公开(公告)号：US20240419089A1

公开(公告)日：2024-12-19

申请号：US18821789

申请日：2024-08-30

Applicant: ASML Holding N.V.

Inventor： Keane Michael LEVY

IPC: G03F7/00

Abstract: Apparatus for and method of removing a contaminant from a working surface of a lithography support such as a reticle or wafer stage in an EUV or a DUV photolithography system in which a base supporting the substrate is provided with a surface profile so as to be thicker towards a middle portion of the base so that when a substrate supported by the base is pressed between the working surface and the base the contaminant is transferred from the working surface to the substrate.

公开(公告)号：US20230359118A1

公开(公告)日：2023-11-09

申请号：US17912202

申请日：2021-03-16

Applicant: ASML HOLDING N.V.

Inventor： Sotrios LYRINTZIS ,  Keane Michael LEVY

IPC: G03F7/00 ,  G03F7/20

CPC classification number: G03F7/0035 ,  G03F7/2037

Abstract: Systems and methods for forming structures (e.g., a plurality of support peaks) on a surface are described. Forming structures on a surface includes masking one or more portions of the surface; removing material from one or more unmasked portions of the surface; and iteratively repeating the masking and removing to reshape the unmasked portions of the surface until the plurality of structures (e.g., support peaks) are formed such that regions of the surface between individual structures (support peaks) have a target characteristic such as a target topography, roughness, etc.

公开(公告)号：US20220066332A1

公开(公告)日：2022-03-03

申请号：US17418487

申请日：2019-12-18

Applicant: ASML Holding N.V.

Inventor： Keane Michael LEVY

IPC: G03F7/20

Abstract: Apparatus for and method of removing a contaminant from a working surface of a lithography support such as a reticle or wafer stage in an EUV or a DUV photolithography system in which abase supporting the substrate is provided with a surface profile so as to be thicker towards a middle portion of the base so that when a substrate supported by the base is pressed between the working surface and the base the contaminant is transferred from the working surface to the substrate.

公开(公告)号：US20220026819A1

公开(公告)日：2022-01-27

申请号：US17291322

申请日：2019-10-31

Applicant: ASML Holding N.V.

Inventor： Keane Michael LEVY ,  Akshay HARLALKA

IPC: G03F7/20

Abstract: Apparatus for and method of removing a contaminant from a working surface of a lithography support such as a reticle or wafer stage in an EUV or a DUV photolithography system in which a cleaning substrate provided with a coating made a selected material and configuration is pressed against the working surface so that the contaminant is transferred from the working surface to the coating.