公开(公告)号：US10209463B2

公开(公告)日：2019-02-19

申请号：US15740961

申请日：2015-12-15

Applicant: Accelink Technologies Co., Ltd.

Inventor： Qionghui Song ,  Jiecong Huang ,  Jiuhong Ling ,  Wei Du ,  Weidong Ma

IPC: G02B6/42 ,  G02B6/44

Abstract: A silicon waveguide coupling alignment apparatus includes a fine adjustment bracket, a stress releasing clamp and a silicon photonic integrated chip force sensor. A silicon photonic integrated chip is fixed on the silicon photonic integrated chip force sensor, at least a part of an optical fiber to be coupled is fixed on one end of the stress releasing clamp, the stress releasing clamp is arranged on the fine adjustment bracket, an end surface of the optical fiber to be coupled is aligned with an end surface of the silicon photonic integrated chip by adjusting a position of the fine adjustment bracket, and a cushioning mechanism is arranged within the stress releasing clamp to cushion a collision force in a direction perpendicular to the end surface of the optical fiber to be coupled. The contact force imposed by the optical fiber on the end surface of the chip can be released by the clamp.

公开(公告)号：US20180196205A1

公开(公告)日：2018-07-12

申请号：US15740961

申请日：2015-12-15

Applicant: Accelink Technologies Co., Ltd.

Inventor： Qionghui Song ,  Jiecong Huang ,  Jiuhong Ling ,  Wei Du ,  Weidong Ma

IPC: G02B6/42 ,  G02B6/44

CPC classification number: G02B6/422 ,  G02B6/42 ,  G02B6/4405

Abstract: A silicon waveguide coupling alignment apparatus includes a fine adjustment bracket, a stress releasing clamp and a silicon photonic integrated chip force sensor. A silicon photonic integrated chip is fixed on the silicon photonic integrated chip force sensor, at least a part of an optical fiber to be coupled is fixed on one end of the stress releasing clamp, the stress releasing clamp is arranged on the fine adjustment bracket, an end surface of the optical fiber to be coupled is aligned with an end surface of the silicon photonic integrated chip by adjusting a position of the fine adjustment bracket, and a cushioning mechanism is arranged within the stress releasing clamp to cushion a collision force in a direction perpendicular to the end surface of the optical fiber to be coupled. The contact force imposed by the optical fiber on the end surface of the chip can be released by the clamp.