公开(公告)号：US20180033674A1

公开(公告)日：2018-02-01

申请号：US15611707

申请日：2017-06-01

Applicant: ASM IP Holding B.V.

Inventor： Won Ki Jeong ,  Sung Hoon Jun ,  Dong Rak Jung

IPC: H01L21/687 ,  C23C16/455

CPC classification number: H01L21/68742 ,  C23C16/44 ,  C23C16/45565 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/68771

Abstract: Provided is a substrate processing apparatus in which parts are selectively lifted according to the purpose or subject of maintenance/repair during a maintenance/repair operation. The substrate processing apparatus includes: a chamber; a first cover and a second cover on the chamber; a lifting device connected to the first cover and configured to raise and lower the first cover; and a connection region. When the lifting device and the second cover are connected to each other via the connection region or the first and second covers are connected to each other via the connection region, the first and second covers are raised and lowered by the lifting device.

公开(公告)号：US11205585B2

公开(公告)日：2021-12-21

申请号：US15611707

申请日：2017-06-01

Applicant: ASM IP Holding B.V.

Inventor： Won Ki Jeong ,  Sung Hoon Jun ,  Dong Rak Jung

IPC: H01L21/67 ,  H01L21/687 ,  C23C16/44 ,  C23C16/455

Abstract: Provided is a substrate processing apparatus in which parts are selectively lifted according to the purpose or subject of maintenance/repair during a maintenance/repair operation. The substrate processing apparatus includes: a chamber; a first cover and a second cover on the chamber; a lifting device connected to the first cover and configured to raise and lower the first cover; and a connection region. When the lifting device and the second cover are connected to each other via the connection region or the first and second covers are connected to each other via the connection region, the first and second covers are raised and lowered by the lifting device.

公开(公告)号：US20240263304A1

公开(公告)日：2024-08-08

申请号：US18638154

申请日：2024-04-17

Applicant: ASM IP Holding B.V.

Inventor： Seung Wook Kim ,  Ju Ill Lee ,  Won Ki Jeong ,  Dong Rak Jung ,  Hong Hyun Kim

IPC: C23C16/44 ,  C23C16/455 ,  C23C16/458 ,  H01J37/32

CPC classification number: C23C16/4411 ,  C23C16/45565 ,  C23C16/45572 ,  H01J37/32522 ,  C23C16/45551 ,  C23C16/4586 ,  H01J37/32082

Abstract: Provided is a cooling device capable of controlling the temperature of an upper portion of a reactor, or more particularly, a gas supply device, for example, a shower head. The cooling device includes a separator configured to uniformly and efficiently cool the gas supply device.

公开(公告)号：US11993843B2

公开(公告)日：2024-05-28

申请号：US16039817

申请日：2018-07-19

Applicant: ASM IP Holding B.V.

Inventor： Seung Wook Kim ,  JuIll Lee ,  Won Ki Jeong ,  Dong Rak Jung ,  Hong Hyun Kim

IPC: C23C16/44 ,  C23C16/455 ,  C23C16/458 ,  H01J37/32

CPC classification number: C23C16/4411 ,  C23C16/45565 ,  C23C16/45572 ,  H01J37/32522 ,  C23C16/45551 ,  C23C16/4586 ,  H01J37/32082

Abstract: Provided is a cooling device capable of controlling the temperature of an upper portion of a reactor, or more particularly, a gas supply device, for example, a shower head. The cooling device includes a separator configured to uniformly and efficiently cool the gas supply device.

公开(公告)号：US20190062907A1

公开(公告)日：2019-02-28

申请号：US16039817

申请日：2018-07-19

Applicant: ASM IP Holding B.V.

Inventor： Seung Wook Kim ,  Ju Il Lee ,  Won Ki Jeong ,  Dong Rak Jung ,  Hong Hyun Kim

IPC: C23C16/44 ,  C23C16/458 ,  C23C16/455

Abstract: Provided is a cooling device capable of controlling the temperature of an upper portion of a reactor, or more particularly, a gas supply device, for example, a shower head. The cooling device includes a separator configured to uniformly and efficiently cool the gas supply device.