公开(公告)号：US10969545B2

公开(公告)日：2021-04-06

申请号：US16759795

申请日：2017-12-25

Applicant: Accelink Technologies Co., Ltd.

Inventor： Jiuhong Ling ,  Fan Wu ,  Xiangjian Kong ,  Changan Li ,  Jiayan Hu

IPC: G02B6/34 ,  G02B6/12

Abstract: An apparatus and method for temperature compensation, belonging to the technical field of optical communications, and particularly an apparatus and method for implementing bilinear temperature compensation of an arrayed waveguide grating is disclosed. The apparatus consists of two drivers. A first driver performs linear compensation in a range lower than normal temperature 25° C. to −40° C. (low-temperature area) or a range higher than ambient temperature 25° C. to 85° C. (high-temperature area). A second driver is used to realize nonlinear compensation of superimposed effect of AWG chip wavelength/temperature in another temperature area. Two parts of the chip after being divided have different relative displacement/effective compensation amounts in different temperature ranges, having over-compensation in the high-temperature area and under-compensation in the low-temperature area, so that a center wavelength of the AWG chip appears as two gentle curves with temperature change. The residual nonlinear temperature effect is effectively reduced.

公开(公告)号：US10241265B2

公开(公告)日：2019-03-26

申请号：US15570022

申请日：2015-12-15

Applicant: Accelink Technologies Co., Ltd.

Inventor： Jiayan Hu ,  Changan Li ,  Jiuhong Ling

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/34 ,  G02B6/42

Abstract: An apparatus for alleviating a nonlinear temperature effect of an arrayed waveguide grating, comprising an integrated optical circuit base for an arrayed waveguide grating chip and an actuator. The integrated optical circuit base includes a first region, a second region connected by a hinge. The actuator includes two or more actuating rods having a thermal expansion coefficient different from that of the integrated optical circuit base. In different temperature ranges, the first region and the second region are driven by different actuating rods to rotate and/or translate relative to each other, so that the first region and the second region have a nonlinear displacement as the temperature changes, which brings the two parts of the arrayed waveguide grating chip to move relative to each other to accurately compensate drifting of a central wavelength of the arrayed waveguide grating chip in the different temperature ranges.

公开(公告)号：US20210055476A1

公开(公告)日：2021-02-25

申请号：US16759795

申请日：2017-12-25

Applicant: ACCELINK TECHNOLOGIES CO., LTD.

Inventor： Jiuhong Ling ,  Fan Wu ,  Xiangjian Kong ,  Changan Li ,  Jiayan Hu

IPC: G02B6/12

Abstract: An apparatus and method for temperature compensation, belonging to the technical field of optical communications, and particularly an apparatus and method for implementing bilinear temperature compensation of an arrayed waveguide grating is disclosed. The apparatus consists of two drivers. A first driver performs linear compensation in a range lower than normal temperature 25° C. to −40° C. (low-temperature area) or a range higher than ambient temperature 25° C. to 85° C. (high-temperature area). A second driver is used to realize nonlinear compensation of superimposed effect of AWG chip wavelength/temperature in another temperature area. Two parts of the chip after being divided have different relative displacement/effective compensation amounts in different temperature ranges, having over-compensation in the high-temperature area and under-compensation in the low-temperature area, so that a center wavelength of the AWG chip appears as two gentle curves with temperature change. The residual nonlinear temperature effect is effectively reduced.

公开(公告)号：US10209463B2

公开(公告)日：2019-02-19

申请号：US15740961

申请日：2015-12-15

Applicant: Accelink Technologies Co., Ltd.

Inventor： Qionghui Song ,  Jiecong Huang ,  Jiuhong Ling ,  Wei Du ,  Weidong Ma

IPC: G02B6/42 ,  G02B6/44

Abstract: A silicon waveguide coupling alignment apparatus includes a fine adjustment bracket, a stress releasing clamp and a silicon photonic integrated chip force sensor. A silicon photonic integrated chip is fixed on the silicon photonic integrated chip force sensor, at least a part of an optical fiber to be coupled is fixed on one end of the stress releasing clamp, the stress releasing clamp is arranged on the fine adjustment bracket, an end surface of the optical fiber to be coupled is aligned with an end surface of the silicon photonic integrated chip by adjusting a position of the fine adjustment bracket, and a cushioning mechanism is arranged within the stress releasing clamp to cushion a collision force in a direction perpendicular to the end surface of the optical fiber to be coupled. The contact force imposed by the optical fiber on the end surface of the chip can be released by the clamp.

公开(公告)号：US20180196205A1

公开(公告)日：2018-07-12

申请号：US15740961

申请日：2015-12-15

Applicant: Accelink Technologies Co., Ltd.

Inventor： Qionghui Song ,  Jiecong Huang ,  Jiuhong Ling ,  Wei Du ,  Weidong Ma

IPC: G02B6/42 ,  G02B6/44

CPC classification number: G02B6/422 ,  G02B6/42 ,  G02B6/4405

Abstract: A silicon waveguide coupling alignment apparatus includes a fine adjustment bracket, a stress releasing clamp and a silicon photonic integrated chip force sensor. A silicon photonic integrated chip is fixed on the silicon photonic integrated chip force sensor, at least a part of an optical fiber to be coupled is fixed on one end of the stress releasing clamp, the stress releasing clamp is arranged on the fine adjustment bracket, an end surface of the optical fiber to be coupled is aligned with an end surface of the silicon photonic integrated chip by adjusting a position of the fine adjustment bracket, and a cushioning mechanism is arranged within the stress releasing clamp to cushion a collision force in a direction perpendicular to the end surface of the optical fiber to be coupled. The contact force imposed by the optical fiber on the end surface of the chip can be released by the clamp.