公开(公告)号：US20170271191A1

公开(公告)日：2017-09-21

申请号：US15451285

申请日：2017-03-06

Applicant: ASM IP Holding B.V.

Inventor： Yong Min Yoo ,  Jong Won Shon ,  Seung Woo Choi ,  Dong Seok Kang

IPC: H01L21/683 ,  C25D11/04 ,  C23C16/04 ,  C25D11/02 ,  C23C16/44 ,  C23C16/505

CPC classification number: C25D11/04 ,  C23C16/4404 ,  C23C16/4409 ,  C23C16/4412 ,  C23C16/45525 ,  C23C16/4583 ,  C23C16/5096 ,  C25D11/022 ,  H01J37/3244 ,  H01J37/32715 ,  H01L21/6719 ,  H01L21/68735 ,  H01L21/68757

Abstract: A substrate supporting plate that may prevent deposition on a rear surface of a substrate and may easily unload the substrate. The substrate supporting plate may include a substrate mounting portion and a peripheral portion surrounding the substrate mounting portion. An edge portion of a top surface of the substrate mounting portion may be anodized. A central portion of the top surface of the substrate mounting portion may not be anodized.

公开(公告)号：US20240158942A1

公开(公告)日：2024-05-16

申请号：US18414914

申请日：2024-01-17

Applicant: ASM IP Holding B.V.

Inventor： Yong Min Yoo ,  Seung Woo Choi ,  Dong Seok Kang ,  Jong Won Shon

IPC: C25D11/04 ,  C23C16/44 ,  C23C16/455 ,  C23C16/458 ,  C23C16/509 ,  C25D11/02 ,  H01J37/32 ,  H01L21/67 ,  H01L21/687

CPC classification number: C25D11/04 ,  C23C16/4404 ,  C23C16/4409 ,  C23C16/4412 ,  C23C16/45525 ,  C23C16/4583 ,  C23C16/5096 ,  C25D11/022 ,  H01J37/3244 ,  H01J37/32715 ,  H01L21/6719 ,  H01L21/68735 ,  H01L21/68757 ,  H01J37/32477

Abstract: A substrate supporting plate that may prevent deposition on a rear surface of a substrate and may easily unload the substrate. The substrate supporting plate may include a substrate mounting portion and a peripheral portion surrounding the substrate mounting portion. An edge portion of a top surface of the substrate mounting portion may be anodized. A central portion of the top surface of the substrate mounting portion may not be anodized.

公开(公告)号：US11965262B2

公开(公告)日：2024-04-23

申请号：US17092599

申请日：2020-11-09

Applicant: ASM IP Holding B.V.

Inventor： Yong Min Yoo ,  Jong Won Shon ,  Seung Woo Choi ,  Dong Seok Kang

IPC: H01L21/687 ,  C23C16/44 ,  C23C16/455 ,  C23C16/458 ,  C23C16/509 ,  C25D11/02 ,  C25D11/04 ,  H01J37/32 ,  H01L21/67

CPC classification number: C25D11/04 ,  C23C16/4404 ,  C23C16/4409 ,  C23C16/4412 ,  C23C16/45525 ,  C23C16/4583 ,  C23C16/5096 ,  C25D11/022 ,  H01J37/3244 ,  H01J37/32715 ,  H01L21/6719 ,  H01L21/68735 ,  H01L21/68757 ,  H01J37/32477

Abstract: A substrate supporting plate that may prevent deposition on a rear surface of a substrate and may easily unload the substrate. The substrate supporting plate may include a substrate mounting portion and a peripheral portion surrounding the substrate mounting portion. An edge portion of a top surface of the substrate mounting portion may be anodized. A central portion of the top surface of the substrate mounting portion may not be anodized.

公开(公告)号：US10738381B2

公开(公告)日：2020-08-11

申请号：US15232603

申请日：2016-08-09

Applicant: ASM IP Holding B.V.

Inventor： Hyun Soo Jang ,  Jeong Ho Lee ,  Woo Chan Kim ,  Sung Hoon Jun ,  Jong Won Shon

IPC: C23C16/44 ,  C30B25/12 ,  C23C16/458

Abstract: Disclosed are a substrate holder and a semiconductor manufacturing apparatus including the substrate holder. The substrate holder provides a reaction region by making face-sealing contact with a reactor wall. The substrate holder has an elastic behavior when pressure is applied thereto while the substrate holder makes face-sealing contact with the reactor wall. The semiconductor manufacturing apparatus includes the substrate holder and a gas supply unit configured to supply gas to the reaction region provided by the reactor wall and the substrate holder.

公开(公告)号：US12270118B2

公开(公告)日：2025-04-08

申请号：US18414914

申请日：2024-01-17

Applicant: ASM IP Holding B.V.

Inventor： Yong Min Yoo ,  Seung Woo Choi ,  Dong Seok Kang ,  Jong Won Shon

IPC: H01L21/687 ,  C23C16/44 ,  C23C16/455 ,  C23C16/458 ,  C23C16/509 ,  C25D11/02 ,  C25D11/04 ,  H01J37/32 ,  H01L21/67

Abstract: A substrate supporting plate that may prevent deposition on a rear surface of a substrate and may easily unload the substrate. The substrate supporting plate may include a substrate mounting portion and a peripheral portion surrounding the substrate mounting portion. An edge portion of a top surface of the substrate mounting portion may be anodized. A central portion of the top surface of the substrate mounting portion may not be anodized.

公开(公告)号：US20170044666A1

公开(公告)日：2017-02-16

申请号：US15232603

申请日：2016-08-09

Applicant: ASM IP Holding B.V.

Inventor： Hyun Soo Jang ,  Jeong Ho Kee ,  Woo Chan Kim ,  Sung Hoon Jun ,  Jong Won Shon

IPC: C23C16/458 ,  C23C16/455

Abstract: Disclosed are a substrate holder and a semiconductor manufacturing apparatus including the substrate holder. The substrate holder provides a reaction region by making face-sealing contact with a reactor wall. The substrate holder has an elastic behavior when pressure is applied thereto while the substrate holder makes face-sealing contact with the reactor wall. The semiconductor manufacturing apparatus includes the substrate holder and a gas supply unit configured to supply gas to the reaction region provided by the reactor wall and the substrate holder.

Abstract translation: 公开了一种衬底保持器和包括衬底保持器的半导体制造设备。 衬底保持器通过与反应器壁进行面密封接触来提供反应区域。 当衬底保持器与反应器壁进行面密封接触时，衬底保持器具有施加压力的弹性。 半导体制造装置包括衬底保持器和气体供给单元，该气体供给单元构造成将气体供应到由反应器壁和衬底保持器提供的反应区域。

公开(公告)号：US20210054519A1

公开(公告)日：2021-02-25

申请号：US17092599

申请日：2020-11-09

Applicant: ASM IP Holding B.V.

Inventor： Yong Min Yoo ,  Jong Won Shon ,  Seung Woo Choi ,  Dong Seok Kang

IPC: C25D11/04 ,  C23C16/44 ,  C25D11/02 ,  H01L21/687 ,  H01L21/67 ,  C23C16/458 ,  C23C16/509 ,  H01J37/32 ,  C23C16/455

Abstract: A substrate supporting plate that may prevent deposition on a rear surface of a substrate and may easily unload the substrate. The substrate supporting plate may include a substrate mounting portion and a peripheral portion surrounding the substrate mounting portion. An edge portion of a top surface of the substrate mounting portion may be anodized. A central portion of the top surface of the substrate mounting portion may not be anodized.

公开(公告)号：US10190214B2

公开(公告)日：2019-01-29

申请号：US15208114

申请日：2016-07-12

Applicant: ASM IP Holding B.V.

Inventor： Jong Won Shon ,  Dae Youn Kim ,  Sang Don Lee ,  Hyun Soo Jang

IPC: C23C16/44 ,  C23C16/455 ,  C23C16/509 ,  H01J37/32

Abstract: A deposition apparatus includes: a substrate support having a main surface on which a substrate is placed; a body disposed on the main surface and including a hollow portion having an exposed upper portion; a plasma electrode unit provided at a inner circumferential surface of the body to separate the hollow portion into an upper space and a lower space; and a gas supply unit supplying process gas to the plasma electrode unit, wherein a gas exhaust channel extending from the lower space to an exhaust outlet provided at a top of the body is formed in the body.