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    METHODS OF FORMING ARRYAS OF NANOSCALE BUILDING BOLCKS
    1.
    发明申请
    METHODS OF FORMING ARRYAS OF NANOSCALE BUILDING BOLCKS 有权
    形成纳米尺寸建筑砖的方法

    公开(公告)号：US20060027799A1

    公开(公告)日：2006-02-09

    申请号：US11161456

    申请日：2005-08-03

    Applicant: Nobuhiko Kobayashi ,  Achyut Dutta

    Inventor： Nobuhiko Kobayashi ,  Achyut Dutta

    IPC: H01L31/109

    CPC classification number: C09K11/883 ,  B82Y10/00 ,  C09K11/565 ,  Y10S438/962 ,  Y10S977/789 ,  Y10S977/827 ,  Y10S977/831 ,  Y10S977/893

    Abstract: THE invention is a method of producing an individual an array, or multiple arrays of quantum dots. Single dots, as well as two or three-dimensional groupings may be created. The invention involves the transfer of quantum dots from a receptor site on a substrate where they are originally created to a separate substrate or layer, with a repetition of the process and a variation in the original pattern to create different structures.

    Abstract translation: 本发明是一种产生单个阵列或多个量子点阵列的方法。 可以创建单个点以及二维或三维分组。 本发明涉及将量子点从原始产生的基底上的受体位点转移到单独的基底或层，重复该过程和原始图案的变化以产生不同的结构。

    High-speed flex printed circuit and method of manufacturing
    2.
    发明申请
    High-speed flex printed circuit and method of manufacturing 有权
    高速柔性印刷电路及其制造方法

    公开(公告)号：US20070066126A1

    公开(公告)日：2007-03-22

    申请号：US11162720

    申请日：2005-09-20

    Applicant: Achyut Dutta ,  Robert Olah

    Inventor： Achyut Dutta ,  Robert Olah

    IPC: H01R12/24

    CPC classification number: H05K1/024 ,  H05K1/0393 ,  H05K3/386 ,  H05K3/4611 ,  H05K3/4635 ,  H05K3/4697 ,  H05K2201/09536 ,  H05K2201/09727 ,  Y10T29/49126

    Abstract: High speed flex printed circuit boards (FLEX-PCBs) are disclosed comprising a dielectrics systems with the back-side trenches, adhesives, signal lines and ground-plans, wherein the signal line and ground-plan are located on the dielectrics. Using of the open trenches in the substrate help to reduce the microwave loss and dielectric constant and thus increasing the signal carrying speed of the interconnects. Thus, according to the present invention, it is possible to provide a simply constructed high speed FLEX-PCB using the conventional material and conventional FLEX-PCB manufacturing which facilitates the design of circuits with controlled bandwidth based on the trench opening in the dielectrics, and affords excellent connection reliability. As the effective dielectric constant is reduced, the signal width is required to make wider or the dielectric thickness is required to make thinner keeping fixed characteristics impedance. The fundamental techniques disclosed here can also be used for high-speed packaging.

    Abstract translation: 公开了高速柔性印刷电路板（FLEX-PCB），其包括具有背面沟槽，粘合剂，信号线和地面平面图的电介质系统，其中信号线和平面图位于电介质上。 使用衬底中的开放沟槽有助于减少微波损耗和介电常数，从而增加互连的信号承载速度。 因此，根据本发明，可以使用常规材料和传统的FLEX-PCB制造提供简单构造的高速FLEX-PCB，其有助于基于电介质中的沟槽开口的具有受控带宽的电路的设计，以及 提供良好的连接可靠性。 随着有效介电常数的降低，需要使信号宽度变宽或需要电介质厚度来形成较薄的保持固定特性阻抗。 这里公开的基本技术也可用于高速包装。

    High-Speed Printed Circuit Boards (PCBs) and Manufacturing
    4.
    发明申请
    High-Speed Printed Circuit Boards (PCBs) and Manufacturing 有权
    高速印刷电路板（PCB）和制造

    公开(公告)号：US20060028305A1

    公开(公告)日：2006-02-09

    申请号：US11161353

    申请日：2005-07-30

    Applicant: Achyut Dutta ,  Robert Olah

    Inventor： Achyut Dutta ,  Robert Olah

    IPC: H01P3/08

    CPC classification number: H01P3/087 ,  H01L2223/6627 ,  H01L2924/19032 ,  H01P3/084 ,  H01P11/003 ,  H05K1/024 ,  H05K1/0306 ,  H05K1/0313 ,  H05K3/386 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/4697

    Abstract: High speed printed circuit boards (PCBs) are disclosed comprising a dielectrics systems with the back-side trenches, prepregs, signal lines and ground-plans, wherein the signal line and ground-plan are located on the dielectrics. Using of the open trenches in the substrate help to reduce the microwave loss and dielectric constant and thus increasing the signal carrying speed of the interconnects. Thus, according to the present invention, it is possible to provide a simple high speed PCB using the conventional material and conventional PCB manufacturing which facilitates the design of circuits with controlled bandwidth based on the trench opening in the dielectrics, and affords excellent reliability. According to this present invention, high speed PCB with the interconnect system contains whole portion or portion of interconnects for high speed chips interconnects and that have have the dielectric system with opened trench or slot to reduce the microwave loss.

    Abstract translation: 公开了高速印刷电路板（PCB），其包括具有背面沟槽，预浸料，信号线和地面平面图的电介质系统，其中信号线和平面图位于电介质上。 使用衬底中的开放沟槽有助于减少微波损耗和介电常数，从而增加互连的信号承载速度。 因此，根据本发明，可以使用常规材料和常规PCB制造提供简单的高速PCB，其有利于基于电介质中的沟槽开口的具有受控带宽的电路的设计，并且提供优异的可靠性。 根据本发明，具有互连系统的高速PCB包含用于高速芯片互连的全部或互连部分，并且具有开放的沟槽或槽的电介质系统以减少微波损耗。

    High Speed Electrical On-Chip Interconnects and Method of Manufacturing
    5.
    发明申请
    High Speed Electrical On-Chip Interconnects and Method of Manufacturing 审中-公开
    高速电子片上互连和制造方法

    公开(公告)号：US20050110138A1

    公开(公告)日：2005-05-26

    申请号：US10904723

    申请日：2004-11-24

    Applicant: Achyut Dutta

    Inventor： Achyut Dutta

    IPC: H01L23/498 ,  H01L23/66 ,  H01L21/00 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC classification number: H01L23/66 ,  H01L23/49822 ,  H01L2223/6627 ,  H01L2924/0002 ,  H01L2924/1903 ,  H01L2924/3011 ,  H01L2924/00

    Abstract: High-speed interconnect systems for connecting two or more electrical elements are provided for on-chip interconnects. The manufacturing process to fabricate the interconnect structure using standard IC process is also provided. The interconnect systems consists of the electrical signal line, inhomogeneous dielectric systems, and with and without ground line, wherein inhomogeneous dielectric system consisting of the opened-trenches into the dielectric substrate or comb-shaped dielectrics to reduce the microwave loss. The signal lines located below and/or above the opened trenches. The opened trenches helps to reduce the microwave-loss induced due to the dielectric material and increases the on-chip interconnects bandwidth. Alternatively, dielectric system can have the structure based on fully electronic or electromagnetic crystal or quasi crystal with the line defect. The interconnect system, can be made in IC for on-chip interconnects using conventional IC manufacturing technology and yet to increase the interconnects-bandwidth.

    Abstract translation: 提供用于连接两个或多个电气元件的高速互连系统用于片上互连。 还提供了使用标准IC工艺制造互连结构的制造工艺。 互连系统由电信号线，不均匀电介质系统和有和没有接地线组成，其中由打开的沟槽组成电介质衬底或梳状电介质的非均匀介质系统以减少微波损耗。 位于打开的沟槽下方和/或上方的信号线。 开放的沟槽有助于减少由于介电材料引起的微波损耗，并增加片上互连带宽。 或者，电介质系统可以具有基于全电子或电磁晶体或具有线缺陷的准晶体的结构。 互连系统可以使用传统IC制造技术在IC中进行片上互连，并且还可以增加互连带宽。

    Image detecting capsule device and manufacturing thereof
    7.
    发明授权
    Image detecting capsule device and manufacturing thereof 有权

    公开(公告)号：US10588496B2

    公开(公告)日：2020-03-17

    申请号：US15213353

    申请日：2016-07-18

    Applicant: Achyut Dutta ,  Robert Olah

    Inventor： Achyut Dutta ,  Robert Olah

    IPC: A61B1/04 ,  A61B1/00

    Abstract: Autonomous/self-powering image detecting systems and their manufacturing technologies are disclosed. An antenna is used to communicate signals. A first energy harvester is used to harvest energy from blackbody radiation, RF signals, movement/vibration, or combination thereof. A power management system is used which controls the energy flow to and from the energy-storage. An image sensor to take the image, a lens, and a transmitter to transmit the images to an outside device are also used in this invention. According to this preferred embodiment, an energy harvester harnessing energy from blackbody radiation from and within the body, is used to extract enough energy to increase the operation time and also to make precision of the image detecting system.

    High speed electronics interconnect and method of manufacture
    9.
    发明授权
    High speed electronics interconnect and method of manufacture 有权

    公开(公告)号：US07372144B2

    公开(公告)日：2008-05-13

    申请号：US10793576

    申请日：2004-03-04

    Applicant: Achyut Dutta

    Inventor： Achyut Dutta

    IPC: H01L21/00

    CPC classification number: H01L23/66 ,  H01L23/5383 ,  H01L25/0655 ,  H01L2223/6627 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/3011 ,  H01P1/2005 ,  H01P3/08 ,  H05K1/0224 ,  H05K1/0236 ,  H05K1/024 ,  H05K1/0253 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0313 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09681 ,  Y02P80/30 ,  H01L2924/00 ,  H01L2224/05599

    Abstract: Fundamental interconnect systems for connecting high-speed electronics elements are provided. Interconnect system has the means, which could reduce the microwave loss by reducing the effective dielectric loss and dielectric constant of the interconnect system, and increase the bandwidth of the interconnects and also reduce the signal propagation delay, respectively. Ideally, the speed of the electrical signal on the signal line can be reached to speed of the light in the air, and the bandwidth can be reached to closer to the optical fiber. The interconnect systems consists of the signal line, dielectric system with opened trench or slot filled up with the air or lower dielectric loss material, and the ground plan. The signal line proposed in this invention could be made any type of signal line configuration for example, microstripline, strip line or coplanar line. The signal line can also be made as single ended or differential pairs of any configurations. The interconnect system based on the fundamental techniques provided in this invention, can be used for on-chip interconnects where the high speed electronics devices are connected by the signal line laid on the oxide or dielectric material. Again, the interconnect system based on the fundamental techniques provided in this invention, can also be used for off-chip interconnects (chip-to-chip interconnects), where the whole portion or portion of the PCB on which high speed chips are to be connected, are having the dielectric system with opened trench or slot to reduce the microwave loss. High scale chip-to-chip interconnection using of the multilayered PCB is possible. The fundamental techniques provided in this invention can also be used for high-speed connectors and high-speed cables. The main advantages of this invention are to make high speed interconnects systems for on-chip and off-chip interconnects. More over, this fundamental technology is also used for the high sped die package, high speed connector, and high speed cables where conventional manufacturing technology can be used and yet to increase the bandwidth of the interconnects.

    PHOTOVOLTAIC CELLS BASED ON NANOSCALE STRUCTURES
    10.
    发明申请
    PHOTOVOLTAIC CELLS BASED ON NANOSCALE STRUCTURES 有权
    基于纳米结构的光伏电池

    公开(公告)号：US20070012354A1

    公开(公告)日：2007-01-18

    申请号：US11161840

    申请日：2005-08-18

    Applicant: Nobuhiko Kobayashi ,  Achyut Dutta

    Inventor： Nobuhiko Kobayashi ,  Achyut Dutta

    IPC: H01L31/00

    CPC classification number: H01L31/0352 ,  H01L31/03529 ,  H01L31/036 ,  H01L31/04 ,  H01L31/07 ,  Y02E10/50

    Abstract: Novel structures of photovoltaic cells (also treated as solar cells) are provided. The Cells are based on the nanometer-scaled wire, tubes, and/or rods, which are made of the electronics materials covering semiconductors, insulator or metallic in structure. These photovoltaic cells have large power generation capability per unit physical area over the conventional cells. These cells can have also high radiation tolerant capability. These cells will have enormous applications such as in space, in commercial, residential and industrial applications.

    Abstract translation: 提供光伏电池的新型结构（也被视为太阳能电池）。 电池基于由涵盖半导体，绝缘体或金属结构的电子材料制成的纳米级线，管和/或棒。 这些光电池相对于常规电池具有比单位物理面积大的发电能力。 这些细胞也具有高耐辐射能力。 这些电池将具有巨大的应用，如空间，商业，住宅和工业应用。

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