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1.发明申请公开(公告)号：US20220026819A1
公开(公告)日：2022-01-27
申请号：US17291322
申请日：2019-10-31
Applicant: ASML Holding N.V.
Inventor： Keane Michael LEVY , Akshay HARLALKA
IPC: G03F7/20
Abstract: Apparatus for and method of removing a contaminant from a working surface of a lithography support such as a reticle or wafer stage in an EUV or a DUV photolithography system in which a cleaning substrate provided with a coating made a selected material and configuration is pressed against the working surface so that the contaminant is transferred from the working surface to the coating.
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