-
1.发明申请公开(公告)号：US20210040356A1
公开(公告)日：2021-02-11
申请号：US17034002
申请日：2020-09-28
Applicant: ASIA ELECTRONIC MATERIAL CO., LTD.
Inventor： Chih-Ming Lin , Chien-Hui Lee
IPC: C09J7/38 , H01B1/02 , C25D5/12 , C25D3/02 , C09J7/28 , C09J9/02 , C09J7/40 , C09J7/30 , C09J7/29 , H01B1/22
Abstract: Provided is a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance Therefore, the multi-layered anisotropic conductive adhesive has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. Also provided is a method of producing the multi-layered anisotropic conductive adhesive.
-
公开(公告)号：US10412866B2
公开(公告)日：2019-09-10
申请号：US15971129
申请日：2018-05-04
Applicant: ASIA ELECTRONIC MATERIAL CO., LTD.
Inventor： Chih-Ming Lin , Hui-Feng Lin , Chien-Hui Lee
Abstract: The present disclosure provides a cover film, including a conductive adhesive layer, an electromagnetic shielding layer formed on the conductive adhesive layer, and an insulating layer formed on the electromagnetic shielding layer. The electromagnetic shielding layer has a thickness of from 0.01 to 25 micrometers, such that the cover film can shield electromagnetic interference through the thinner interposed electromagnetic shielding layer.
-
3.发明授权公开(公告)号：US11634612B2
公开(公告)日：2023-04-25
申请号：US17034002
申请日：2020-09-28
Applicant: ASIA ELECTRONIC MATERIAL CO., LTD.
Inventor： Chih-Ming Lin , Chien-Hui Lee
IPC: C09J7/29 , C09J7/38 , H01B1/02 , C09J7/28 , C09J9/02 , C09J7/40 , C09J7/30 , H01B1/22 , C08K3/08 , C08K7/00 , C25D5/12 , C25D3/02 , C25D5/00
Abstract: Provided is a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. Also provided is a method of producing the multi-layered anisotropic conductive adhesive.
-
公开(公告)号：US20230065194A1
公开(公告)日：2023-03-02
申请号：US17898679
申请日：2022-08-30
Applicant: ASIA ELECTRONIC MATERIAL CO., LTD.
Inventor： Wei-Chih Lee , Chih-Ming Lin , Chia-Hua Ho , Chien-Hui Lee
Abstract: An electromagnetic interference shielding film includes an insulation layer, a first adhesive layer, a porous metal layer and a conductive adhesive layer including a plurality of conductive particles. The first adhesive layer is located between the insulation layer and the porous metal layer, and the porous metal layer is formed on the first adhesive layer, and making the first adhesive layer locate between the porous metal layer and the insulation layer. The conductive adhesive layer is located on the porous metal layer so that the porous metal layer is located between the first adhesive layer and the conductive adhesive layer. The present invention further provides a preparation method thereof.
-
公开(公告)号：US20160113162A1
公开(公告)日：2016-04-21
申请号：US14882753
申请日：2015-10-14
Applicant: ASIA ELECTRONIC MATERIAL CO., LTD.
Inventor： Chih-Ming Lin , Hui-Feng Lin , Chien-Hui Lee
IPC: H05K9/00
CPC classification number: H05K9/0088 , H05K1/0218
Abstract: The present disclosure provides a cover film, including a conductive adhesive layer, an electromagnetic shielding layer formed on the conductive adhesive layer, and an insulating layer formed on the electromagnetic shielding layer. The electromagnetic shielding layer has a thickness of from 0.01 to 25 micrometers, such that the cover film can shield electromagnetic interference through the thinner interposed electromagnetic shielding layer.
Abstract translation: 本公开内容提供了一种覆盖膜，包括导电粘合剂层，形成在导电粘合剂层上的电磁屏蔽层和形成在电磁屏蔽层上的绝缘层。 电磁屏蔽层具有0.01至25微米的厚度，使得覆盖膜可以通过较薄的插入的电磁屏蔽层屏蔽电磁干扰。
-
Patent Agency Ranking
公开(公告)号：US12233622B2
公开(公告)日：2025-02-25
申请号：US17898679
申请日：2022-08-30
Applicant: ASIA ELECTRONIC MATERIAL CO., LTD.
Inventor： Wei-Chih Lee , Chih-Ming Lin , Chia-Hua Ho , Chien-Hui Lee
Abstract: An electromagnetic interference shielding film includes an insulation layer, a first adhesive layer, a porous metal layer and a conductive adhesive layer including a plurality of conductive particles. The first adhesive layer is located between the insulation layer and the porous metal layer, and the porous metal layer is formed on the first adhesive layer, and making the first adhesive layer locate between the porous metal layer and the insulation layer. The conductive adhesive layer is located on the porous metal layer so that the porous metal layer is located between the first adhesive layer and the conductive adhesive layer. The present invention further provides a preparation method thereof.
-
公开(公告)号：US20180255668A1
公开(公告)日：2018-09-06
申请号：US15971129
申请日：2018-05-04
Applicant: ASIA ELECTRONIC MATERIAL CO., LTD.
Inventor： Chih-Ming Lin , Hui-Feng Lin , Chien-Hui Lee
CPC classification number: H05K9/0088 , H05K1/0218
Abstract: The present disclosure provides a cover film, including a conductive adhesive layer, an electromagnetic shielding layer formed on the conductive adhesive layer, and an insulating layer formed on the electromagnetic shielding layer. The electromagnetic shielding layer has a thickness of from 0.01 to 25 micrometers, such that the cover film can shield electromagnetic interference through the thinner interposed electromagnetic shielding layer.
-
公开(公告)号：US20250153461A1
公开(公告)日：2025-05-15
申请号：US19021343
申请日：2025-01-15
Applicant: ASIA ELECTRONIC MATERIAL CO., LTD.
Inventor： Wei-Chih Lee , Chih-Ming Lin , Chia-Hua Ho , Chien-Hui Lee
Abstract: An electromagnetic interference shielding film includes an insulation layer, a first adhesive layer, a porous metal layer and a conductive adhesive layer including a plurality of conductive particles. The first adhesive layer is located between the insulation layer and the porous metal layer, and the porous metal layer is formed on the first adhesive layer, and making the first adhesive layer locate between the porous metal layer and the insulation layer. The conductive adhesive layer is located on the porous metal layer so that the porous metal layer is located between the first adhesive layer and the conductive adhesive layer. The present invention further provides a preparation method thereof.
-
9.发明授权公开(公告)号：US10822529B2
公开(公告)日：2020-11-03
申请号：US15854935
申请日：2017-12-27
Applicant: ASIA ELECTRONIC MATERIAL CO., LTD.
Inventor： Chih-Ming Lin , Chien-Hui Lee
IPC: C25D5/12 , C09J7/28 , C09J9/02 , C09J7/40 , C09J7/30 , C09J7/29 , H01B1/22 , C08K3/08 , C08K7/00 , C09J7/38 , H01B1/02 , C25D3/02
Abstract: The present disclosure provides a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal, and the total thickness of the multi-layered anisotropic conductive adhesive is 45 to 100 μm. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive of the present disclosure has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. The disclosure further provides a method of producing the multi-layered anisotropic conductive adhesive.
-
10.发明申请公开(公告)号：US20180273809A1
公开(公告)日：2018-09-27
申请号：US15854935
申请日：2017-12-27
Applicant: ASIA ELECTRONIC MATERIAL CO., LTD.
Inventor： Chih-Ming Lin , Chien-Hui Lee
CPC classification number: C09J7/385 , C08K3/08 , C08K7/00 , C08K2201/001 , C09J7/28 , C09J7/29 , C09J7/30 , C09J7/401 , C09J9/02 , C09J2201/128 , C09J2201/36 , C09J2201/602 , C09J2201/606 , C09J2203/326 , C09J2205/102 , C09J2400/163 , C09J2400/263 , C09J2433/00 , C09J2467/005 , C25D3/02 , C25D5/12 , H01B1/026 , H01B1/22
Abstract: The present disclosure provides a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal, and the total thickness of the multi-layered anisotropic conductive adhesive is 40 to 60 μm. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive of the present disclosure has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. The disclosure further provides a method of producing the multi-layered anisotropic conductive adhesive.
-
-
-
-
-
-
-
-
-
Search Results
10
records
(took 0.016 seconds)
