公开(公告)号：US20240213058A1

公开(公告)日：2024-06-27

申请号：US18392301

申请日：2023-12-21

Applicant: ASM IP Holding B.V.

Inventor： Masaei Suwada ,  Taira Okabe

IPC: H01L21/67

CPC classification number: H01L21/67201 ,  H01L21/67248

Abstract: Load lock assemblies and associated temperature control assemblies are disclosed. The temperature control assemblies are moveably disposed within a load lock chamber body and constructed and arranged to be inserted and extracted from the load lock chamber body.

公开(公告)号：US20240198538A1

公开(公告)日：2024-06-20

申请号：US18543906

申请日：2023-12-18

Applicant: ASM IP Holding B.V.

Inventor： Taira Okabe

IPC: B25J15/00 ,  B06B1/06 ,  B25J11/00

CPC classification number: B25J15/0014 ,  B06B1/0629 ,  B25J11/0095 ,  B25J15/0004 ,  B25J15/0019 ,  B06B2201/70

Abstract: An End effector is disclosed. The exemplary end effector includes a substrate-supporting body for placing the substrate thereon; and a first array of wave generators disposed in the substrate-supporting body and configured to generate a surface wave to a backside of the substrate.

公开(公告)号：US20250069920A1

公开(公告)日：2025-02-27

申请号：US18806906

申请日：2024-08-16

Applicant: ASM IP Holding B.V.

Inventor： Masaei Suwada ,  Taira Okabe

IPC: H01L21/67

Abstract: Load lock assemblies, semiconductor processing systems including load lock assemblies, and associated methods for regulating the temperature of a substrate within load lock assemblies are disclosed. The load lock assemblies include a temperature control assembly coupled to an elevator, the elevator configured to provide vertical movement to the temperature control assembly within a load lock body.