08F214/265 ,  C08J5/18 ,  H01L23/3121 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: To provide a mold release film which is excellent in releasability and capable of suppressing contamination of a mold or a resin-encapsulation portion by the mold release film and which is capable of forming a resin-encapsulation portion excellent in adhesion to an ink layer, and a process for producing a semiconductor package using the mold release film. A mold release film to be disposed on a cavity surface of a mold in a method for producing a semiconductor package wherein a semiconductor element is disposed in the mold and encapsulated with a curable resin to form a resin-encapsulation portion, characterized in that it has a first surface to be in contact with the curable resin at the time of forming the resin-encapsulation portion, and a second surface to be in contact with the cavity surface, at least the first surface is made of a fluororesin, and in a specific test method, F/Al is from 0.2 to 4, or F/(C+F+O) is from 0.1 to 0.3.

Abstract translation: 本发明提供一种脱模性优良，能够抑制由脱模膜污染模具或树脂封装部的脱模膜，能够形成与油墨层的粘附性优异的树脂封装部，以及 使用脱模膜制造半导体封装的方法。 一种在半导体封装的制造方法中设置在模具的空腔表面上的脱模膜，其中半导体元件设置在模具中并用可固化树脂包封以形成树脂封装部分，其特征在于，其具有 在形成树脂封装部分时与可固化树脂接触的第一表面和与空腔表面接触的第二表面，至少第一表面由氟树脂制成，并且在具体的 试验方法中，F / Al为0.2〜4，F /（C + F + O）为0.1〜0.3。

公开(公告)号：US20160242274A1

公开(公告)日：2016-08-18

申请号：US15140912

申请日：2016-04-28

Applicant: ASAHI GLASS COMPANY, LIMITED

Inventor： Tomoya HOSODA ,  Eiichi NISHI ,  Toru SASAKI ,  Yasuhiko MATSUOKA ,  Wataru KASAI

IPC: H05K1/02 ,  H05K3/46 ,  C09J127/18 ,  H05K1/03 ,  H01P3/08 ,  C09J7/02 ,  H05K3/06 ,  H05K3/22

Abstract: To provide an adhesive film comprising a polyimide film and a fluorinated resin layer directly laminated, in which blisters (foaming) in an atmosphere corresponding to reflow soldering at high temperature are suppressed, and a flexible metal laminate. An adhesive film having a fluorinated resin layer containing a fluorinated copolymer (A) directly laminated on one side or both sides of a polyimide film, wherein the fluorinated copolymer (A) has a melting point of at least 280° C. and at most 320° C., is melt-moldable, and has at least one type of functional groups selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and the fluorinated resin layer has a thickness of from 1 to 20 μm.

Abstract translation: 为了提供一种粘合剂膜，其包括聚酰亚胺膜和直接层压的氟化树脂层，其中抑制了在与高温回流焊接相对应的气氛中的起泡（发泡）和柔性金属层压体。 一种粘合膜，其具有含有在聚酰亚胺膜的一面或两面直接层叠的含氟共聚物（A）的氟化树脂层，其中，所述含氟共聚物（A）的熔点为280℃以上，320以下 ℃，可熔融成型，并且具有选自含有羰基的基团，羟基，环氧基和异氰酸酯基团中的至少一种官能团，氟化树脂层具有 厚度为1至20μm。

公开(公告)号：US20180050516A1

公开(公告)日：2018-02-22

申请号：US15786876

申请日：2017-10-18

Applicant: ASAHI GLASS COMPANY, LIMITED

Inventor： Tomoya HOSODA ,  Wataru KASAI ,  Toru SASAKI ,  Masatoshi ABE

IPC: B32B15/08 ,  B32B37/06 ,  B32B7/12 ,  C23F1/00 ,  C09J7/02 ,  C09J5/06 ,  H05K1/03 ,  H05K3/06

CPC classification number: B32B15/08 ,  B32B7/12 ,  B32B27/30 ,  B32B37/06 ,  B32B2307/306 ,  B32B2309/02 ,  B32B2457/08 ,  C08F214/262 ,  C08F214/265 ,  C09J5/06 ,  C09J7/00 ,  C09J7/25 ,  C09J7/35 ,  C09J127/18 ,  C09J129/10 ,  C09J135/00 ,  C09J2203/326 ,  C09J2400/163 ,  C09J2427/00 ,  C09J2479/086 ,  C23F1/00 ,  H05K1/0353 ,  H05K1/0393 ,  H05K3/022 ,  H05K3/06 ,  H05K3/386 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/068

Abstract: To provide a material for a printed circuit board which is less likely to be warped in a high temperature region (from 150 to 200° C.) while maintaining electrical properties, a metal laminate, methods for producing them, and a method for producing a printed circuit board.A material having a fluorinated resin layer is subjected to a heat treatment. The fluorinated resin layer is composed of a composition containing a fluorinated copolymer (a) having at least one type of functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, having a melting point of from 280 to 320° C. and a melt flow rate of at least 2 g/10 min measured at 372° C. under a load of 49 N. The heat treatment is carried out at a temperature of at least 250° C. and lower by at least 5° C. than the melting point of the fluorinated copolymer (a) so that the ratio of the melt flow rate of the fluorinated resin layer after the heat treatment to that before the heat treatment, and the melt flow rate of the fluorinated resin layer after the heat treatment, are respectively within specific ranges.

公开(公告)号：US20170207105A1

公开(公告)日：2017-07-20

申请号：US15479577

申请日：2017-04-05

Applicant: ASAHI GLASS COMPANY, LIMITED

Inventor： Wataru KASAI ,  Masami Suzuki

IPC: H01L21/56 ,  B29C70/70 ,  B29C33/68

Abstract: To provide a mold release film which has excellent mold releasing property and is capable of reducing contamination of a mold in a sealing step; a process for producing the mold release film; and a process for producing a semiconductor package by using the mold release film. The mold release film 1 is a mold release film to be disposed on a surface of a mold which is to be in contact with a curable resin, in the production of a semiconductor package by disposing a semiconductor element in the mold, and sealing it with the curable resin to form a resin sealed portion. This mold release film 1 comprises a resin-side mold release layer 2 to be in contact with the curable resin at the time of forming the resin sealed portion, and a gas barrier layer 3. The gas barrier layer 3 contains at least one polymer (I) selected from the group consisting of a polymer having vinyl alcohol units and a polymer having vinylidene chloride units, and the thickness of the gas barrier layer 3 is from 0.1 to 5 μm.

公开(公告)号：US20160368177A1

公开(公告)日：2016-12-22

申请号：US15256980

申请日：2016-09-06

Applicant: Asahi Glass Company, Limited

Inventor： Wataru KASAI ,  Masami Suzuki

IPC: B29C33/68 ,  B29C45/02 ,  B29C43/18 ,  H01L23/29 ,  B32B27/08 ,  B32B37/12 ,  H01L21/56 ,  B29C45/14 ,  B32B27/32

CPC classification number: B29C33/68 ,  B29C43/18 ,  B29C45/02 ,  B29C45/14655 ,  B29C2045/14663 ,  B29K2627/18 ,  B29L2031/3481 ,  B32B7/12 ,  B32B27/06 ,  B32B27/08 ,  B32B27/16 ,  B32B27/18 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B37/12 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2264/102 ,  B32B2264/108 ,  B32B2307/21 ,  B32B2307/54 ,  B32B2307/732 ,  B32B2327/18 ,  H01L21/566 ,  H01L23/293 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: To provide a mold release film which is not easily electrically charged or curled, does not contaminate a mold, and has excellent mold followability, a process for its production, and a process for producing a semiconductor package by using the mold release film. A mold release film to be disposed on a surface of a mold which is to be in contact with a curable resin, in a process for producing a semiconductor package by disposing a semiconductor element in the mold, and sealing it with the curable resin to form a resin sealed portion, comprising a first thermoplastic resin layer to be in contact with the curable resin at the time of forming the resin sealed portion, a second thermoplastic resin layer to be in contact with the mold at the time of forming the resin sealed portion, and an interlayer disposed between the first thermoplastic resin layer and the second thermoplastic resin layer, wherein the first thermoplastic resin layer and the second thermoplastic resin layer have a storage elastic modulus at 180° C. of from 10 to 300 MPa, respectively, the difference in storage elastic modulus at 25° C. between them is at most 1,200 MPa, and their thicknesses are from 12 to 50 μm, and the interlayer includes a layer containing a polymeric antistatic agent.

Abstract translation: 为了提供不容易带电或卷曲的脱模膜，不污染模具，并且具有优异的模具跟随性，其制造方法以及通过使用脱模膜制造半导体封装的工艺。 在通过将半导体元件设置在模具中并通过可固化树脂密封形成半导体封装的制造方法中，设置在与可固化树脂接触的模具的表面上的脱模膜 树脂密封部，其包括在形成树脂密封部时与固化性树脂接触的第一热塑性树脂层，在形成树脂密封部时与模具接触的第二热塑性树脂层 以及设置在第一热塑性树脂层和第二热塑性树脂层之间的中间层，其中第一热塑性树脂层和第二热塑性树脂层的180℃下的储能弹性模量分别为10〜300MPa， 它们之间在25℃下的储能弹性模量的差异为至多1200MPa，并且它们的厚度为12至50μm，并且中间层包括含有聚合物抗体 静电剂。

公开(公告)号：US20160368176A1

公开(公告)日：2016-12-22

申请号：US15256957

申请日：2016-09-06

Applicant: Asahi Glass Company, Limited

Inventor： Wataru KASAI

IPC: B29C33/68 ,  B29C45/02 ,  H01L27/146 ,  B32B27/08 ,  B32B37/12 ,  H01L21/48 ,  B29C45/14 ,  B32B27/32

CPC classification number: B29C33/68 ,  B29C45/02 ,  B29C45/1418 ,  B29C45/14655 ,  B29C2045/025 ,  B29C2045/14663 ,  B29K2075/00 ,  B29K2627/18 ,  B29L2031/3481 ,  B32B3/30 ,  B32B7/06 ,  B32B25/08 ,  B32B27/08 ,  B32B27/283 ,  B32B27/302 ,  B32B27/32 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B37/12 ,  B32B2250/24 ,  B32B2307/54 ,  B32B2327/18 ,  B32B2375/00 ,  B32B2439/00 ,  B32B2457/00 ,  B32B2457/14 ,  H01L21/4803 ,  H01L21/565 ,  H01L21/566 ,  H01L23/057 ,  H01L27/14618 ,  H01L2924/0002 ,  H01L2924/00

Abstract: To provide a process for producing a package for mounting a semiconductor element by using a mold, said a package for mounting a semiconductor element comprising a substrate having a mounting surface for mounting a semiconductor element and a packaging body formed from a cured product of a curable resin and having a frame-shaped portion surrounding the mounting surface, and the package has a concave portion formed by the mounting surface and the packaging body, which allows it to prevent resin burrs without occurrence of dents or damage of a substrate and failure in releasing from a mold, and to provide a mold release film to be suitably used for the production process.A mold release film having a substantially constant thickness over the film, is disposed on the upper mold having a convex portion of which shape corresponds to the concave portion, the substrate is disposed on the lower portion, the upper mold and the lower mold are closed so as to be in close contact with the convex portion to the mounting portion of the substrate via the mold release film, a space formed between the upper mold and the lower mold is filled with a curable resin, followed by curing the curable resin, and the cured product is released together with the substrate, from the mold.

Abstract translation: 在膜上具有基本恒定的厚度的脱模膜设置在上模上，其具有与凹部相对应的形状的凸部，基板设置在下部，上模和下模闭合 通过脱模膜与基板的安装部与凸部紧密接触，在上模和下模之间形成的空间填充有可固化树脂，然后固化可固化树脂，并且 固化产物与基材一起从模具中释放出来。

公开(公告)号：US20160368175A1

公开(公告)日：2016-12-22

申请号：US15256913

申请日：2016-09-06

Applicant: Asahi Glass Company, Limited

Inventor： Wataru KASAI ,  Masami SUZUKI

IPC: B29C33/68 ,  B29C45/02 ,  B29C43/18 ,  B32B27/32 ,  H01L21/56 ,  B32B27/36 ,  B32B27/08 ,  B32B37/12 ,  B32B37/10 ,  B29C45/14 ,  B32B27/34

CPC classification number: B29C33/68 ,  B29C43/18 ,  B29C45/02 ,  B29C45/14639 ,  B29C45/14655 ,  B29C2045/14663 ,  B29K2075/00 ,  B29K2627/18 ,  B29L2031/3481 ,  B32B27/08 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B37/10 ,  B32B37/12 ,  B32B2250/24 ,  B32B2327/18 ,  B32B2367/00 ,  B32B2375/00 ,  B32B2377/00 ,  B32B2457/14 ,  H01L21/566 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: To provide a mold release film having excellent releasing properties for a sealed body from a mold and excellent followability to a mold requiring significant deformation, in a method for producing a sealed body wherein a structure comprising a substrate, a semiconductor element and connection terminals, is disposed in a mold requiring significant deformation and sealed with a curable resin to form a resin sealed portion having a thickness of at least 3 mm. The mold release film has a first layer to be in contact with the curable resin at the time of forming the resin sealed portion, and a second layer, wherein the first layer has a thickness of from 5 to 30 μm and is made of at least one member selected from the group consisting of a fluororesin and a polyolefin having a melting point of at least 200° C., and the second layer has a thickness of from 38 to 100 μm, a product of the tensile storage modulus (MPa) at 180° C. and the thickness (μm) being at most 18,000 (MPa·μm), and a product of the tensile stress at break (MPa) at 180° C. and the thickness (μm) being at least 2,000 (MPa·μm).

Abstract translation: 本发明提供一种密封体的制造方法，其特征在于，包括基板，半导体元件和连接端子的结构体为 设置在需要大量变形并且用可固化树脂密封的模具中，以形成厚度至少为3mm的树脂密封部分。 脱模膜在形成树脂密封部时具有与可固化树脂接触的第一层，第二层，其中第一层的厚度为5〜30μm，至少由 选自由氟树脂和熔点至少为200℃的聚烯烃组成的组中的一种，第二层的厚度为38〜100μm，拉伸储能模量（MPa）在 180℃，厚度（μm）为18000（MPa·μm）以下，180℃下的断裂拉伸应力（MPa）和厚度（μm）为2000以上（MPa·s）以下的乘积 μm）。

公开(公告)号：US20160078979A1

公开(公告)日：2016-03-17

申请号：US14944657

申请日：2015-11-18

Applicant: ASAHI GLASS COMPANY, LIMITED

Inventor： Tomoya HOSODA ,  Yasuhiko MATSUOKA ,  Toru SASAKI ,  Wataru KASAI

IPC: H01B3/30 ,  B32B27/28 ,  H01B13/08 ,  B29C65/00 ,  H01B3/44 ,  B32B27/08 ,  B29C65/02

CPC classification number: H01B3/306 ,  B29C63/0065 ,  B29C63/02 ,  B29C65/022 ,  B29C66/5326 ,  B29K2627/18 ,  B29K2679/08 ,  B29L2009/00 ,  B29L2031/3412 ,  B29L2031/3462 ,  B32B27/08 ,  B32B27/18 ,  B32B27/20 ,  B32B27/281 ,  B32B27/304 ,  B32B27/322 ,  B32B2250/24 ,  B32B2307/206 ,  B32B2307/306 ,  B32B2307/50 ,  B32B2307/54 ,  B32B2307/712 ,  B32B2307/714 ,  B32B2457/00 ,  B32B2457/04 ,  B32B2605/18 ,  C08F214/262 ,  C08J5/121 ,  C08J2327/12 ,  C08J2379/08 ,  H01B3/445 ,  H01B13/0891 ,  C08F214/26 ,  C08F216/1408

Abstract: To provide an insulating tape for covering, in which a polyimide film and a fluorinated resin film are laminated with excellent adhesion, and a method for producing a structure, which comprises covering a conductor with such an insulating tape for covering, followed by thermal treatment. The insulating tape for covering, comprises a polyimide film and a fluorinated resin film directly laminated on one or both surfaces of the polyimide film, wherein the fluorinated resin film contains a fluorinated copolymer (A) which has a melting point of from 220 to 320° C. and can be melt-molded and which has at least one type of functional groups selected from the group consisting of carbonyl group-containing groups, hydroxy groups, epoxy groups and isocyanate groups.

Abstract translation: 为了提供一种绝缘胶带，其中聚酰亚胺膜和氟化树脂膜以优异的粘合性层压，以及一种制造结构的方法，其包括用这种用于覆盖的绝缘带覆盖导体，随后进行热处理。 覆盖用绝缘带包括直接层叠在聚酰亚胺膜的一面或两面的聚酰亚胺膜和氟化树脂膜，其中，氟化树脂膜含有熔点为220〜320℃的氟化共聚物（A） 并且可以熔融模制，并且其具有至少一种选自由含羰基的基团，羟基，环氧基和异氰酸酯基组成的组中的官能团。