公开(公告)号：US20230207439A1

公开(公告)日：2023-06-29

申请号：US17561533

申请日：2021-12-23

Applicant: Adel A. ELSHERBINI ,  Telesphor KAMGAING

Inventor： Adel A. ELSHERBINI ,  Telesphor KAMGAING

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/15 ,  H01L23/538 ,  H01L25/065

CPC classification number: H01L23/49838 ,  H01L23/15 ,  H01L23/5381 ,  H01L23/5385 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0655 ,  H01L2224/1703 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2924/3511

Abstract: Embodiments disclosed herein include die modules, electronic packages, and electronic systems. In an embodiment, a die module comprises a substrate, where the substrate comprises glass. In an embodiment, a blind cavity is formed into the substrate. In an embodiment, a first die is in the blind cavity, a second die is over the substrate, and a third die is over the substrate and adjacent to the second die.

公开(公告)号：US20190207287A1

公开(公告)日：2019-07-04

申请号：US15859482

申请日：2017-12-30

Applicant: Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Adel A. ELSHERBINI ,  Telesphor KAMGAING

Inventor： Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Adel A. ELSHERBINI ,  Telesphor KAMGAING

IPC: H01P5/10 ,  H01P3/02

CPC classification number: H01P5/1007 ,  H01P3/026 ,  H01P5/1015 ,  H01P5/107

Abstract: Embodiments include waveguide launchers and connectors (WLCs), and a method of forming a WLC. The WLC has a waveguide connector with a waveguide launcher, a taper, and a slot-line signal converter; and a balun structure on the slot-line signal converter, where the taper is on the slot-line signal converter and a terminal end of the waveguide connector to form a channel and a tapered slot. The WLC may have the waveguide connector disposed on the package, and a waveguide coupled to waveguide connector. The WLC may include assembly pads and external walls of the waveguide connector electrically coupled to package. The WLC may have the balun structure convert a signal to a slot-line signal, and the waveguide launcher converts the slot-line signal to a closed waveguide mode signal, and emits the closed signal along channel and propagates the closed signal along taper slot to the waveguide coupled to waveguide connector.

公开(公告)号：US20190204508A1

公开(公告)日：2019-07-04

申请号：US15859477

申请日：2017-12-30

Applicant: Adel A. ELSHERBINI ,  Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Erich N. EWY ,  Telesphor KAMGAING ,  Johanna M. SWAN

Inventor： Adel A. ELSHERBINI ,  Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Erich N. EWY ,  Telesphor KAMGAING ,  Johanna M. SWAN

IPC: G02B6/28 ,  G02B6/38 ,  G02B6/12

CPC classification number: H01P5/107 ,  G05D1/00 ,  H01Q1/32 ,  H04L12/40189 ,  H04L2012/40273 ,  H04W4/38 ,  H04W4/40

Abstract: Embodiments include a sensor node, a method of forming the sensor node, and a vehicle with a communication system that includes sensor nodes. A sensor node includes an interconnect with an input connector, an output connector, and an opening on one or more sidewalls. The sensor node also includes a package with one or more sidewalls, a top surface, and a bottom surface, where at least one of the sidewalls of the package is disposed on the opening of interconnect. The sensor node may have a control circuit on the package, a first millimeter-wave launcher on the package, and a sensor coupled to the control circuit, where the sensor is coupled to the control circuit with an electrical cable. The sensor node may include that at least one of the sidewalls of the package is crimped by the opening and adjacent and co-planar to an inner wall of the interconnect.

公开(公告)号：US20230207436A1

公开(公告)日：2023-06-29

申请号：US17561531

申请日：2021-12-23

Applicant: Adel A. ELSHERBINI ,  Telesphor KAMGAING

Inventor： Adel A. ELSHERBINI ,  Telesphor KAMGAING

IPC: H01L23/498 ,  H01L23/15 ,  H01L25/065

CPC classification number: H01L23/49827 ,  H01L23/15 ,  H01L25/0655 ,  H01L23/49838

Abstract: Embodiments disclosed herein include die modules, electronic packages, and systems. In an embodiment, a die module comprises a first substrate and a first die over the first substrate. In an embodiment, the die module further comprises a second die over the first substrate adjacent to the first die. In an embodiment, the die module further comprises a via module through the first substrate. In an embodiment, the via module comprises a second substrate, where the second substrate comprises glass, and a via through the second substrate.

公开(公告)号：US20230207492A1

公开(公告)日：2023-06-29

申请号：US17561559

申请日：2021-12-23

Applicant: Aleksandar ALEKSOV ,  Georgios C. DOGIAMIS ,  Neelam PRABHU GAUNKAR ,  Telesphor KAMGAING ,  Veronica STRONG ,  Brandon RAWLINGS ,  Robert MONGRAIN ,  Beomseok CHOI

Inventor： Aleksandar ALEKSOV ,  Georgios C. DOGIAMIS ,  Neelam PRABHU GAUNKAR ,  Telesphor KAMGAING ,  Veronica STRONG ,  Brandon RAWLINGS ,  Robert MONGRAIN ,  Beomseok CHOI

IPC: H01L23/64 ,  H01F27/40 ,  H01L23/15 ,  H01L23/498

CPC classification number: H01L23/645 ,  H01F27/40 ,  H01L23/15 ,  H01L23/49827

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a substrate, where the substrate comprises glass. In an embodiment, a via opening is formed through a thickness of the substrate, and a first layer is over sidewalls of the via opening. In an embodiment, the first layer comprises a magnetic material. In an embodiment, a second layer is over the first layer, where the second layer is an insulator. In an embodiment, a third layer fills the via opening, where the third layer is a conductor.

公开(公告)号：US20230207404A1

公开(公告)日：2023-06-29

申请号：US17561570

申请日：2021-12-23

Applicant: Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Veronica STRONG ,  Aleksandar ALEKSOV ,  Brandon RAWLINGS ,  Neelam PRABHU GAUNKAR

Inventor： Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Veronica STRONG ,  Aleksandar ALEKSOV ,  Brandon RAWLINGS ,  Neelam PRABHU GAUNKAR

IPC: H01L23/15 ,  H01L23/498 ,  H01L23/48 ,  H01L21/48

CPC classification number: H01L23/15 ,  H01L23/49827 ,  H01L23/481 ,  H01L21/486 ,  H05K1/0306

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a substrate, where the substrate comprises glass. In an embodiment, a via opening is formed through the substrate, where the via opening has an hourglass shaped profile. In an embodiment, a magnetic layer fills the via opening, and a via is through the magnetic layer. In an embodiment, sidewalls of the via are substantially vertical.

公开(公告)号：US20230207332A1

公开(公告)日：2023-06-29

申请号：US17557961

申请日：2021-12-21

Applicant: Veronica STRONG ,  Robert JORDAN ,  Telesphor KAMGAING

Inventor： Veronica STRONG ,  Robert JORDAN ,  Telesphor KAMGAING

IPC: H01L21/48 ,  H01L23/15 ,  H01L23/48 ,  H01L23/498

CPC classification number: H01L21/4857 ,  H01L23/15 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a substrate with a first surface and a second surface, where the substrate comprises glass. In an embodiment, the electronic package further comprises a via opening through the substrate, where sidewalls of the via opening have a root mean squared (RMS) surface roughness that is approximately 100nm or greater. In an embodiment, the electronic package further comprises a liner over the sidewalls of the via opening, where an RMS surface roughness of the liner is approximately 50nm or smaller. An electronic package may further comprise a via through the via opening.

公开(公告)号：US20230208009A1

公开(公告)日：2023-06-29

申请号：US17561542

申请日：2021-12-23

Applicant: Neelam PRABHU GAUNKAR ,  Georgios C. DOGIAMIS ,  Telesphor KAMGAING ,  Aleksandar ALEKSOV ,  Brandon RAWLINGS ,  Veronica STRONG

Inventor： Neelam PRABHU GAUNKAR ,  Georgios C. DOGIAMIS ,  Telesphor KAMGAING ,  Aleksandar ALEKSOV ,  Brandon RAWLINGS ,  Veronica STRONG

IPC: H01Q1/22 ,  H01Q9/04 ,  H01L23/498

CPC classification number: H01Q1/2283 ,  H01Q9/0407 ,  H01L23/49827 ,  H05K1/181

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a core, where the core comprises glass. In an embodiment, a buildup layer is over the core. In an embodiment, a patch antenna with a first patch is under the core, and a second patch is over a surface of the core opposite from the first patch. In an embodiment, the electronic package further comprises a via through the core and coupled to the patch antenna.

公开(公告)号：US20180331051A1

公开(公告)日：2018-11-15

申请号：US15776021

申请日：2015-12-22

Applicant: Georgios C. DOGLAMIS ,  Telesphor KAMGAING ,  Eric J. LI ,  Javier A. FALCON ,  INTEL CORPORATION

Inventor： Georgios C. DOGIAMIS ,  Telesphor KAMGAING ,  Eric J. LI, Sr. ,  Javier A. FALCON ,  Yoshihiro TOMITA ,  Vijay K. NAIR ,  Shawna M. LIFF

IPC: H01L23/66 ,  H01L23/552 ,  H01L25/16 ,  H01L23/498 ,  H01L23/31

Abstract: Embodiments of the invention include a microelectronic device that includes a first die having a silicon based substrate and a second die coupled to the first die. In one example, the second die is formed with compound semiconductor materials. The microelectronic device includes a substrate that is coupled to the first die with a plurality of electrical connections. The substrate including an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20230207494A1

公开(公告)日：2023-06-29

申请号：US17561726

申请日：2021-12-24

Applicant: Jianyong XIE ,  Andrew P. COLLINS ,  Arghya SAIN ,  Sivaseetharaman PANDI ,  Telesphor KAMGAING

Inventor： Jianyong XIE ,  Andrew P. COLLINS ,  Arghya SAIN ,  Sivaseetharaman PANDI ,  Telesphor KAMGAING

IPC: H01L23/64 ,  H01F27/28 ,  H01L23/15 ,  H01L23/498

CPC classification number: H01L23/645 ,  H01F27/2804 ,  H01L23/15 ,  H01L23/49827

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a first layer that comprises glass. In an embodiment, a second layer comprising glass is over the first layer. In an embodiment, the electronic package further comprises an inductor between the first layer and the second layer.