DEVICE AND METHOD FOR ALIGNING AND BONDING LENS ARRAY AND PD ARRAY WITH HIGH PRECISION

    公开(公告)号:US20170343748A1

    公开(公告)日:2017-11-30

    申请号:US15534863

    申请日:2014-12-17

    Abstract: Device and method are provided to align and bond a lens array to a PD array with high precision, which can implement aligning and bonding of the lens array automatically. A telescopic rod of the stepping actuator is adjusted until photosensitive areas of the PD array form a clear image on the image acquisition CCD through the lens array, an adjusted distance h1 of the telescopic rod is recorded, and a position coordinate (xn, yn) of center of each circular photosensitive area in the image may be obtained, and a slope k1 of a line connecting the centers of the photosensitive areas is calculated. The telescopic rod is adjusted again, and a slope k2 of a line connecting the centers of the apertures of the lens array is calculated. Based on calculated values Δxn, Δyn, arctan(k1)-arctan(k2), the high-resolution adjustment stage is adjusted to adjust position of the lens array.

    Silicon waveguide coupling alignment apparatus

    公开(公告)号:US10209463B2

    公开(公告)日:2019-02-19

    申请号:US15740961

    申请日:2015-12-15

    Abstract: A silicon waveguide coupling alignment apparatus includes a fine adjustment bracket, a stress releasing clamp and a silicon photonic integrated chip force sensor. A silicon photonic integrated chip is fixed on the silicon photonic integrated chip force sensor, at least a part of an optical fiber to be coupled is fixed on one end of the stress releasing clamp, the stress releasing clamp is arranged on the fine adjustment bracket, an end surface of the optical fiber to be coupled is aligned with an end surface of the silicon photonic integrated chip by adjusting a position of the fine adjustment bracket, and a cushioning mechanism is arranged within the stress releasing clamp to cushion a collision force in a direction perpendicular to the end surface of the optical fiber to be coupled. The contact force imposed by the optical fiber on the end surface of the chip can be released by the clamp.

    SILICON WAVEGUIDE COUPLING ALIGNMENT APPARATUS

    公开(公告)号:US20180196205A1

    公开(公告)日:2018-07-12

    申请号:US15740961

    申请日:2015-12-15

    CPC classification number: G02B6/422 G02B6/42 G02B6/4405

    Abstract: A silicon waveguide coupling alignment apparatus includes a fine adjustment bracket, a stress releasing clamp and a silicon photonic integrated chip force sensor. A silicon photonic integrated chip is fixed on the silicon photonic integrated chip force sensor, at least a part of an optical fiber to be coupled is fixed on one end of the stress releasing clamp, the stress releasing clamp is arranged on the fine adjustment bracket, an end surface of the optical fiber to be coupled is aligned with an end surface of the silicon photonic integrated chip by adjusting a position of the fine adjustment bracket, and a cushioning mechanism is arranged within the stress releasing clamp to cushion a collision force in a direction perpendicular to the end surface of the optical fiber to be coupled. The contact force imposed by the optical fiber on the end surface of the chip can be released by the clamp.

    Device and method for aligning and bonding lens array and PD array with high precision

    公开(公告)号:US09964717B2

    公开(公告)日:2018-05-08

    申请号:US15534863

    申请日:2014-12-17

    Abstract: Device and method are provided to align and bond a lens array to a PD array with high precision, which can implement aligning and bonding of the lens array automatically. A telescopic rod of the stepping actuator is adjusted until photosensitive areas of the PD array form a clear image on the image acquisition CCD through the lens array, an adjusted distance h1 of the telescopic rod is recorded, and a position coordinate (xn, yn) of center of each circular photosensitive area in the image may be obtained, and a slope k1 of a line connecting the centers of the photosensitive areas is calculated. The telescopic rod is adjusted again, and a slope k2 of a line connecting the centers of the apertures of the lens array is calculated. Based on calculated values Δxn, Δyn, arctan(k1)−arctan(k2), the high-resolution adjustment stage is adjusted to adjust position of the lens array.

    COUPLING DEVICE OF OPTICAL WAVEGUIDE CHIP AND PD ARRAY LENS
    7.
    发明申请
    COUPLING DEVICE OF OPTICAL WAVEGUIDE CHIP AND PD ARRAY LENS 审中-公开
    光波导片和PD阵列镜的耦合器件

    公开(公告)号:US20160231522A1

    公开(公告)日:2016-08-11

    申请号:US15024086

    申请日:2013-12-17

    Abstract: A coupling device of an optical waveguide chip and a PD array lens. The coupling device comprises a waveguide chip, a PD array, a heat sink, a waveguide gasket and a substrate. The waveguide gasket and the heat sink are located on the substrate, the PD array is located on the heat sink, and the waveguide chip is provided on the waveguide gasket. A reflection prism is provided in an optical path between the waveguide chip and the PD array. The output light of the waveguide chip is reflected by the reflection prism, and then is received by the PD array. A lens array having a convergence effect is provided in the optical path between the waveguide chip and the PD array. The coupling device can reduce costs and has a simple structure, the assembly process thereof is easy to realize, and the photoelectric conversion efficiency thereof is high.

    Abstract translation: 光波导芯片和PD阵列透镜的耦合器件。 耦合装置包括波导芯片,PD阵列,散热器,波导衬垫和衬底。 波导垫片和散热器位于基板上,PD阵列位于散热器上,波导芯片设置在波导垫片上。 在波导芯片和PD阵列之间的光路中设置反射棱镜。 波导芯片的输出光被反射棱镜反射,然后由PD阵列接收。 在波导芯片和PD阵列之间的光路中提供具有会聚效应的透镜阵列。 联接装置可以降低成本并且结构简单,其组装过程容易实现,并且其光电转换效率高。

    Signal demodulation method and apparatus, computer storage medium and device

    公开(公告)号:US12294412B2

    公开(公告)日:2025-05-06

    申请号:US18015071

    申请日:2020-12-21

    Abstract: Disclosed are a signal demodulation method and apparatus, a computer storage medium and a device. The method comprises: acquiring a signal to be demodulated; performing direct current blocking and bias processing on the signal to obtain a processed signal; comparing the processed signal with a preset decision signal, and obtaining a demodulation signal according to a comparison result. Thus, direct current blocking processing on a modulation signal can avoid dynamic changes of DC components caused by average power changes of carrier signals, avoiding wrongly demodulating the modulation signal. Bias processing after the direct current blocking on the modulation signal can further realize an AC signal decision without introducing a negative pressure source. A real-time decision on the processed signal via the preset decision signal can dynamically adapt the average power of carrier signals, thereby ensuring to correctly demodulate the modulation signal and improving the accuracy of demodulation results.

    Debugging Method And Device For Operating Point Voltage Of Parallel MZI Electro-Opticalmodulator

    公开(公告)号:US20190273558A1

    公开(公告)日:2019-09-05

    申请号:US16329065

    申请日:2016-12-19

    Abstract: A debugging method and device for an operating point voltage of a parallel MZI electro-optical modulator. The parallel MZI electro-optical modulator comprises a Parent MZI (2) formed by a parallel connection of a Child MZI (3) in an I path and a Child MZI (4) in a Q path. The debugging method comprises: fixing a bias voltage of one Child MZI of the Child MZI (3) in the I path and the Child MZI (4) in the Q path; gradually adjusting a bias voltage of the other Child MZI, testing a parent extinction ratio Per of the Parent MZI (2) when different bias voltages are applied, and finding a corresponding bias voltage as an operating point voltage of the other Child MZI when the Per of the Parent MZI (2) reaches a minimum value, and then finding a corresponding bias voltage as an operating point voltage of the one Child MZI when the Per of the Parent MZI (2) reaches a minimum value; setting the bias voltages of the two Child MZIs as operating point voltages corresponding to the two Child MZIs respectively, adjusting a phase modulation voltage of the Parent MZI (2) until an output effect of the parallel MZI electro-optical modulator reaches the best, and determining the phase modulation voltage of the Parent MZI (2). The method and device are simple; and the debugging process thereof is fast and efficient.

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