Inspection apparatus and device manufacturing method

    公开(公告)号:US10126237B2

    公开(公告)日:2018-11-13

    申请号:US14850917

    申请日:2015-09-10

    Abstract: An inspection apparatus comprises an illumination system (12) for illuminating a target structure with illuminating radiation and a collection system for collecting the illuminating radiation after it has been scattered by the target structure. A programmable spatial light modulator (713) comprises an array of movable mirror elements (742) in a conjugate pupil plane (P″) of the illumination system. Between the array of mirror elements and the target a common optical path is defined forming part of the illumination system and the collection system. Each mirror element is movable between a first position where it reflects illuminating radiation into the common optical path and a second position where it reflects radiation from the common optical path toward a detector (19, 23). Various combinations of illumination aperture and collection aperture can be defined without the light losses associated with beam splitters and transmissive spatial light modulators.

    Focus monitoring arrangement and inspection apparatus including such an arrangement

    公开(公告)号:US10215954B2

    公开(公告)日:2019-02-26

    申请号:US15379918

    申请日:2016-12-15

    Abstract: A focus monitoring arrangement (1000) is provided for a scatterometer or other optical system. A first focus sensor (510) provides a first focus signal (S1-S2) indicating focus relative to a first reference distance (z1). A second focus sensor (1510) for providing a second focus signal (C1-C2) indicating focus relative to a second reference distance (z2). A processor (1530) calculates a third focus signal by combining the first focus signal and the second focus signal. By varying the proportions of the first and second focus signals in calculating the third focus signal, an effective focus offset can be varied electronically, without moving elements.

    Metrology method and apparatus, computer program and lithographic system

    公开(公告)号:US10191391B2

    公开(公告)日:2019-01-29

    申请号:US15279860

    申请日:2016-09-29

    Abstract: Disclosed is a metrology apparatus for measuring a parameter of a lithographic process, and associated computer program and method. The metrology apparatus comprises an optical system for measuring a target on a substrate by illuminating the target with measurement radiation and detecting the measurement radiation scattered by the target; and an array of lenses. Each lens of the array is operable to focus the scattered measurement radiation onto a sensor, said array of lenses thereby forming an image on the sensor which comprises a plurality of sub-images, each sub-image being formed by a corresponding lens of the array of lenses. The resulting plenoptic image comprises image plane information from the sub-images, wavefront distortion information (from the relative positions of the sub-images) and pupil information from the relative intensities of the sub-images.

    Method of Inspecting a Substrate, Metrology Apparatus, and Lithographic System

    公开(公告)号:US20180107124A1

    公开(公告)日:2018-04-19

    申请号:US15723820

    申请日:2017-10-03

    Abstract: Metrology apparatus and methods are disclosed. In one arrangement, a substrate is inspected. A source beam of radiation emitted by a radiation source is split into a measurement beam and a reference beam. A first target is illuminated with the measurement beam, the first target being on the substrate. A second target is illuminated with the reference beam, the second target being separated from the substrate. First scattered radiation is collected from the first target and delivered to a detector. Second scattered radiation is collected from the second target and delivered to the detector. The first scattered radiation interferes with the second scattered radiation at the detector. The first target comprises a first pattern. The second target comprises a second pattern, or a pupil plane image of the second pattern. The first pattern is geometrically identical to the second pattern, the first pattern and the second pattern are periodic and a pitch of the first pattern is identical to a pitch of the second pattern, or both.

Patent Agency Ranking